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Photonics IC’s (PIC’s) are used to transmit and receive data through a (single-mode or multi-mode) optical fiber carrier, and provide the requisite electro-optical conversion for system integration. The architecture of the PIC spans the full characteristics of data transmission and reception:
Typically,… Read More
Floating-point computation has been a staple of mainframe, minicomputer, supercomputer, workstation, and PC platforms for decades. Almost all modern microprocessor IP supports the IEEE 754 floating-point standard. Embedded design, for reasons of power and area and thereby cost, often eschews floating-point hardware… Read More
Cache evolved when the world was all about homogeneous processing and slow and expensive shared memory. Now, compute is just part of the problem – devices need to handle display, connectivity, storage, and other tasks, all at the same time. Different, heterogeneous cores handle different workflows in the modern SoC, and the burden… Read More
FMCAD (Formal Methods in Computer Aided Design) is a technical conference with a 20-year pedigree. This is a conference for serious formal methods teams. Key notes are from Berkeley and UCLA, committee members are all formal heavyweights and best I can tell, there is no exhibitors area.… Read More
It is a busy month for book signings but it is a pleasure to do it for the greater good of the semiconductor industry. It really is an honor to meet the people who keep our electronic devices on the leading edge of technology, absolutely.
The Linley Processor Conference is on September 27[SUP]th[/SUP]and 28[SUP]th[/SUP] at the Hyatt… Read More
This is the first MIPI DEVCOM event and the location is my favorite, the Computer Museum in Silicon Valley. For those of you who haven’t been, the Computer Museum preserves and presents for posterity the artifacts and stories of the information age, an age we all grew up in. For those of you who have been to the Computer Museum there … Read More
By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More
ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More
What happens when you get a panel of four executives together with an industry-leading journalist to discuss tradeoffs in IoT designs? After the obligatory introductions, Ed Sperling took this group into questions on power, performance, and integration.… Read More
The 2016 edition of the Flash Memory Summit produced more than the usual amount of excitement. Samsung’s response to the Intel/Micron 3D XPoint challenge arrived in new slideware, indicating the war for next-generation SSDs is just starting. Who has the advantage?
We’d all like to think this is about creating a breakthrough technology,… Read More
Tools for Chips and Dips an Overview of the Semiconductor Tools Market