You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 50
[name] => Events
[slug] => events
[term_group] => 0
[term_taxonomy_id] => 50
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 1494
[filter] => raw
[cat_ID] => 50
[category_count] => 1494
[category_description] =>
[cat_name] => Events
[category_nicename] => events
[category_parent] => 0
[is_post] =>
)
Just two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.
That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator. Panelists… Read More
Anirudh Devgan (President of Cadence), gave the third keynote at CDNLive Silicon Valley this year. He has clearly become adept in this role. He has a big, but supportable vision for Cadence across markets and technologies and he’s become a master of the annual tech reveals that I usually associate with keynotes.
Anirudh opened … Read More
The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More
To me the major idea of ISO 26262 compliance is ensuring that requirements can be traced throughout the entire design and verification process, including the use of IP blocks. The first market application that comes to mind with ISO 26262 is automotive, with its emphasis on safety because human lives are at stake. Since necessity… Read More
The use of hard masks instead of photoresist for the Extension implant is an effective way to optimize the amount of dopant that is retained along the fin sidewalls for those fins that border along photoresist edges (as discussed in Part 1 of this series).
However, hard masks do nothing to address the dominant problem driving steeper… Read More
TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.
TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More
Each year, TSMC conducts two major customer events worldwide – the TSMC Technology Symposium in the Spring and the TSMC Open Innovation Platform Ecosystem Forum in the Fall. The Technology Symposium event was recently held in Santa Clara, CA, providing an extensive update on the status of advanced semiconductor and packaging… Read More
The letters “PVT” roll of the tongue easily enough, belying the complexity that variations in process, temperature and voltage can cause for analog designs. For semiconductor processes, there are dozens of parameters that can affect the viability of a design. It would be easy enough to optimize a circuit with only one or two varying… Read More
The 3D character of FinFET transistor structures pose a range of unique fabrication problems that can make it challenging to get these devices to yield. This is especially true for the all-important Extension implant that is put in place just prior to the nitride spacer formation.
The Extension implant is a central component of… Read More
This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More
A Century of Miracles: From the FET’s Inception to the Horizons Ahead