In all the hubbub about AI/ML, it’s easy to see why visual ML gets more attention. It’s got appeal because of applications such as autonomous driving. Because of this it’s easy to overlook the importance of audio ML. I own a Tesla and putting it into autopilot is very cool, but even it has voice recognition built in as an important feature… Read More
Cadence – Defining a Roadmap to the Future
Cadence recently published a position paper that details a set of enabling technologies that will be needed for product design going forward. Entitled Intelligent System Design, the piece describes the changing landscape of system design and the requirements for success. Cadence has built a branded approach to address these… Read More
Innovation in Verification April 2020
This blog is the next in a series in which Paul Cunningham (GM of the Verification Group at Cadence), Jim Hogan and I pick a paper on a novel idea we appreciated and suggest opportunities to further build on that idea.
We’re getting a lot of hits on these blogs but would like really like to get feedback also.
The Innovation
Our next pick… Read More
Webinar: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs
I had the opportunity to preview the upcoming SemiWiki webinar titled: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs. John Park’s message, describing this powerful Cadence solution, really impressed me. That’s why I want to encourage you to register for it and join this SemiWiki … Read More
Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
Artificial intelligence (AI) and machine learning (ML) are hot topics. Beyond the impact these technologies are having on the world around us, they are also having impact on the semiconductor and EDA ecosystem. I posted a blog last week that discussed how Cadence views AI/ML, both from a tool and ecosystem perspective. The is one… Read More
Machine Learning for EDA – Inside, Outside and Everywhere Else
Artificial intelligence (AI) is everywhere. The rise of the machines is upon us in case you haven’t noticed. Machine learning (ML) and its associated inference abilities promise to revolutionize everything from driving your car to making breakfast. We hear a lot about the macro, end-product impact of this technology, but there… Read More
Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips
At DesignCon 2020, there was a presentation by Micron, Socionext and Cadence that discussed design challenges and strategies for using the new low-power DDR specification (LPDDR5). As is the case with many presentations at DesignCon, ecosystem collaboration was emphasized. Justin Butterfield (senior engineer at Micron)… Read More
Bridging the Gap Between Design and Analysis
At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More
IBIS-AMI Back-Channel System Optimization in Practice
I recently spent some time at DesignCon 2020 in Santa Clara. For those who haven’t attended this show in a while, you need to go. It’s no longer a small event focused on chip design. It has grown into a true system-level conference, with a broad ecosystem represented on the show floor and in the technical sessions. Ecosystem is an important… Read More
AI Interposer Power Modeling and HBM Power Noise Prediction Studies
I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More