Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration, high-speed communications, and advanced computing. Additionally, the companies have developed an AI-assisted design flow for TSMC’s Compact Universal Photonic Engine (COUPE™) platform, streamlining photonic design and enhancing efficiency.

Multiphysics and AI-Driven Design Innovations

Synopsys and TSMC are advancing multiphysics analysis for complex, hierarchical 3DIC designs. The multiphysics flow integrates tools like Ansys RedHawk-SC™, Ansys RedHawk-SC Electrothermal™, and Synopsys 3DIC Compiler™ to enable thermal-aware and voltage-aware timing analysis. This approach accelerates convergence for large-scale 3DIC designs, addressing challenges in thermal management and signal integrity critical for high-performance chips.

For TSMC’s COUPE platform, Synopsys leverages AI-driven tools like Ansys optiSLang® and Ansys Zemax OpticStudio® to optimize optical coupling systems. These tools, combined with Ansys Lumerical FDTD™ for photonic inverse design, allow engineers to create custom components, suhttps://www.ansys.com/products/connect/ansys-optislangch as grating couplers, while reducing design cycle times and improving design quality through sensitivity analysis. This AI-assisted workflow is transformative for photonic applications, enabling faster development of high-speed communication interfaces.

Certifications for Advanced Process Technologies

The collaboration includes certifications for key Synopsys tools across TSMC’s advanced nodes. Ansys RedHawk-SC and Ansys Totem™ are certified for power integrity verification on TSMC’s N3C, N3P, N2P, and A16™ processes, ensuring reliable chip performance. Ansys HFSS-IC Pro™, designed for electromagnetic modeling, is certified for TSMC’s N5 and N3P processes, supporting system-on-chip electromagnetic extraction. These certifications enable designers to meet stringent requirements for AI, high-performance computing (HPC), 5G/6G, and automotive electronics.

Additionally, Ansys PathFinder-SC™ is certified for TSMC’s N2P process, offering electrostatic discharge current density (ESD CD) and point-to-point (P2P) checking. This tool enhances chip resilience against electrical overstress, accelerating early-stage design validation and improving product durability, particularly for complex 3DIC and multi-die systems. Synopsys is also working with TSMC to develop a photonic design kit for the A14 process, expected in late 2025, further expanding support for photonic applications.

Industry Impact and Strategic Partnership

This collaboration underscores Synopsys’ leadership in providing design solutions for next-generation technologies.

“Synopsys provides a broad range of design solutions to help semiconductor and system designers tackle the most advanced and innovative products for AI enablement, data center, telecommunications, and more,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Synopsys. “Our strong and continuous partnership with TSMC has been a key factor in maintaining our position at the forefront of technology while providing consistent value to our shared customers.”

“TSMC’s advanced process, photonics, and packaging innovations are accelerating the development of high-speed communication interfaces and multi-die chips that are essential for high-performance, energy-efficient AI systems,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. “Our collaboration with OIP ecosystem partners such as Synopsys has delivered an advanced thermal, power and signal integrity analysis flow, along with an AI-driven photonics optimization solution for the next generation of designs.”

Bottom line: By combining Synopsys’ simulation expertise with TSMC’s advanced process technologies this partnership accelerates the development of robust, high-performance chips, solidifying both companies’ roles in shaping the future of semiconductor design, absolutely.

The full press release is here.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

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TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging

TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
by Daniel Nenni on 09-25-2025 at 8:00 am

TSMC OIP 2025

In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling new applications in daily life.

Evolving models, including embodied AI, chain-of-thought reasoning, and agentic systems, demand larger datasets, more complex computations, and extended processing times. This surge has led to AI accelerators consuming 3x more power per package in five years, with deployments scaling 8x in three years, making energy efficiency paramount for sustainable AI growth.

TSMC’s strategy focuses on advanced logic and 3D packaging innovations, coupled with ecosystem collaborations, to tackle this challenge. Starting with logic scaling, TSMC’s roadmap is robust: N2 will enter volume production in the second half of 2025, N2P slated for next year, A16 with backside power delivery by late 2026, and A14 progressing smoothly.

Enhancements to N3 and N5 continue to add value. From N7 to A14, speed at iso-power rises 1.8x, while power efficiency improves 4.2x, with each node offering about 30% power reduction over its predecessor. A16’s backside power targets AI and HPC chips with dense networks, yielding 8-10% speed gains or 15-20% power savings versus N2P.

N2 Nanoflex DTCO optimizes designs for dual high-speed and low-power cells, achieving 15% speed boosts or 25-30% power reductions. Foundation IP innovations further enhance efficiency. Optimized transmission gate flip-flops cut power by 10% with minimal speed (2%) and area (6%) trade-offs, sometimes outperforming state gate variants.

Dual-rail SRAM with turbo/nominal modes delivers 10% higher efficiency and 150mV lower Vmin, with area penalties optimized away. Compute-In-Memory stands out: TSMC’s digital CIM based Deep Learning Accelerator offers 4.5x TOPS/W and 7.8x TOPS/mm² over traditional 4nm DLAs, scaling from 22nm to 3nm and beyond. TSMC invites partnerships for further CIM advancements.

AI-driven design tools amplify these gains. Synopsys’ DSO.AI is the leader with reinforcement learning for PPA optimization, improving power efficiency by 5% in APR flows and 2% in metal stacks, totaling 7%. For analog designs integrations with TSMC APIs yield 20% efficiency boosts and denser layouts. AI assistants accelerate analysis 5-10x via natural language queries for power distribution insights.

Shifting to 3D packaging, TSMC’s 3D Fabric includes SoIC for silicon stacking, InFO for mobile/HPC chiplets, CoWoS for logic-HBM integration, and SoW for wafer-scale AI systems. Energy-efficient communication sees 2.5D CoWoS improving 1.6x with microbump pitches from 45µm to 25µm. 3D SoIC boosts efficiency 6.7x over 2.5D, though with smaller integration areas (1x reticle vs. 9.5x). Die-to-die IPs, aligned with UCIE standards, are available from partners like AlphaWave and Synopsys.

HBM integration advances: HBM4 on TSMC’s N12 logic base die provides 1.5x bandwidth and efficiency over HBM3e DRAM dies. N3P custom bases reduce voltage from 1.1V to 0.75V. Silicon photonics via co-packaged optics offers 5-10x efficiency, 10-20x lower latency, and compact forms versus pluggables. AI optimizations from Synopsys/ANSYS enhance this by 1.2x through co-design.

Decoupling capacitance innovations using Ultra High-Performance Metal-Insulator-Metal plus Embedded Deep Trench Capacitor enables 1.5x power density without integrity loss, modeled by Synopsys/ANSYS tools. EDA-AI automates EDTC insertion (10x productivity) and substrate routing (100x, with optimal signal integrity).

Bottom line: Moore’s Law is alive and well. Logic scaling delivers 4.2x efficiency from N7 to A14, CIM adds 4.5x IP/design innovations contribute 7-20%. Packaging yields 6.7x from 2.5D to 3D, 5-10x from photonics, and 1.5-2x from HBM/ Decoupling Capacitor advances, with AI boosting productivity 10-100x.

TSMC honored partners with the 2025 OIP Awards for contributions in A14/A16 infrastructure, multi-die solutions, AI design, RF migration, IP, 3D Fabric, and cloud services. It is all about the ecosystem, absolutely.

Exponential AI power needs demand such innovations. TSMC’s collaborations drive 5-10x gains fostering efficient, productive AI ecosystems. Looking ahead, deeper partnerships will unlock even more iterations for sustainable AI advancement.

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MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency

MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
by Daniel Nenni on 09-16-2025 at 6:00 am

2nm

MediaTek’s first chipset using 2nm technology expected in late 2026

MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology, with volume production slated for late 2026. This milestone reinforces the long-standing collaboration between MediaTek and TSMC, which has consistently delivered high-performance, power-efficient chipsets for applications spanning flagship mobile devices, computing, automotive, data centers, and more.

TSMC’s 2nm process technology introduces a nanosheet transistor structure, a significant leap forward in semiconductor design. This innovative architecture enables substantial improvements in both performance and power efficiency, setting a new standard for advanced chipsets. MediaTek’s first 2nm-based chipset, expected to debut in late 2026, will leverage these advancements to deliver unparalleled capabilities across a wide range of devices and industries.

Compared to TSMC’s current-generation N3E process, the N2P technology offers remarkable enhancements: up to an 18 percent increase in performance at the same power level, approximately 36 percent reduction in power consumption at equivalent speeds, and a 1.2x increase in logic density. These improvements translate into faster, more energy-efficient chips that can handle the increasing demands of modern applications, from AI-driven computing to high-performance mobile devices and energy-conscious automotive systems.

“MediaTek’s innovations powered by TSMC’s 2nm technology underscores our industry leadership, as we continue to push forward with the most advanced semiconductor process technologies available for a variety of devices and applications,” said Joe Chen, President of MediaTek. “Our long history of close collaboration with TSMC has led to incredible advancements in solutions for our global customers, offering the highest performance and power efficiency from the edge to the cloud.”

Dr. Kevin Zhang, Senior Vice President of Business Development and Global Sales and Deputy Co-COO of TSMC, echoed this sentiment: “TSMC’s 2nm technology represents a significant step forward into the nanosheet era, demonstrating our relentless dedication to fulfilling our customers’ needs – tuning and improving our technologies to deliver energy-efficient computing capability. Our ongoing collaboration with MediaTek focuses on maximizing enhanced performance and power capabilities across a wide range of applications.”

This development marks a pivotal moment in the semiconductor industry, as MediaTek and TSMC continue to drive innovation in chip design and manufacturing. The adoption of nanosheet transistors in the 2nm process enables greater scalability and efficiency, addressing the growing complexity of modern devices. From smartphones and AI-powered PCs to smart homes, high-performance computing, and AI data centers, MediaTek’s 2nm chipset is poised to redefine performance standards while prioritizing energy efficiency.

MediaTek’s commitment to advancing transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8 positions the company at the forefront of the industry. Powering over 2 billion connected devices annually, MediaTek’s solutions are integral to creating a smarter, more connected world. As a trusted partner to leading global brands, the company continues to innovate, ensuring that its high-performance, power-efficient products meet the evolving needs of consumers and businesses alike.

The successful tape-out of MediaTek’s 2nm chipset is a testament to the strength of its partnership with TSMC and its dedication to pushing technological boundaries. By leveraging TSMC’s state-of-the-art 2nm process, MediaTek is well-positioned to deliver next-generation solutions that enhance everyday life and drive the future of connectivity and artificial intelligence.

About MediaTek
MediaTek is a global leader in fabless semiconductor design, providing innovative solutions from edge to cloud. Powering over 2 billion connected devices annually, MediaTek drives advancements in AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8, enabling devices from smartphones and AI PCs to automotive and data centers. Committed to a smarter, more connected world, MediaTek ensures access to world-class technology for all. Visit www.mediatek.com for more information.

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TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future

TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future
by Admin on 09-07-2025 at 8:00 am

TSMC Substainability Report 2024 2025

TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates facilities across Taiwan, China, the U.S., Japan, and Europe. The report, spanning 278 pages, highlights TSMC’s role as an “innovation pioneer, responsible purchaser, practitioner of green power, admired employer, and power to change society.” Amid rising global risks like extreme weather, as noted in the World Economic Forum’s Global Risks Report, TSMC emphasizes multilateral cooperation to advance sustainability, aligning with UN Sustainable Development Goals (SDGs).

In letters from ESG Steering Committee Chairperson C.C. Wei and ESG Committee Chairperson Lora Ho, TSMC reaffirms sustainability as core to its resilience and competitiveness. Wei stresses that ESG is embedded in every decision, driving net zero emissions by 2050 and carbon neutrality. The company saved 104.2 billion kWh globally in 2024 through efficient chips, equivalent to 44 million tons of reduced carbon emissions. By 2030, each kWh used in production is projected to save 6.39 kWh worldwide. Ho highlights collaborations across five ESG directions: green manufacturing, responsible supply chains, inclusive workplaces, talent development, and care for the underprivileged.

Environmentally, as a “practitioner of green power,” TSMC focuses on climate and energy (pages 108-123), water stewardship (pages 124-134), circular resources (pages 135-146), and air pollution control (pages 147-153). It deployed 1,177 energy-saving measures, achieving 810 GWh in annual savings and 13% renewable energy usage, targeting 60% by 2030 and RE100 by 2040. Scope 1-3 emissions reductions follow SBTi standards, with 2025 as the baseline for absolute cuts by 2035. A new carbon reduction subsidy for Taiwanese tier-1 suppliers and the GREEN Agreement for 90% of raw material emitters aim to slash Scope 3 emissions. Water-positive goals by 2040 include a 2.7% reduction in unit consumption and 100% reclaimed water systems. Circular efforts recycled 97% of waste globally, transforming 9,400 metric tons into resources, while volatile organic compounds and fluorinated GHGs saw 99% and 96% reductions, respectively.

Socially, TSMC positions itself as an “admired employer” (pages 155-202), fostering an inclusive workplace with a Global Inclusive Workplace Statement and campaigns on action, equity, and allyship. It conducted a global Workplace Human Rights Climate Survey and expanded human rights due diligence to suppliers, incorporating metrics into long-term goals. Women comprise 40% of employees, with targets for over 20% in management. Talent development averaged 90 learning hours per employee, with programs like the Senior Manager Learning and Development achieving 90-point satisfaction. Occupational safety maintained an incident rate below 0.2 per 1,000 employees, enhanced by 24/7 ambulances and diverse protective gear. As a force for societal change (pages 204-232), TSMC’s foundations benefited 1,391,674 people through 171 initiatives, investing NT$2.441 billion. Social impact assessments using IMP and IRIS+ frameworks supported STEM education, elderly care, and SDG 17 partnerships.

Governance-wise (pages 234-251), TSMC reported NT$2.95 trillion in revenue and NT$1.17 trillion in net income, with 69% from advanced 7nm-and-below processes. R&D spending hit US$6.361 billion, up 3.1-fold in a decade. The ESG Performance Summary (pages 263-271) details metrics like 100% supplier audits and top rankings in DJSI and MSCI ESG.

Bottom line: The report showcases TSMC’s 2024 achievements: 11,878 customer innovations, 96% customer satisfaction, and NT$2.45 trillion in Taiwanese economic output, creating 358,000 jobs. Despite challenges like geopolitical tensions, TSMC’s net zero roadmap and inclusive strategies position it as a sustainability leader, driving shared value for stakeholders and a resilient future.

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TSMC 2025 Update: Riding the AI Wave Amid Global Expansion

TSMC 2025 Update: Riding the AI Wave Amid Global Expansion
by Daniel Nenni on 09-05-2025 at 6:00 am

CC Wei Donold Trump Handshake

Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.

The TSMC OIP Ecosystem Forum is the second series of events. At the previous TSMC Technology Symposium last April we were told that N2 design starts were exceeding N3 which was quite a statement. From what I have learned from the ecosystem over the last few months, that may have been an understatement. TSMC N2 is absolutely dominating the foundry business and for good reasons, but most importantly it is trust. TSMC’s market share at 3nm and 2nm is upwards of 90% while their total market share is now between 60-70%. Simply amazing but well deserved.

Financially, TSMC has delivered stellar results. In the second quarter of 2025, revenue reached a record $30.1 billion, marking a 44% year-over-year increase. Gross margins climbed to 59%, up 5 percentage points from the previous year, reflecting strong pricing power and efficiency gains from previous nodes. Net profit surged, with earnings per share hitting NT$15.36, beating analyst forecasts. For the first half of the year, total sales hit $60.5 billion, a 40% jump from 2024. Buoyed by this momentum, TSMC raised its full-year 2025 revenue growth guidance to approximately 30%, up from 25%. Personally I believe TSMC is once again being conservative. My guess would be 35% revenue growth but that depends on China business (Nvidia) which seems to be constrained.  Either way it will be another great year for TSMC.

My optimism stems from unrelenting AI-related demand with revenue from AI accelerators expected to double in 2025. TSMC capital expenditures for the year are projected at $38 billion to $42 billion, focusing on advanced process technologies and overall capacity expansion.

On the technology front TSMC is still pushing boundaries. The company plans to start high volume manufacturing of its N2 chips in the fourth quarter of 2025 which is earlier than anticipated, meaning yield is higher than anticipated. Trial production at its Kaohsiung and Hsinchu fabs has already begun with Apple, Nvidia, AMD, Qualcomm, and MediaTek leading customer demand. Looking further ahead, TSMC broke ground on a 1.4nm facility in Taiwan, with mass production targeted for the second half of 2028, promising 15% performance gains and 30% power savings. Additionally, advanced packaging capacity (CoWoS) has already doubled to 75,000 WPM six months ahead of schedule through partnerships with ASE and Amkor.

Expansion remains a key strategy amid geopolitical tensions. TSMC’s Arizona subsidiary turned profitable in the first half of 2025, reporting a $150.1 million net profit after initial losses. The company is also advancing fabs in Europe and Japan to strengthen supply chains. In Taiwan, new facilities like Fab 25 in the Central Taiwan Science Park will house 1.4nm and 1nm plants with trial production starting in 2027. A new Taiwanese law ensures cutting-edge tech stays on the island, keeping overseas fabs one generation (N-1) behind. This move addresses U.S.-China trade frictions and potential tariffs, which TSMC has flagged as potential risks.

Despite headwinds like currency fluctuations and rising operational costs, TSMC’s outlook is bullish. Third-quarter revenue is forecasted at $31.8 billion to $33 billion, supported by AI and high-performance computing demand. Monthly revenues through June 2025 showed consistent growth, with June alone up 39.6% year-over-year. Analysts maintain a “Buy” rating, citing sustained AI momentum and even Jensen Huang (Nvidia CEO) has a “Buy” rating on TSMC (“anybody who wants to buy TSMC stock is a very smart person”). Never in the 30+ year history of Nvidia and TSMC have I ever seen Jensen so complimentary of TSMC and that will tell you how closely they are working together.

From 2025 to 2030, TSMC’s investments will reshape sectors like AI, automotive, and consumer electronics, reinforcing its ecosystem for a competitive landscape. As my semiconductor bellwether, TSMC’s trajectory signals a thriving semiconductor industry though vigilance on geopolitics remains essential. Dr. C.C. Wei has proven to be a politically savvy leader so I have no concerns here at this point in time. Go TSMC and GO semiconductor industry, $1 trillion dollars by 2030, absolutely!

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Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap

Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap
by Daniel Nenni on 07-22-2025 at 6:10 am

Alchip TSMC N2 announcement SemiWiki

Alchip Technologies, a global leader in high-performance computing (HPC) and AI infrastructure ASICs, has officially launched its 2nm Design Platform, marking a major advancement in custom silicon design. The company has already received its first 2nm wafers and is collaborating with customers on the development of high-performance ASICs built on this next-generation node. This milestone positions Alchip among the earliest adopters of TSMC’s leading-edge technologies, with a clear roadmap that extends to both TSMC’s N2 (2nm) and upcoming A16 (1.6nm) process technologies.

Advanced Chiplets and Packaging for 2nm Compute Systems
The new design platform delivers a full-stack methodology for building compute-dense, power-efficient ASICs on TSMC’s N2 node. It supports a broad set of chiplet integration strategies, enabling 2nm compute dies to work in tandem with 3nm or 5nm I/O chiplets. This approach supports a heterogeneous architecture that optimizes performance, yield, and design flexibility—critical in the post-Moore’s Law era.

Alchip’s platform also supports TSMC’s CoWoS®-S/R/L 2.5D/3D packaging, System on Integrated Chip (SoIC®-X) bonding, and is on track to support System on Wafer (SoW™) packaging for 3DICs. Additionally, die-to-die (D2D) IP and IO chiplet development are built into the platform, ensuring robust interconnect and thermal-aware design.

Overcoming N2 Design Complexity

TSMC’s N2 process represents its first gate-all-around (GAAFET) node, replacing FinFETs with nanosheet transistors. This shift offers notable benefits in performance, power efficiency, and area (PPA), with up to 10–15% speed gain or 25–30% power reduction over N3E. However, it also introduces significant layout and manufacturing challenges. These include tighter design rules, more complex power and signal routing, and new constraints around nanosheet stacking and variability.

Alchip’s 2nm Design Platform is engineered to address these issues head-on. The design flow is optimized to manage the increased diversity of standard cells and the denser transistor layouts introduced at N2. By anticipating placement, routing, and power integrity challenges early in the design process—before floorplanning or clock tree synthesis—Alchip reduces turnaround time while enhancing design predictability.

Power and Thermal Density Solutions

At 2nm, power and thermal density per square millimeter rise significantly due to increased gate counts and faster switching. Alchip’s methodology addresses this with thermal-aware floorplanning, advanced packaging co-optimization, and strategic power distribution planning. Even in the absence of native 2nm I/O chiplets, the platform supports mixed-node integration using 3nm and 5nm I/O for early deployment and yield optimization.

First-Pass Success, SoIC Demonstration, and A16 Transition

Alchip’s 2nm test chip achieved first-pass silicon success, validating both its methodology and IP stack. The design featured the company’s proprietary AP-Link-3D I/O interface, demonstrating full compatibility with SoIC-X chiplet interconnect. These results reinforce Alchip’s leadership in 3D integration and position it well for TSMC’s future process nodes, including A16™, which introduces backside power delivery and further transistor performance improvements.

Positioning for the TSMC N2 Era

TSMC began risk production on N2 in late 2024, with volume ramp expected in the second half of 2025. N2 introduces nanosheet GAAFETs, enabling better electrostatic control and design flexibility with variable channel widths. Alchip’s 2nm platform ensures customers are equipped to tap into these benefits while mitigating the risks associated with early-node development.

“We’re open for business and ready to support customers’ 2nm demand,” said Erez Shaizaf, CTO of Alchip Technologies. “Our new platform positions us as an industry leader, not only at 2nm but as we prepare for TSMC’s A16 era.”

“The is really just another milestone on our 2nm roadmap. Alchip’s 2nm platform is ready to work with key IP vendors, and we’ve been actively engaged with a couple of different companies on their 2nm ASIC developments. We anticipate this to be a very popular node for high-performance computing innovation,” explains Dave Hwang, General Manager, North America Business Unit.

Contact Alchip

About Alchip

Founded in 2003 and headquartered in Taipei, Alchip Technologies Ltd. is a leading global ASIC provider, specializing in HPC and AI applications. Its services span ASIC design, chiplet integration, 2.5D/3D packaging, and manufacturing management. Alchip serves top-tier system companies worldwide and is listed on the Taiwan Stock Exchange .

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Certus Semiconductor at the 2025 Design Automation Conference #62DAC

Certus Semiconductor at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-15-2025 at 10:00 am

62nd DAC SemiWiki

Certus Semiconductor Brings High-Performance Custom I/O and ESD IP to DAC 2025

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at booth #1731 during DAC 2025, June 23–27 in San Francisco. Known for its robust, customer-proven IP tailored for challenging applications, Certus will highlight its extensive portfolio of high-speed, multi-voltage, and specialty I/O libraries that deliver seamless integration and outstanding protection across advanced nodes.

With over 16 years of experience, Certus specializes in developing custom I/O and ESD solutions for a wide range of high-performance interfaces—WiFi, Cellular, HDMI, LVDS, USB, XAUI, and up to 256Gb SerDes—while supporting harsh environments like automotive, industrial, and aerospace.

Certus recently joined the TSMC Open Innovation Platform® (OIP) IP Alliance, enabling the company to apply its custom I/O and ESD technology to TSMC’s advanced process nodes and deliver optimized, foundry-aligned IP to a broader base of SoC developers.

At DAC 2025, Certus will demonstrate how its IP portfolio supports:

  • Multi-protocol and multi-voltage I/O libraries for simplified integration across a wide voltage and protocol range
  • Combo GPIOs supporting interfaces like I²C/I³C/SPI/LVCMOS/HSTL/SSTL/eMMC
  • High-voltage and ultra-high-voltage (10V, 20V+) ESD protection on low-voltage CMOS for analog, RF, and MEMS applications
  • Custom die-to-die and high-speed SerDes I/O solutions with industry-leading low capacitance and robust ESD performance
  • Radiation-hardened and automotive-grade solutions across process nodes from 180nm down to 12nm

Certus’s IP is designed for performance, reliability, and ease of use—backed by expert technical support and a deep understanding of customer integration needs. Whether you’re working on ultra-low-power sensor interfaces or high-speed SoC interconnects, Certus offers IP that’s built to meet your design challenges head-on.

Visit Certus at DAC 2025 (booth #1731) to see how their cutting-edge custom I/O and ESD solutions can streamline your next chip design.

Learn more at www.certus-semi.com

DAC registration is open.

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Alchip’s Technology and Global Talent Strategy Deliver Record Growth

Alchip’s Technology and Global Talent Strategy Deliver Record Growth
by Kalar Rajendiran on 05-20-2025 at 10:00 am

Alchip TSMC 2nm N2

Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building customer-centric solutions that differentiate at the packaging level. In a candid update from CEO Johnny Shen, three pillars emerged as central to Alchip’s strategy: technology leadership, talent deployment, and customer-driven business execution.

TECHNOLOGY: 2nm and 3nm

Alchip is preparing for a significant technology inflection with the introduction of 2nm  design enablement, the first gate-all-around (GAA) transistor node. While 3nm (the final FinFET-based node) will dominate most production designs in 2025, a select few projects are advancing into 2nm, which introduces unique design complexities. These include significantly higher compute power requirements for final sign-off and verification.

During peak 3nm workloads, Alchip leveraged more than 500 servers; for 2nm, even larger compute infrastructures will be required. The company’s 2nm test chip taped out in 2024, with silicon results expected soon. These results will help quantify the PPA (power, performance, area) delta between 3nm and 2nm. While pure 2nm designs might be rare, hybrid approaches—with compute logic in 2nm and analog/mixed-signal components in 3nm chiplets—are becoming common among customers.

Alchip’s early 2nm work is already being validated by one of its more significant customers, who plans to initiate both a test chip and product chip kickoff, within 2025. This underscores Alchip’s credibility as a first-choice ASIC partner for leading-edge silicon.

TEAM: Strategic Global Expansion of Engineering Resources

With 86% of 2024 revenue originating from North America, and with global expansion considerations, Alchip is aggressively shifting its design workforce to Taiwan, Japan, and Southeast Asia. In Vietnam, where the company already employs 30 engineers, headcount is expected to grow to 70–80 by the end of 2025. Similarly, Malaysia’s team is expanding from 20 to approximately 50 engineers. By year-end, over half of Alchip’s engineering workforce will reside outside China.

This distributed R&D model not only ensures IP security and compliance with international regulations but also enables proximity to foundries, customers, and local talent pools. In the United States, Alchip is scaling up its Field Application Engineers (FAEs), Program Managers (PMs), and senior R&D experts to support a customer base that demands nuanced understanding of compute architecture, PPA trade-offs, and roadmap alignment.

For package and assembly support, much of the technical interface remains US-based, with Taiwan-based experts frequently dispatched to co-locate with customers when needed. Testing and product engineering disciplines remain centralized in Taiwan, where Alchip’s reputation as a top-tier semiconductor employer provides a strong pipeline of experienced hires.

BUSINESS: Record-Breaking Growth Driven by Differentiated Solutions

In 2024, Alchip delivered its seventh consecutive year of record financials, with revenue of $1.62 billion and net income of $200.8 million—each marking new highs. These numbers translate into a revenue-per-employee ratio of approximately $2.5 million, placing Alchip among the most productive companies in the semiconductor industry.

Core to this growth is the company’s differentiated package engineering. While customers rarely question Alchip’s ability to deliver on the compute side, most customer inquiries now revolve around packaging strategy. These include determining the optimal HBM stack configuration, interposer design, chiplet integration, thermal modeling, and overall system optimization.

Alchip has completed 18 CoWoS (Chip-on-Wafer-on-Substrate) designs, the most of any ASIC partner, according to TSMC. These designs have varied significantly by customer, each requiring unique interposer geometries, memory bandwidth targets, and form factor considerations. Johnny attributes this capability to Alchip’s focus on emerging, high-tech startups, whose need to innovate quickly forces the company to stay ahead of the technology curve.

This flexibility and deep design experience have made Alchip a go-to partner not only for startups, but also for established tech giants pursuing the next wave of AI and HPC performance.

Outlook: Enabling Tomorrow’s Compute Platforms

With 20–30 tape outs per year, Alchip maintains a rapid feedback loop that continuously hones its methodology, toolchains, and cross-functional workflows. As customers move toward 2nm GAA, 3DIC architectures, and multi-die systems, Alchip is positioning itself as a turnkey provider of silicon, packaging, and system-level integration expertise.

Its tight alignment with TSMC’s roadmap, along with a strategic pivot toward a distributed global engineering footprint, ensures that Alchip will remain a critical player in enabling the future of AI and HPC workloads. The company’s ability to combine advanced silicon design with deep system integration know-how is what makes it not just a service provider—but a true innovation partner.

Also Read:

Outlook 2025 with David Hwang of Alchip

Alchip is Paving the Way to Future 3D Design Innovation

Alchip Technologies Sets Another Record


Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy

Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy
by Mike Gianfagna on 05-09-2025 at 8:00 am

Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy

The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There are great presentations and demonstrations everywhere, but occasionally a company rises above the noise and grabs the spotlight with unique or memorable news.

My view is that Analog Bits stepped into the spotlight this year with cutting-edge analog IP on the latest nodes and a strategy that will change the way design is done. Let’s examine how Analog Bits steals the show with working IP on TSMC 3nm and 2nm and a new design strategy.

Blazing the Trail to 2nm

Working silicon demonstrations of TSMC’s CLN2P technology represent rare air at this TSMC event. Analog Bits recently completed a successful second test chip tapeout at 2nm, but the real news is the company also came to the show with multiple working analog IPs at 2nm. Six precision IPs were demonstrated, the locations of those blocks on the test chip is shown below and the finished chip pictured at the top of this post.

ABITCN2P – Test Chip Layout

What follows are some details from the cutting edge. Let’s begin with the wide range PLL.  Features of this IP include:

  • Electrically programmable for multiple applications
  • Wide range of input and output frequencies for diverse clocking needs
  • Implemented with Analog Bits’ proprietary architecture
  • Low power consumption
  • Spread spectrum tracking capability
  • Requires no additional on-chip components or bandgaps, minimizing power consumption
  • Excellent jitter performance with optimized noise rejection

The figure below illustrates some power and jitter numbers. Note the jitter data is for the whole test setup, test chip output buffers, test board, measurement equipment, and not a de-embedded number of the PLL standalone.

PLL Jitter and Power

Next is the PVT sensor. IPs like this are critical for managing power and heat. There will be more on power management in a bit. Features of this IP include:

  • High accuracy thermometer is a highly integrated macro for monitoring temperature variation on-chip
  • Industry leading accuracy untrimmed, with easy trimming procedures
  • An additional voltage sample mode is included allowing for voltage monitoring
  • The block includes a simple-to-use digital interface that works with standard core and IO level power supplies
  • Implemented with Analog Bits’ proprietary architecture
  • Low power consumption

Demonstrations included showcasing the temperature accuracy and temperature and voltage linearity of the IP.

Next is a droop detector. Voltage droop is another key item for power management.  It occurs when the current in the power delivery network (PDN) abruptly changes, often due to workload fluctuations. This effect can lead to supply voltage drops across the chip which can cause performance degradation, reduce energy efficiency, and even result in catastrophic timing failures. Feature of this IP include:

  • Integrated voltage reference for stand-alone operation
  • Easy to integrate with no additional components or special power requirements
  • Easy to use and configure
  • Programmable droop detection levels
  • Low power
  • Implemented with Analog Bits’ proprietary architecture
  • Requires no additional on-chip macros, minimizing power consumption

The next IP is an 18-40MHz crystal oscillator. Features for this IP include:

  • Pad macro that supports most industry standard crystals in the 18-40MHz range
  • Uses standard CMOS transistors
  • Power-down option for IDDQ testing
  • Oscillator by-pass mode option for logic testing
  • Self-contained ESD protection structure

And finally, the differential transmit (TX) and receive (RX) IP blocks. Features here include:

TX

  • Wide frequency range support up to 2,000 MHz output for diverse clocking needs
  • Implemented with Analog Bits’ proprietary architecture
  • Low power consumption
  • Requires no additional on-chip components or bandgaps, minimizing power consumption

RX

  • Differential clock receiver
  • Single-ended output to chip core
  • Wide ranges of input frequencies for diverse clocking needs
  • Implemented with Analog Bits’ proprietary architecture
  • Low power consumption
  • Programmable termination
  • Spread spectrum tracking capability
  • Requires no additional on-chip components or bandgaps, minimizing power consumption

On the Cutting Edge with 3nm IP

Four power management IPs from TSMC’s CLN3P process were also demonstrated at the show. The test chip these IPs came from is also pictured in the graphic at the top of this post. The IPs demonstrated include:

A scalable low-dropout (LDO) regulator. Features of this IP include:

  • Integrated voltage reference for precision stand-alone operation
  • Easy to integrate with no additional components or special power requirements
  • Easy to use and configure
  • Scalable for multiple output currents
  • Programmable output level
  • Trimmable
  • Implemented with Analog Bits’ proprietary architecture
  • Requires no additional on-chip macros, minimizing power consumption

The line regulation performance of this IP is shown in the figure below.

Next is a spread spectrum clock generation PLL supporting PCIe Gen4 and Gen5. Features of this IP include:

  • High performance design emphasis for meeting low jitter requirements in PCIe Gen4 and Gen5 applications
  • Implemented with Analog Bits’ proprietary LC architecture
  • Low power consumption
  • Spread spectrum clock generation (SSCG) and tracking capability
  • Excellent jitter performance with optimized noise rejection
  • Calibration code and bandgap voltage observability (for test)
  • Requires no additional on-chip components, minimizing power consumption

A high-accuracy thermometer IP using Analog Bits patented pinless technology was also demonstrated. Features of this IP include:

  • IP is a highly integrated macro for monitoring temperature variation on-chip
  • Industry leading accuracy untrimmed, with easy trimming procedures
  • An additional voltage sample mode is included allowing for voltage monitoring
  • The block includes a simple-to-use digital interface that works with just standard core and power supply saving customers analog routing and simplifying package design
  • Pinless technology means the IP is powered by the core voltage, no analog power pin is required
  • Low power consumption

Voltage linearity for this IP is shown in the figure below.

Voltage Linearity

And finally, a droop detector for 3nm. Features include:

  • Integrated voltage reference for stand-alone operation
  • Easy to integrate with no additional components or special power requirements
  • Easy to use and configure
  • Programmable droop detection levels
  • Low power
  • Implemented with Analog Bits’ proprietary architecture
  • Requires no additional on-chip macros, minimizing power consumption

Intelligent Power Architecture Launches a New Design Strategy

Innovation brings new challenges. A big design challenge is optimizing performance and power in an on-chip environment that is constantly changing, is prone to on-chip variation and is faced with all kinds of power-induced glitches. As multi-die design grows, these problems are compounded across many chiplets that now also need a high-bandwidth, space-efficient, and power-efficient way to communicate.

This problem cannot be solved as an afterthought. Plugging in optimized IP or modifying software late in the design process will not be enough. Analog Bits believes that developing a holistic approach to power management during the architectural phase of the project is the only path forward.

It is against this backdrop that the company announced its Intelligent Power Architecture initiative at the TSMC Technology Symposium. The company stated that its high-accuracy on-die PVT sensors, process performance monitors, integrated power-on resets, droop detectors, LDOs, and glitch catchers all work together with its low power SerDes, ADCs and pinless IP libraries to deliver a power management architecture that will meet the most demanding requirements. Pinless IP technology, invented by Analog Bits, will become even more critical to migrate below 3nm as all of the IP will work directly from the core voltage. The technology is already proven in production silicon on N5 and N3.

Analog Bits stated the company is already working with large, successful organizations that are building some of the most power-hungry chips in the world to achieve this goal. The mission now is to bring an intelligent power architecture to mainstream design for all companies. This work will be interesting to watch as Analog Bits re-defines the way advanced design is done. 

To Learn More

You can find extensive coverage of Analog Bits on SemWiki here. You can also learn more about what Analog Bits did at the TSMC Technology Symposium here, including additional IP demos  of automotive grade pinless high-accuracy PVT, pinless PLL, and PCIe SERDES on TSMC N5A. And you can watch the details of both the 2nm and 3nm demos here.

Keep watching the company’s website as the strategy behind the Intelligent Power Architecture unfolds. And that’s how Analog Bits steals the show with working IP on TSMC 3nm and 2nm and a new design strategy.

Also Read:

2025 Outlook with Mahesh Tirupattur of Analog Bits

Analog Bits Builds a Road to the Future at TSMC OIP

Analog Bits Momentum and a Look to the Future


TSMC Describes Technology Innovation Beyond A14

TSMC Describes Technology Innovation Beyond A14
by Mike Gianfagna on 05-01-2025 at 10:00 am

Device Architecture Outlook

The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process node was deemed to define the most advanced technology available from TSMC. Recently, a presentation from the event was posted that discusses technology leadership, and in that presentation, what lies beyond A14. Seeing what’s around the next corner is always interesting. Let’s look at how TSMC describes technology innovation beyond A14.

The Presenter

Dr. Yuh Jier Mii

The presenter was Dr. Yuh-Jier Mii, EVP and Co-Chief Operating Officer at TSMC. Dr. Mii is an excellent presenter. He describes very complex work in language everyone can understand. His presentation builds on work he presented at last year’s IEDM event. Dr. Mii covered a lot of information. A link is coming. But first, I’d like to focus on his comments on innovation at TSMC beyond A14. 

What Was Said

The broad focus of Dr. Mii’s discussion focused on new transistor architectures and new materials. He began by discussing device architectures. The current evolution is from FinFET to Nanosheet. Beyond these technologies, vertically stacked NFET and PFET devices, called CFETs is a likely scaling candidate. Beyond CFET, there are breakthroughs in channel material that can enable further dimensional scaling and energy reduction. These developments are summarized in the graphic above.

Dr. Mii reported that TSMC has been actively building CFET devices on silicon to enable the next level of scaling. TSMC presented its first CFET transistor at a 48nm gate pitch at IEDM 2023. This year at IEDM, TSMC presented the smallest CFET inverter. The figure below illustrates the well-balanced performance characteristics of this device up to 1.2V.

He explained that this demonstration achieved a significant milestone in CFET technology development that will help to drive future technology scaling.

Dr. Mii reported that great progress has also been made on transistors with 2D channel materials. TSMC has demonstrated the first electrical performance using a monolayer channel in stacked nanosheet architecture similar to the N2 technology. An inverter has also been developed using well-matched N and P channel devices operating at 1V. This work is summarized in the figure below.

Going forward, there are plans to continue to develop new interconnect technologies to improve interconnect performance. For copper interconnect, the plan is to use a new via scheme to reduce via resistance and coupling capacitance. Work is also underway on a new copper barrier to reduce copper line resistance.

Beyond copper, there is work underway on new metal materials with an air gap that could further reduce resistance and coupling capacitance. Intercalated Graphene is another new and promising metal material that could significantly reduce interconnect delay in the future. This work is summarized in the graphic below.

To Learn More

Dr. Mii covered many other topics. You can view his entire presentation here. And that’s how TSMC describes technology innovation beyond A14.

Also Read:

TSMC Brings Packaging Center Stage with Silicon

TSMC 2025 Technical Symposium Briefing

IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?