DAC’s technical program offers the best-in-class solutions that promise to advance Electronic Design Automation (EDA) and Embedded Systems and Software (ESS). DAC 2013 is seeking submissions that deal with design technologies and algorithms, addressing all aspects of electronic design across several submission categories.… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI ConnectivityPCI Express (PCIe), PCIe switches, Time Division Multiplexing…Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!Analog Bits, Inc. is an established provider of…Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026Perforce delivers a DevOps Tech Stack for teams…Read More
Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read More
DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verificationMach42 spun out of the Department of Physics…Read MoreExclusive Sneak Peek: Cadence at TSMC OIP Ecosystem Forum 2012
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem. More than 90% of the attendees last year said “this… Read More
A Brief History of RTDA
Andrea Casotto, the CEO of RTDA, started the company in Alameda in 1995, initially by himself, to market the FlowTracer software technology.
The early version of the technology was created as part of his PhD thesis at UC Berkeley, when Andrea sought automated ways to help engineering students who were having problems using EDA … Read More
EDA User: Rafaela Novais from TowerJazz Semi
While reading an article on DeepChip I found an interesting comment from Rafaela Novais, a Design Support Manager at TowerJazz Semi and decided to interview her to learn more about her experience as an IC designer and EDA tool user.
EDA Solutions at Ultra Low Power Developer Forum Demonstrates Mixed-Signal Flow including Tools from Tanner EDA, Incentia and Aldec
EDA Solutions, sole representative in Europe for Tanner EDA and Incentia Design Systems, is exhibiting at the ‘Design & Elektronik’ Developer Forum on Ultra Low Power in Munich, Germany, on October 10, 2012, at the Holiday Inn (Munich – City Centre).
EDA Solutions will be presenting its complete analog, digital and… Read More
New MIPI protocols: Unipro, LLI and CSI3 over MPHY.
New MIPI protocols: Unipro, LLI and CSI3 over MPHY.
Gabriele ZARRI, Moshik RUBIN, Cadence
Sophia Antipolis, France SAME 2012 Conference – October 2 & 3, 2012 2
Abstract:
With more than 50% of the world‟s population using cellular phones and the growing number of devices that go mobile, from game consoles and media player… Read More
So British! with Mike MULLER (ARM CTO & Founder) at SAME Conference
SAME conference has started with Joel Huloux, Chairman of the MIPI Alliance, who gave a high level introduction about MIPI, rather business than technology oriented, talking to Marketing/Management audience. Extracting the main points from his presentation:
- More than 30 specifications have been issued (Important remark:
EDAC Reports Upbeat Q2 2012 Revenues
EDA revenues for Q2 2012 were up 10.8% compared to Q2 2011 as reported by EDAC today.
Increasing
- CAE
- IC Physical Design & Verification
- Semi IP
High Frequency Analysis of IC Layouts
IC designers of passive devices often use empirical approaches to perform High Frequency Analysis (HFA), however there is at least one new approach being offered by Mentor Graphics using a tool flow of:
- Device detection and extraction with Calibre LVS and Calibre PERC
- Interconnect RLC extraction with Calibre xRC, Calibre xACT-3D
Linley Tech Processor Conference 2012
Learn everything you need to know about processors for enterprise- and carrier-communications systems. We have added more Speakers and industry experts and expanded the two-day conference program with 25 % more sessions.
We will be featuring presentations on the newest processors with multiple cores, programmable data planes,… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging