Semidynamics: A Single-Software-Stack, Configurable and Customizable RISC-V SolutionFounded with a vision to create transformative, customizable…Read More
Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early AdoptersThe demand for high-performance computing (HPC), data centers,…Read More
Arteris Empowering Advances in Inference AcceleratorsSystolic arrays, with their ability to highly parallelize…Read More
The Convergence of Functional with Safety, Security and PPA VerificationFormal For All! “Do I need a PhD…Read More
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC … Read More
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry… Read More
In a previous blog, Black Friday and the Predicted Semiconductor Shortages, I reported that total semiconductor manufacturing capacity is shrinking as older fabs close and new ones ramp up even slower than expected, resulting in a record reduction of total wafer capacity and silicon allocation starting in 2010. DRAM shortages… Read More
Launched in April 2008, the TSMC OIP initiative is a collaborative strategy aimed at breaking down the barriers of semiconductor design enablement in order to reduce waste and increase the profitability of the industry as a whole.
The TSMC Open Innovation Platform promotes timeliness-driven innovation amongst the semiconductor… Read More
This blog posting is sponsored by EVA airlines, as I’m in the EVA executive lounge eating free food (I blog for food). “Fly EVA, the lesser of evils for Taiwan air travel!” EVA Air has a perfect safety record in 9 years of operation, China Air on the other hand has the worst safety record in the industry!
This blog was inspired by one of … Read More
It has been an interesting month in the semiconductor business. Record revenues, profits, aggressive expansion plans, something we have not seen before and may not see again. Let’s start in Taiwan then move to Silicon Valley, Upstate New York, China, and Korea, with a look at: financials, capacity, and consolidation.
TSMC and… Read More
“Cadence Design Systems, Inc. (NASDAQ: CDNS), the global leader in EDA360………”
Of course, why wouldn’t Cadence be the global leader in something they just made up? As a follow-up to my yawningly successful blog Cadence EDA360 Manifesto:
One of the problems I have with EDA360 is the fear, uncertainty, and doubt (FUD) it attempts … Read More
EDA360 is said to be a blueprint or high-level vision for the EDA industry and not a Cadence specific document, based on the challenges that customers are experiencing. What EDA36o really is, is a manifesto, a public declaration of intentions, opinions, objectives, or motives, issued by a specific organization. The question … Read More
Moore slightly altered the formulation of the law over time, bolstering the perceived accuracy of Moore’s law in retrospect. Most notably, in 1975, Moore altered his projection to a doubling every two years. Despite popular… Read More
As you may know I enjoy poking fun at the current state of semiconductor design and manufacture media; sloppy reporting, editors with little or no actual semiconductor experience taking corporate marketing spins on news/events and passing it along as fact.
Last week it was the EETimes parroting the Samsung foundry business press… Read More
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