By Kamal Khan
The semiconductor world has always been the beating heart of tech innovation, powering everything from our smartphones to the latest AI breakthroughs. However, as chip complexity increases and market demands accelerate, adherence to traditional development cycles may be stagnating design teams and slowing … Read More
Why IP Quality and Governance Are Essential in Modern Chip DesignBy Kamal Khan In today’s semiconductor industry, success…Read More
U.S. Electronics Production GrowingU.S. electronics production has been on an accelerating…Read More
Inference Acceleration from the Ground UpVSORA, a pioneering high-tech company, has engineered a…Read More
AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor DesignThe semiconductor industry is undergoing a transformative shift…Read More
Emulator-Like Simulation Acceleration on GPUs. Innovation in VerificationGPUs have been proposed before to accelerate logic…Read MorePodcast EP316: An Introduction to Hardware Security Modules (HSMs) and Marvell’s Unique LiquidSecurity Offering with Bill Hagerstrand
Daniel is joined by Bill Hagerstrand, director of Security Business at Marvell Technology where he manages the market-leading Marvell LiquidSecurity® HSM business. Bill has more than 20 years of experience in the semiconductor, AI/machine learning, and security markets.
Bill explains what an HSM is, how it is configured and… Read More
A Compelling Differentiator in OEM Product Design
Jennifer, an OEM hardware designer, is planning a product around a microcontroller she thinks will meet her needs and wants to supply power from a 3V coin cell battery which she must connect though a boost controller. Jennifer searches a rough description of the part she needs, generating a long list of component manufacturers … Read More
Pioneering Engineer Dr. Tsu-Jae King Liu to Receive Semiconductor Industry’s Top Honor
In a landmark recognition of trailblazing innovation and leadership, Dr. Tsu-Jae King Liu, the newly elected President of the National Academy of Engineering has been named the 2025 recipient of the Global Semiconductor Alliance’s highest accolade: the Dr. Morris Chang Exemplary Leadership Award. Announced on October… Read More
PDF Solutions Charts a Course for the Future at Its User Conference and Analyst Day
Every major supplier has its user event. This is usually where the latest innovations from the company are revealed and progress over the past year is promoted. While there may be user presentations and exhibits, the primary focus is typically the vendor communicating its messages to the user base. The upcoming PDF Solutions Users… Read More
TCAD Update from Synopsys
We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a long way to make the life of Fab engineers easier. EDA tools in the TCAD (Technology Computer Aided Design) category are critical for TCAD engineers to accelerating… Read More
Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation
In a landmark announcement at NVIDIA’s GTC Washington, D.C. conference Synopsys unveiled deepened collaborations with NVIDIA to revolutionize semiconductor design and engineering through agentic AI, GPU-accelerated computing, and AI-driven physics simulations. This partnership, building on over three decades… Read More
IEDM 2025 and the 100th Anniversary of the FET
The International Electron Devices Meeting (IEDM) is the world’s preeminent forum for unveiling breakthroughs in semiconductor and electronic device technology, manufacturing, design, physics, modeling, and circuit integration. Sponsored by the IEEE Electron Devices Society, it has been a cornerstone event since… Read More
CEO Interview with Wilfred Gomes of Mueon Corporation
Wilfred Gomes is the co-founder, CEO, and president of Mueon Corporation, a next-generation infrastructure startup rethinking how data centers are built for the AI era. The company’s flagship innovation, Cubelets™, modular, stackable units that unite compute, memory, power delivery and thermal management, replace the … Read More
Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More


Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business