The RISC-V and Open-Source Functional Verification ChallengeMost of the RISC-V action at the end…Read More
Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers2.5D package design is rapidly finding its stride…Read More
Addressing Reliability and Safety of Power Modules for Electric VehiclesAs electric vehicles (EVs) gain widespread adoption, safety,…Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024Anyone who has read my articles about IEDM…Read More
SI and PI Update from Cadence on Sigrity XSignal Integrity (SI) and Power Integrity (PI) issues…Read More
The webinar on CPS (chip-package-system) is on Tuesday 9th August at 11am Pacific time. It will be conducted by Christopher Ortiz, Principal Application Engineer at Apache Design Solutions. Dr. Ortiz has been with Apache since 2007, supporting the Sentinel product line. Prior to Apache he worked at Agere / LSI, where he investigated… Read More
Generally if you want to read about power dissipation in SoCs and the potential impact on limiting how much computer power we might be able to cram onto a given piece of silicon then EE Times is a good place to look. But last weekend there was a full-length article in, of all places a different Times, the New York Times, entitled Progress… Read More
ARM’s move into the broad Tablet and PC space is based on lining up as many partners as possible to attack Intel from multiple angles. It’s a strategy not so different from what Intel employed in the early PC days. However, the strategy is unraveling as Apple and Samsung have reached market share domination without ARM’s merchant… Read More
This is an amazing picture (click to enlarge). Apple now makes 2/3 of all the profit in the entire mobile handset industry. And that is the entire handset industry, not just smartphones where it has also blown past Nokia to become number one (although there are more Android handsets than iOS, those handsets are spread across multiple… Read More
I have shared with you the most interesting I have heard during IP-SoC 2010, in two blogs, Part I was about IP market forecast(apparently my optimistic view was quite different from the rather pessimistic vision shared by SC analysts) and Part II, named “System Level Mantra”, was strongly influenced by Cadence clever presentation,… Read More
The PathFinder webinar will be at 11am Pacific time on Thursday 4th August. It will be conducted by Karthik Srinivasan, Senior Applications Engineer at Apache Design Solutions. Mr. Srinivasan has over four years of experience in the EDA industry, focusing on die, system, and cross-domain analysis. His professional interests… Read More
The under the radar, sleepy microcontroller market is about to undergo a rapid transformation the next several years with new entrants and the rise of 32 bit cores that will redefine the parameters for success. This will revive growth and result in new winners and losers. But lots of questions remain.
My first job out of college in… Read More
I met with Jeff Wilson, Product Marketing Manager at Mentor in the Calibre product group to learn more about Smart Fill versus Dummy Fill for DFM flows. Jeff works in the Wilsonville, Oregon office and we first meet at Silicon Compilers back in the 1990’s.
Dummy Fill
This diagram shows an IC layout layer on the left as originally… Read More
The Totem webinar will be at 11am on Tuesday 2nd August. This session will be conducted by Karan Sahni, Senior Applications Engineer at Apache Design Solutions. Karan has been with Apache since 2008, supporting the Redhawk, Totem, Sentinel product lines. He received his MS in Electrical Engineering from the Syracuse University… Read More
Hard to believe EDA360, the Cadence Blueprint toBattle ‘Profitability Gap’; Counters Semiconductor Industry’s Greatest Threat!, is DEAD at the ripe old age of one. As you may have already read John Bruggeman left Cadence after the company conference call last week. The formal announcement should go out on Monday after the SEC… Read More
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