ansys simworld semiconductors 800x100 1
WP_Term Object
(
    [term_id] => 178
    [name] => IP
    [slug] => ip
    [term_group] => 0
    [term_taxonomy_id] => 178
    [taxonomy] => category
    [description] => Semiconductor Intellectual Property
    [parent] => 0
    [count] => 1336
    [filter] => raw
    [cat_ID] => 178
    [category_count] => 1336
    [category_description] => Semiconductor Intellectual Property
    [cat_name] => IP
    [category_nicename] => ip
    [category_parent] => 0
)

Tela Innovations, DAC Update

Tela Innovations, DAC Update
by Daniel Payne on 06-13-2013 at 12:16 pm

Lawsuits in EDA are common, and Tela Innovationsfiled a huge complaint back in February with the U.S. International Trade Commission (USITC) against HTC Corporation; HTC America, Inc.; LG Electronics, Inc.; LG Electronics U.S.A., Inc.; LG Electronics MobileComm U.S.A., Inc.; Motorola Mobility LLC; Nokia Corporation; Nokia, Inc.; Pantech Co., Ltd.; and Pantech Wireless, Inc.

At DAC last week I met with Neal Carney to get an update on what Tela Innovations is up to this year.


Dhrumil Gandhi (left), Neal Carney (right)

Discussion Notes

Power reduction benefits – gate length biasing to reduce leakage, (Blaze MO) analyze slack in non crtical paths then swap out for lower drive cells and lower dynamic power. Non disruptive to design, because the layout is smaller. Can reduce up to 15% on dynamic power. Works on a timing-closed design

SOld to COT users or provided as a service. Published users are LSI Logic, Mellanox – network processing, Mindspeed – now defunct.

TSMC (Power Trim) – using Tela technology.

Litigation ongoing now.

FinFET – still could use this approach with multi VT.

All the data in chart is bulk CMOS, not FinFET or FD SOI (yet).

Leakage Reduction


Concurrent Leakage and Dynamic Power Reduction

Litigation – no news until settlement or agreement reached.

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