RIP Jim Hogan – An Industry Icon

RIP Jim Hogan – An Industry Icon
by Bernard Murphy on 03-21-2021 at 8:00 am

RIP Jim Hogan

An unavoidable consequence of getting older is that more frequently our friends and colleagues unexpectedly leave us for their final venture. Jim Hogan, widely known and loved in the semiconductor industry, has passed on. He will leave a substantial hole in the hearts of many. Always ready with seasoned advice, a sympathetic … Read More


Tela Innovations, DAC Update

Tela Innovations, DAC Update
by Daniel Payne on 06-13-2013 at 12:16 pm

Lawsuits in EDA are common, and Tela Innovationsfiled a huge complaint back in February with the U.S. International Trade Commission (USITC) against HTC Corporation; HTC America, Inc.; LG Electronics, Inc.; LG Electronics U.S.A., Inc.; LG Electronics MobileComm U.S.A., Inc.; Motorola Mobility LLC; Nokia Corporation; Nokia,… Read More


FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More


TSMC Open Innovation Platform Explained

TSMC Open Innovation Platform Explained
by Daniel Nenni on 11-09-2009 at 10:56 pm

Launched in April 2008, the TSMC Open Innovation Platform initiative is a collaborative strategy aimed at breaking the bottlenecks of semiconductor design enablement in order to promote growth for the industry as a whole. The TSMC iPDK Debate: Lets Play Monopoly! blog I did provides more technical detail.

While Wafer count is… Read More