I’ve followed the enthusiastic market acceptance of FPGA chips over the decades, and even semiconductor companies like Intel acquired Altera, while AMD tries to acquire Xilinx. The idea of field programmable logic makes a lot of sense for use in systems designs today, and it was inevitable that a company like Menta would… Read More
Author: Daniel Payne
DAC 2021 – Embedded FPGA IP from Menta
DAC 2021 – What’s Up with Agnisys and Spec-driven IC Development
Walking the exhibit floors at DAC in December I spotted the familiar face of Anupam Bakshi, Founder and CEO of Agnisys, so I stopped by the booth to get an update on his EDA company. My first question for him was about the origin of the company name, Agnisys, and I found at that Agni means Fire in Sanskrit, one of the five elements.
The … Read More
CES 2022 and the Electrification of Cycling
With the Omicron variant of the COVID-19 virus in the news, there have been some big corporate names withdrawing from CES ( Peleton, Super73), however the cycling innovation companies assembled once again in Las Vegas this year for CES 2022. Data from statista show the strong growth in bicycle revenues in March 2020, when the pandemic… Read More
Webinar: AMS, RF and Digital Full Custom IC Designs need Circuit Sizing
My career started out by designing DRAM circuits at Intel, and we manually sized every transistor in the entire design to get the optimum performance, power and area. Yes, it was time consuming, required lots of SPICE iterations and was a bit error prone. Thank goodness times have changed, and circuit designers can work smarter … Read More
DAC 2021 – Cliosoft Overview
It’s been awhile since I really looked at what Cliosoft has to offer in the EDA tool space, so at the 58th DAC I stopped by their exhibit booth on Tuesday to visit with Karim Khalfan, VP of Application Engineering, and Simon Rance, VP of Marketing. Their booth had all of the hot market segments listed: Automotive, 5G, IoT, AI, … Read More
DAC 2021 – Taming Process Variability in Semiconductor IP
Tuesday at DAC was actually my very first time attending a technical session, and the presentation from Nebabie Kebebew, Siemens EDA, was called, Mitigating Variability Challenges of IPs for Robust Designs. There were three presentations scheduled for that particular Designer, IP and Embedded Systems track, but with the COVID… Read More
DAC 2021 – Siemens EDA talks about using the Cloud
My third event at DAC on Monday was all about using EDA tools in the Cloud, and so I listened to Craig Johnson, VP EDA Cloud Solutions, Siemens EDA. Early in the day I heard from Joe Sawicki, Siemens EDA, on the topic of Digitalization.
Why even use the Cloud for EDA? That’s a fair question to ask, and Craig had several high-level… Read More
DAC 2021 – Accellera Panel all about Functional Safety Standards
Functional safety has been at the forefront of the electrification of our vehicles with new ADAS features, and the push to reach autonomous driving, while having compliance with the ISO 26262 functional safety standard. I attended the Accellera hosted panel discussion on Monday at DAC, hearing from functional safety panelists… Read More
DAC 2021 – Joe Sawicki explains Digitalization
Monday at DAC this year started off on a very optimistic note as Joe Sawicki from Siemens EDA presented in the Pavilion on the topic of Digitalization, a frequent theme in the popular press because of the whole Work From Home transition that we’ve gone through during the pandemic. Several industries are benefiting from the… Read More
System Technology Co-Optimization (STCO)
My first exposure to seeing multiple die inside of a single package in order to get greater storage was way back in 1978 at Intel, when they combined two 4K bit DRAM die in one package, creating an 8K DRAM chip, called the 2109. Even Apple used two 16K bit DRAM chips from Mostek to form a 32K bit DRAM, included in the Apple III computer, circa… Read More
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CMOS Forever?