Webinar Recap: IP Security Threats in your SoC

Webinar Recap: IP Security Threats in your SoC
by Daniel Payne on 11-28-2019 at 10:00 am

Three years ago my youngest son purchased a $17 smart watch on eBay, but then my oldest son read an article warning about how that watch would sync with your phone, then send all of your contact info to an address in China. My youngest son then wisely turned the watch off, and never used it again. Hackers have been able to spoof and hide Read More


Webinar Recap: Challenges of Autonomous Vehicle Validation

Webinar Recap: Challenges of Autonomous Vehicle Validation
by Daniel Payne on 11-27-2019 at 10:00 am

Autonomous vehicle progress is in the daily news, so it’s quite exciting to watch it develop with the help of SoC design, sensors, actuators and software from engineering teams spanning the entire globe. Tesla vehicles have reached Level 2 autonomy, Audi e-tron is at Level 3, and Waymo nearly at Level 5 with robot taxis being… Read More


Functional Safety Comes to EDA and IP

Functional Safety Comes to EDA and IP
by Daniel Payne on 11-13-2019 at 10:00 am

Every week I read headlines about the progress of autonomous vehicles, and the inevitable questions began to arise, like, “Just how safe is this AV?”, or “Is this new ADAS feature trustworthy?” The automotive industry has already setup the ISO 26262 functional safety standard, and we’ve bloggedRead More


Mentor Adds Circuit Simulators to the Cloud using Azure

Mentor Adds Circuit Simulators to the Cloud using Azure
by Daniel Payne on 11-08-2019 at 6:00 am

Most EDA tools started out running on mainframe computers, then minicomputers, followed by workstations and finally desktop PCs running Linux. If your SoC design team is working on a big chip with over a billion transistors, then your company likely will use a compute farm to distribute some of the more demanding IC jobs over lots… Read More


DAC 2020 – Call for Contributions

DAC 2020 – Call for Contributions
by Daniel Payne on 10-28-2019 at 6:00 am

My first DAC was in 1987 so I’ve seen our industry expand greatly over the years, and I expect that #57DAC on July 19-23, 2020 in SFO to be another exciting event to attend for semiconductor professionals from around the globe. What makes DAC so compelling for me to visit are the people, exhibitors, panel discussions, technical… Read More


Automating Timing Arc Prediction for AMS IP using ML

Automating Timing Arc Prediction for AMS IP using ML
by Daniel Payne on 10-16-2019 at 6:00 am

NVIDIA designs some of the most complex chips for GPU and AI applications these days, with SoCs exceeding 21 billion transistors. They certainly know how to push the limits of all EDA tools, and they have a strong motivation to automate more manual tasks in order to quicken their time to market. I missed their Designer/IP Track Poster… Read More


Workflow Automation Applied to IP Lifecycle Management

Workflow Automation Applied to IP Lifecycle Management
by Daniel Payne on 10-04-2019 at 10:00 am

I often blog about a specific EDA tool, or an IP block, but the way that SoC design teams approach their designs and then use tools and IP can either be a manual, ad-hoc process, or part of something that is well-documented, following a design methodology. Back in the 1980’s while at Intel our team first created a design methodology… Read More


Debugging SoCs at the RTL, Gate and SPICE Netlist Levels

Debugging SoCs at the RTL, Gate and SPICE Netlist Levels
by Daniel Payne on 10-02-2019 at 10:00 am

Debugging an IC is never much fun because of all the file formats used, the levels of hierarchy and just the sheer design size, so when an EDA tool comes around that allows me to get my debugging done quicker, then I take notice and give it a look. I was already familiar with debugging SPICE netlists using a tool called SPICEVision Pro,… Read More


Speeding Up Physical Failure Analysis (PFA)

Speeding Up Physical Failure Analysis (PFA)
by Daniel Payne on 09-19-2019 at 10:00 am

The cost of an IC depends on many factors like: NRE, masks, fabrication, testing, packaging. Product engineers are tasked with testing each part and understanding what exactly is limiting the yields. Every company has a methodology for Physical Failure Analysis (PFA), and the challenge is to make this process as quick as possible,… Read More


3D TCAD Simulation for Power Devices

3D TCAD Simulation for Power Devices
by Daniel Payne on 08-30-2019 at 10:00 am

My first IC design back in 1978 was a DRAM and it ran on 12V, 5V and -5V, but then my second DRAM was using only a 5V supply. Today we see SOCs running under a 1V supply voltage, but there is a totally different market for power devices that are at the other end of the voltage spectrum and they handle switching ranges from 12V – 250V. … Read More