CEO Interview with Dr. Maksym Plakhotnyuk of ATLANT 3DDr. Maksym Plakhotnyuk, is the CEO and Founder…Read More
Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD ModelingThe semiconductor industry is rapidly moving beyond traditional…Read More
AI Booming is Fueling Interface IP 23.5% YoY GrowthAI explosion is clearly driving semi-industry since 2020.…Read More
“Now, here, you see, it takes all the running you can do, to keep in the same place. If you want to get somewhere else, you must run at least twice as fast as that!”
—Lewis Carroll, Through the Looking Glass
The use of stitching can greatly reduce the number of double patterning (DP) decomposition violations that a designer has to resolve.… Read More
Foundries and EDA vendors are cooperating at increasing levels of technical intimacy as we head to the 20nm and lower nodes. Cadence has a strong position in the EDA tools used for IC design and layout of custom and AMS (Analog Mixed-Signal) designs. They have created a series of webinars to highlight the design challenges and new… Read More
The news this week that PC sales dropped by double digit percentages and to a level not seen since 2006 sent shudders down the halls of OEMs and chip suppliers. Are we entering a final death spiral as opposed to the gradual decline that most expected? Perhaps there is another explanation. From a distance, it appears that the mobile … Read More
On Friday (April 19[SUP]th[/SUP]) I will be keynoting FinFET day at the EDPS conference in Monterey. This is an excellent opportunity to ask the experts about the challenges of FinFET design and manufacturing in an intimate setting (60 people). If you are interested register today and use the promo codeSemiWiki-EDPS-JFR and … Read More
Ivo Bolsens, the CTO of Xilinx, is giving the opening keynote at the Electronic Design Process Symposium (EDPS) in Monterey on Thursday and Friday this coming week. The title of his keynote is The All Programmable SoC – At the Heart of Next Generation Embedded Systems. He covers a lot of ground but the core of his presentation… Read More
For the last few years, thru silicon via (TSV) based ICs have been looming in the mist of the future. Just how far ahead are they? Xiliinx famously has a high-end gate-array in production on a 2.5D interposer, Micron has a memory cube, TSMC has done various things in 3D that it calls CoWoS (chip on wafer on substrate), Qualcomm have been… Read More
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
The Electronic Design Process Symposium (EDPS) is April 18 & 19 in Monterey. The workshop style Symposium is in its 20[SUP]th[/SUP] year. The first session is titled “ESL & Platforms”, which immediately follows the opening Keynote address by Ivo Bolsens, CTO of Xilinx.
In his keynote presentation Ivo will present how… Read More
It was spring 2010 and I was asked to attend an HLS (High Level Synthesis) meeting. To be honest I cringed, after my bad relationship with Accel DSP and broken promises my heart was all walled up and needed counseling. But my management had a way of making me an offer I could not refuse, like keeping my job. So reluctantly I went. Does your… Read More
SemiWiki broke the story yesterday about the Cadence legal action against Berkeley Design Automation and today I spent time with customers of both companies in Silicon Valley getting reactions. That is the advantage of working in Silicon Valley for almost 30 years, if you don’t know the right people, you certainly know the people… Read More
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