Whenever a market matures, either it gets plagued by substitutes or it looks for complementary products or technologies which can fuel its maturation curve into further growth opportunities. While PCs and Notebooks got substituted by smartphones, there is no other device in foresight to substitute smartphones. The reason … Read More
Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification2.5D and 3D ICs present special challenges since…Read More
Webinar: Fine-grained Memory Protection to Prevent RISC-V Cyber AttacksMost organizations are aware of cybercrime attempts such…Read More
Webinar: Samtec and Achronix Expand AI in the Data CenterThe performance demands of data centers continue to…Read More
Don't Settle for Less Than Optimal - Get the Perfect Inductor Every TimeThe meaning of the word “Veloce” is “blazing…Read More
Synopsys is Paving the Way for Success with 112G SerDes and BeyondData communication speeds continue to grow. New encoding…Read More
A brief history of the Internet of Things
The Internet of Things (IoT) is apparently the next big thing, but it tends to appear in different ways to different people. To some it’s all about connectivity of the web of devices and to other it’s synonymous with sensors and wearable devices. And the scope of IoT is expanding by the day—to smart lighting, smart thermostats, smart… Read More
TSMC Bringing EUV Into Production
Last week was ASML’s investor day. I wasn’t there and they haven’t yet got the material posted on their website, so this is all second hand information. As you know, if you have read any of my comments on EUV, I have been dubious about whether EUV would ever work for production.
The three big problems seem to be:
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Xilinx the EDA Company
Like you I cannot believe 2015 is upon us. 15 years ago I remember the Y2K panic. I remember watching the news and noticed the liberal media (they were liberal back then too) just waiting for the first fail somewhere. Ended up like Geraldo at the opening of Al Capone’s Vault. Remember that one? As I persist on with this word salad may I … Read More
eSilicon’s IP Marketplace
eSilicon engages with customers in many different ways, from providing a full menu of design services down to simply manufacturing parts. Increasingly, they have been automating a lot of this on their website. It started with automatic quotes for MPW shuttles and more recently they have a full production quote system for parts… Read More
TSMC Sees More Growth in 2015!
As I wait for my plane to Taiwan I’m wondering what the New Year has in store for the fabless semiconductor ecosystem. Good things I hope but to make sure let’s take another look at one of my trusted economic bellwethers (TSMC) which I’m guessing will break the $25B revenue mark this year. That is more than a 25% growth rate year… Read More
Which IP for FD-SOI Ecosystem?
We know that the best technology or product, even if it exhibits best in class and unmatched features, is almost of no use if lacking an ecosystem. If you think about a processor core, you will expect to find compatible communication bus and memories (inside the SoC) and operating system, compiler, debugger, etc. When dealing with… Read More
Synopsys Q4 Earnings
Synopsys announced their earnings a couple of days ago. This is actually also the end of their fiscal year. They had quarterly earnings of $539M meaning that they did just over $2B for the year. Their guidance for fiscal 2015 is revenue between $2.185B to $2.225B. They said that about 80% of that revenue is already in backlog.
But it… Read More
Variation at IEDM
IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).
For the last few years on the Tuesday… Read More
Intel is NOT Quitting Mobile!
Judging from the presentation Hermann Eul did at NASDAQ this week Intel is still in mobile. This presentation was probably inked before Intel Mobile was folded into the PC Group however. The first clue is Hermann’s title was listed as “General Manager and Vice President, Mobile Communications Group” which he is no longer. Even … Read More
Application-Specific Lithography: Sense Amplifier and Sub-Wordline Driver Metal Patterning in DRAM