eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSilicon… Read More
Security by Design: Arteris Expands Its Partnership with ArmArteris has expanded its partnership with Arm to…Read More
How early symmetry validation eliminates costly late-stage respinsBy Mauli Shah, Product Engineer, Siemens Analog and…Read More
Rethinking Formal Verification in the AI EraBy Kanav Arora, ML Researcher at ChipAgents Most…Read More
CEO Interview with Ann Wu and Akash Levy of SilimateAnn Wu is Co-founder & CEO of Silimate.…Read More
From Process Learning to Production Control: Characterization for the Era of Heterogeneous SystemsEvery generation of semiconductor innovation has relied on…Read MoreVirtualizing 5G Infrastructure Verification
Mentor have pushed the advantages of virtualized verification in a number of domains, initially in verifying advanced networking devices supporting multiple protocols and software-defined networking (SDN), and more recently for SSD controllers, particularly in large storage systems for data centers. There are two important… Read More
Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More
Automating Timing Arc Prediction for AMS IP using ML
NVIDIA designs some of the most complex chips for GPU and AI applications these days, with SoCs exceeding 21 billion transistors. They certainly know how to push the limits of all EDA tools, and they have a strong motivation to automate more manual tasks in order to quicken their time to market. I missed their Designer/IP Track Poster… Read More
Cadence and Green Hills Share More Security Thoughts at ARM Techcon
On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More
Formal in the Field: Users are Getting More Sophisticated
Building on an old chestnut, if sufficiently advanced technology looks like magic, there are a number of technology users who are increasingly looking like magicians. Of course when it comes to formal, neither is magical, just very clever. The technology continues to advance and so do the users in their application of those methods.… Read More
Free webinar – Accelerating data processing with FPGA fabrics and NoCs
FPGAs have always been a great way to add performance to a system. They are capable of parallel processing and have the added bonus of reprogramability. Achronix has helped boost their utility by offering on-chip embedded FPGA fabric for integration into SoCs. This has had the effect of boosting data rates through these systems… Read More
Response to IP’s Growing Impact On Yield And Reliability
One of the reasons I founded SemiWiki nine years ago was the lack of EDA, IP and Foundry content in the media. The problem is that unless you work in the industry it is very difficult to write about it in competent technical detail. Most media outlets only know what vendors tell them which is how the semiconductor industry worked before… Read More
Comparing Applied Materials with Lam Research
Lam Research (NASDAQ:LRCX) will announce its quarterly earnings on October 23, 2019, and Applied Materials (NASDAQ:AMAT) the following month on November 14, 2019. Both companies make equipment used to manufacture semiconductor devices. While private and institutional investors often own both individual stocks, this article… Read More
Auto Architecture and the Need for Speed
Automotive makers and their suppliers are jacking up the processing power being introduced to cars along with higher speed wireless external connections. These high speed systems promise to collect, process, interpret and transmit sensor data for the purpose of enabling advanced collision avoidance and, ultimately, automated


ASML High-NA EUV is Not Ready for High-Volume Production