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8051: The Core That’s Still Probably in Your House or Car

8051: The Core That’s Still Probably in Your House or Car
by Don Dingee on 06-29-2026 at 6:00 am

CAST T8051XC3 IP core block diagram

When a small team at Intel began work on its second-generation 8-bit microcontroller in the summer of 1978, they took lessons from their first effort, the 8048, hoping to create something more flexible and enduring. Approaching five decades later, their creation, the 8051, is still going strong, although the current offerings… Read More


CEO Interview with Tom (TJ) Jackson of Softchip

CEO Interview with Tom (TJ) Jackson of Softchip
by Daniel Nenni on 06-28-2026 at 6:00 pm

TJ Headshot brick

Tom Jackson is a serial entrepreneur who founded multiple successful technology ventures with expertise in turning around struggling companies. Experienced in developing strategic partnerships across the technology sector. Skilled at translating complex technical innovations into compelling, value propositions for… Read More


CEO Interview with Yossi Meyouhas of Xsight Labs

CEO Interview with Yossi Meyouhas of Xsight Labs
by Daniel Nenni on 06-28-2026 at 2:00 pm

Yossi meyouhas

Yossi Meyouhas is the CEO of Xsight Labs. Yossi joined Xsight Labs in May 2021 as Chief Operating Officer. Prior to Xsight Labs, Yossi was SVP R&D in Valens Semiconductors (2017-2021), and before that served in multiple senior positions in Marvell Technology Group, the last being SVP Engineering and General Manager of Marvell

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Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang

Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang
by Daniel Nenni on 06-26-2026 at 10:00 am

Daniel is joined by William Wang the CEO and Founder of ChipAgents.ai, the category-leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
by Daniel Nenni on 06-26-2026 at 6:00 am

Inel 18A vs Intel 18A P

Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More


WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads

WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads
by Daniel Nenni on 06-25-2026 at 2:00 pm

Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads

In this webinar, Google Cloud and NetApp explore how semiconductor companies can address the growing infrastructure demands of modern Electronic Design Automation (EDA) workflows. As process technologies continue to advance and chip designs become increasingly complex, engineering teams require scalable, high-performance… Read More


How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
by Mike Gianfagna on 06-25-2026 at 10:00 am

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.

llmda.aiRead More


COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era

COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
by Daniel Nenni on 06-25-2026 at 6:00 am

AX66

COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More


The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story

The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story
by Jonah McLeod on 06-24-2026 at 2:00 pm

Open AI Illustration

Every family has that one wedding where, halfway through the toasts, someone leans over and whispers “wait, who’s paying for all this?” This is that wedding. OpenAI and Broadcom are the happy couple. Apollo Global Management walked the bride down the aisle. Nvidia may have just stood up to offer a toast, a very… Read More


The Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor

The Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor
by Moh Kolb on 06-24-2026 at 10:00 am

Picture BORB EORC June19

Co-packaged optics, silicon photonics, optical I/O, and photonic engines are becoming central topics in the future of AI infrastructure.

The common story is simple:

Copper is reaching limits.
Light can move data farther and more efficiently.
Therefore, AI systems will move from electrical interconnects toward optical interconnects.… Read More