ChipNexus has introduced its NEX Analog Agent, bringing conversational automation to analog engineering workflows built around Cadence Virtuoso, Spectre simulation and Siemens Calibre physical verification. Available now, the software operates with customers’ installed tools, licenses and process design kits, giving… Read More
NIST Sets a Clearer Course for the Post-Quantum Security TransitionNIST’s report, Transition to Post-Quantum Cryptography Standards, gives…Read More
CTO Interview with Ed Plowman of Imagination TechnologiesEd Plowman is Chief Technology Officer at Imagination…Read More
Ceva’s next NeuPro generation opens new possibilities across AICeva is broadening the possibilities for AI silicon…Read More
How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB LiveAllegro MicroSystems’ experience with yieldHUB Live shows how…Read More
Interview with Sweta Gupta, VP of Engineering of Analog BitsSweta Gupta is the Vice President of Engineering…Read MoreDelivering Silicon Systems Through AI Disruption, Part 2: The Conductor
Conductor: the person who keeps every section of the orchestra in time without playing an instrument. In this article, it’s your operating model.
In Part 1, I wrote about the score, your designed workflows across the three layers Gene Kim and Steven Spear describe in Wiring the Winning Organization: the technical work, … Read More
WEBINAR: Porting, Analysing & Optimising AI Models onto Edge GPUs
Modern AI models are opening up new possibilities at the edge. Turning those possibilities into responsive, efficient applications, however, requires more than choosing hardware with an impressive TOPS figure. Developers need to understand how models behave on their target devices, where performance is lost, and which optimisations… Read More
Interview with David Tester VP of Engineering Mach42
David Tester is the VP of Engineering at Mach42, with 30 years of experience in semiconductor development, engineering leadership, and business growth. As Chief Engineer at EnSilica, he helped transform the company from a design consultancy into a publicly listed fabless semiconductor business, scaling the organisation … Read More
Glass Is Becoming an AI Infrastructure Platform
The value of glass will be determined not by its material properties alone, but by whether it can expand the package architecture window and be realized repeatedly at manufacturing scale.
AI infrastructure is pushing advanced packaging into a regime where the substrate itself increasingly determines what can be built.
As packages… Read More
Ceva and Mobilint Bring Physical AI Closer to Everyday Devices
Physical AI is moving closer to everyday reality, and a new collaboration between Ceva and Mobilint offers an encouraging example of how that progress can reach commercial devices. Mobilint’s REGULUS edge AI System-on-Chip brings together Ceva’s SensPro AI DSP and NeuPro-Nano NPU, marking the first production deployment … Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
The philosophy of relying on a single, unified IP stack to lower your total cost of ownership is not a new concept invented just for the AI era. Semiconductor engineering teams have been weighing the trade-offs of piecemeal versus integrated intellectual property sourcing for decades. In previous process generations, veering… Read More
CTO Interview with Taylor Barton of Certus Semiconductor
Taylor Barton is a Lead Analog/Mixed-Signal and I/O IC Design Engineer at Certus Semiconductor, where he has worked since December 2022. He has designed more than 20 silicon-proven I/O and ESD libraries and has led analog and I/O IP projects, including ADC and SerDes designs. Taylor holds B.S. and M.S. degrees in Electrical Engineering… Read More
Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity
By Defacto Staff
Today’s chips are no longer just processors, they are entire systems. A System-on-Chip (SoC) brings together CPU clusters, accelerators, memories, interconnects and dozens of peripherals, often coming from many different teams and vendors. With AI, high-performance computing and IoT driving demand for … Read More
Reimagining 3D IC Design: From Architecture to Signoff
By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA
The semiconductor industry is undergoing a fundamental transformation. Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a powerful alternative… Read More


The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival