By Prof. Dr. S. Filo Ambrosini
On a semiconductor line, a rising defect rate can trigger a familiar debate. Do we need a new inspection system? More sensors? An additional engineer?
Those may all be valid responses. But before making the decision, someone needs to establish when the change began, where it first appears, and whether… Read More
Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More
Daniel is joined by Matthew Ozalas from Keysight. With an experience of more than 20 years, Matthew brings a plethora of knowledge in complex RF designs using CAD tools. Matthew has also authored several application notes on RF and Microwave design and development using Keysight ADS with his recent ones based on “Artificial … Read More
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More
By Joel Jorgensen, FlowAccel.
The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More
ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More
Daniel is joined by the CEO of Cognichip, Faraj Aalaei, a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, he was responsible for building and leading two semiconductor companies through IPOs as a founder… Read More
Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More
ASML Has High-NA and Chipmakers Can’t Say No