Automotive makers and their suppliers are jacking up the processing power being introduced to cars along with higher speed wireless external connections. These high speed systems promise to collect, process, interpret and transmit sensor data for the purpose of enabling advanced collision avoidance and, ultimately, automated




My Top Three Reasons to Attend IEDM 2019
The International Electron Devices Meeting is a premier event to learn about the latest in semiconductor process technology. Held every year in early December is San Francisco this years conference will be held from Decembers 7th through December 11th. You can learn more about the conference at their web site here.
This is a must… Read More
Mentor’s Questa verification tools now run on 64-bit ARM based servers
The server market has been undergoing changes in the last few years. The traditional go-to for server processors had been x86 based chips from Intel or AMD. However, if you go on Amazon AWS looking for EC2 instances, you will see the “A1” instance type, which is an ARM based instance. This is not what you might think at first. The A1 instance… Read More
Accellera IP Security Standard: A Start
I mentioned some time ago (a DVCon or two ago) that Accellera had started working on a standard to quantify IP security. At the time I talked about some of the challenges in the task but nevertheless applauded the effort. You’ve got to start somewhere and some way to quantify this is better than none, as long as it doesn’t deliver misleading… Read More
Functional Safety ARC Processor IP will speed automotive system design
In the automotive space you can’t even get out of the starting gate without Functional Safety (FS). All electronic system that go into cars must have ISO 26262 certification. However, this is not something you slap on after the fact. From the ground up the requirements for ISO 26262 must be considered and the proper processes must… Read More
WEBINAR: Generating and Measuring IP Security Threat Levels For Your SoCs
IPs have an attack surface that indicates how they can be compromised in real world scenarios. Some portions of the attack surfaces are well known, others are discovered during analysis, testing or out in the field. SoCs that use large collections of IPs need a systematic and reliable way to determine the various security vulnerabilities… Read More
Webinar – AI/ML SoC Memory and Interconnect IP Perspectives
For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More
Design Perspectives on Intermittent Faults
Bugs are an inescapable reality in any but the most trivial designs and usually trace back to very deterministic causes – a misunderstanding of the intended spec or an incompletely thought-through implementation of some feature, either way leading to reliably reproducible failure under the right circumstances. You run diagnostics,… Read More
5G Deployments – The Analysis Requirements are Ginormous
The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended). 5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave”)… Read More
A Future Vision for 3D Heterogeneous Packaging
At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology. Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More
Weebit Nano Moves into the Mainstream with Customer Adoption