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Semiconductor Expert Forum

Podcast EP296: How Agentic and Autonomous Systems Make Scientists More Productive with SanboxAQ’s Tiffany Callahan

Podcast EP296: How Agentic and Autonomous Systems Make Scientists More Productive with SanboxAQ’s Tiffany Callahan
by Daniel Nenni on 07-09-2025 at 8:00 am
Categories: AI

Dan is joined by Dr. Tiffany Callahan from SandboxAQ. As one of the early movers in the evolving sciences of computational biology, machine learning and artificial intelligence, Tiffany serves as the technical lead for agentic and autonomous systems at SandboxAQ. She has authored over 50 peer-reviewed publications, launched… Read More

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Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications

Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications
by Admin on 07-09-2025 at 8:00 am
Categories: 3D IC

Hybrid Bonding for Advanced Packaging

In extreme ultraviolet lithography (EUVL) systems, the collector mirror is a critical optical component that gathers and directs EUV light from the source toward the projection optics. Over time, the collector surface accumulates contaminant films — primarily tin (Sn) debris from the laser-produced plasma (LPP) source, … Read More

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Insider Opinions on AI in EDA. Accellera Panel at DAC

Insider Opinions on AI in EDA. Accellera Panel at DAC
by Bernard Murphy on 07-09-2025 at 6:00 am
Categories: Accellera, AI, Events, Semiconductor Services

Accellera Panel on AI in EDA min

In AI it is easy to be distracted by hype and miss the real advances in technology and adoption that are making a difference today. Accellera hosted a panel at DAC on just this topic, moderated by Dan Nenni (Mr. SemiWiki). Panelists were: Chuck Alpert, Cadence’s AI Fellow driving cross-functional Agentic AI solutions throughout… Read More

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Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC Verification

Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC Verification
by Kalar Rajendiran on 07-08-2025 at 10:00 am
Categories: EDA, Siemens EDA

SmartCompile

In the race to deliver ever-larger SoCs under shrinking schedules, simulation is becoming a bottleneck. With debug cycles constrained by long iteration times—even for minor code changes—teams are finding traditional flows too rigid and slow. The problem is further magnified in continuous integration and continuous deployment… Read More

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Arteris Simplifies Design Reuse with Magillem Packaging

Arteris Simplifies Design Reuse with Magillem Packaging
by Mike Gianfagna on 07-08-2025 at 6:00 am
Categories: Arteris, Events, IP

Arteris Simplifies Design Reuse with Magillem Packaging

Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More

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MEMS Technology – From Fringe to Mainstream

MEMS Technology – From Fringe to Mainstream
by Daniel Nenni on 07-07-2025 at 10:00 am
Categories: IP

MEMs 2025 SemiWiki

Last month, Lj Ristic delivered an invited talk on MEMS technology as a driving force at the Laser Display and Lighting Conference 2025, held at Trinity College Dublin.  His talk included a review of some major successes of MEMS industry. We used that occasion to talk to him and discuss some major achievements and the status of MEMS… Read More

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Caspia Focuses Security Requirements at DAC

Caspia Focuses Security Requirements at DAC
by Mike Gianfagna on 07-07-2025 at 6:00 am
Categories: AI, Caspia Technologies, Events, Security

Caspia Highlights Security Requirements at DAC

As expected, security was a big topic at DAC this year. The growth of AI has demanded complex, purpose-built semiconductors to run ever-increasing workloads. AI has helped to design those complex chips more efficiently and with less power demands. There was a lot of discussion on these topics. But there is another part of this trend.… Read More

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CEO Interview with Peter L. Levin of Amida

CEO Interview with Peter L. Levin of Amida
by Daniel Nenni on 07-05-2025 at 10:00 am
Categories: AI, CEO Interviews, Security

Peter L. Levin Headshot 2024

Peter L. Levin has served at senior levels of leadership in the federal government, the private sector, and academe. Immediately prior to co-founding Amida, he was Senior Advisor to the Secretary and Chief Technology Officer of the Department of Veterans Affairs, where he led their health record modernization initiative. His… Read More

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CEO Interview with John Akkara of Uptime Crew

CEO Interview with John Akkara of Uptime Crew
by Daniel Nenni on 07-05-2025 at 6:00 am
Categories: AI, CEO Interviews

John (2)

John Akkara is the Founder and CEO of Uptime Crew, where he channels his entrepreneurial spirit to create impactful opportunities in the IT industry. An immigrant from India, John’s journey began with a full-ride tennis scholarship to a Division I university, where he studied finance. Today, as the leader of Uptime Crew, John … Read More

Podcast EP295: How Nordic Semiconductor Enables World-Class Wireless Products with Sam Presley

Podcast EP295: How Nordic Semiconductor Enables World-Class Wireless Products with Sam Presley
by Daniel Nenni on 07-04-2025 at 10:00 am
Categories: Mobile

Dan is joined by Sam Presley, technical product manager at Nordic Semiconductor. With a background in electronics engineering, embedded firmware development and consumer products development, his current areas of expertise are hardware and software for IoT applications, with a special focus on enabling product manufacturers… Read More