As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More





Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
Analysis and Exploration of Parasitic Effects
With advanced semiconductor processes continuing to shrink, the number and complexity of parasitic elements in designs grows exponentially contributing to one of the most significant bottlenecks in the design flow. Undetected parasitic-induced issues can be extremely costly, often resulting in tape-out delays.
Silvaco… Read More
Siemens Proposes Unified Static and Formal Verification with AI
Given my SpyGlass background I always keep an eye out for new ideas that might be emerging in static and formal verification. Whatever can be covered through stimulus-free analysis reduces time that needn’t be wasted in dynamic analysis, also adding certainty to coverage across that range. Still, advances don’t come easily. … Read More
Edge Roughness Differences Among EUV Resists
EUV resists are a key component in the implementation and optimization of EUV lithography. By converting a limited number of absorbed EUV photons into a variable number of released migrating electrons, the resist becomes the final determinant of resolution. There are two kinds of resist which are seriously considered: chemically… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
By Tetsu Ho
With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More
Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap
Alchip Technologies, a global leader in high-performance computing (HPC) and AI infrastructure ASICs, has officially launched its 2nm Design Platform, marking a major advancement in custom silicon design. The company has already received its first 2nm wafers and is collaborating with customers on the development of high-performance… Read More
Agile Analog Update at #62DAC
On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More
Accelerating IC Design: Silvaco’s Jivaro Parasitic Reduction Tool
In Silvaco’s July 2025 video presentation at the 62nd Design Automation Conference (DAC), Senior Staff Applications Engineer Tim Colton introduced Jivaro, a specialized parasitic reduction tool designed to tackle the escalating challenges of post-layout simulation in advanced IC designs. As semiconductor nodes… Read More
Protecting Sensitive Analog and RF Signals with Net Shielding
By Hossam Sarhan
Communication has become the backbone of our modern world, driving the rapid growth of the integrated circuit (IC) industry, particularly in communication and automotive applications. These applications have increased the demand for high-performance analog and radio frequency (RF) designs.
However, designing… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet