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SISPAD 2020

September 23 - September 25

September 23-25, 2020

Workshop, September 22

ALL-VIRTUAL Conference

Sponsored by The Japan Society of Applied Physics

Technical Co-sponsored by The IEEE Electron Devices Society

Supported by IEEE Electron Devices Society Kansai Chapter

IMPORTANT ANNOUNCEMENT !

Considering the effect of worldwide outbreak of COVID-19, the SISPAD 2020 Committee has decided to hold the conference as “ALL-VIRTUAL” conference. Based on this decision, the important dates are updated as

  • Abstract Submission Deadline: June 20
  • Notification of Acceptance: July 24
  • Deadline of Final Proceedings Submission: August 21

In addition, a limited number of papers will be accepted as late news, whose deadline will be late August.

The period of the conference is not restricted to 4 days, and we are planning to extend it, for example, two weeks.

Updated information will be announced on the conference website.

International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.

The 25th SISPAD will be held as an All-Virtual conference.

Important Dates:

  • April 6, 2020 —> June 20, 2020 Abstract Submission Deadline
  • May 31, 2020 —> July 24, 2020 Notification of Acceptance
  • June 30, 2020 —> August 21, 2020 Full Paper Submission Deadline

Details

Start:
September 23
End:
September 25
Event Tags:
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Website:
https://sites.google.com/view/sispad2020/