Join us for this day-long seminar, where you will learn to apply the full suite of Cadence’s cutting-edge technology platforms for rapid and robust analog and mixed-signal IC, package, and board design.

CadenceCONNECT will feature two tracks:

Track 1: Custom IC, Analog, RF, Photonics, and Mixed-Signal Design Technologies

In this track, you will learn about new capabilities ofour core Virtuoso® technology and our multiphysics analysis solvers that enable a step change in capacity and performance. We will also talk about new tools introduced in the last 12 months, such as Spectre® FX Simulator for FastSPICE simulation, Voltus-XFi Custom Power Integrity Solution, and SimVision MS Debug Option, to name just a few.

Track 2: Package, PCB, and RF Design and Analysis Technologies

In this track, you will learn about the Cadence suite with chip, IC package, and PCB design tools, as well as fundamental multiphysics analysis technologies spanning electromagnetic, thermal, signal, and power integrity solutions, empowering you to simulate and analyze complete electronic system designs incorporating one or more fabrics, as the design progresses from concept to signoff and manufacturing.

Location and Date:

Sharon Hotel, Herzliya, Israel

May 3, 2023