WP_Term Object
(
    [term_id] => 44
    [name] => TechInsights
    [slug] => techinsights
    [term_group] => 0
    [term_taxonomy_id] => 44
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 105
    [filter] => raw
    [cat_ID] => 44
    [category_count] => 105
    [category_description] => 
    [cat_name] => TechInsights
    [category_nicename] => techinsights
    [category_parent] => 386
    [is_post] => 
)
            
image001 (16)
WP_Term Object
(
    [term_id] => 44
    [name] => TechInsights
    [slug] => techinsights
    [term_group] => 0
    [term_taxonomy_id] => 44
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 105
    [filter] => raw
    [cat_ID] => 44
    [category_count] => 105
    [category_description] => 
    [cat_name] => TechInsights
    [category_nicename] => techinsights
    [category_parent] => 386
    [is_post] => 
)

Ireland – A Model for the US on Technology

Ireland – A Model for the US on Technology
by Scotten Jones on 05-02-2021 at 6:00 am

Slide1 2

After I published a recent article about Intel, I was contacted by the Irish Development Agency (IDA) where Intel has a large fab presence and asked if I would like to interview them about the Intel site. The interview with Turlough McCormack of the IDA, started with Intel’s presence in Ireland but then went on to paint an interesting… Read More


How to Spend $100 Billion Dollars in Three Years

How to Spend $100 Billion Dollars in Three Years
by Scotten Jones on 04-25-2021 at 6:00 am

Slide1 1

TSMC recently announced plans to spend $100 billion dollars over three years on capital. For 2021 they announced $30B in total capital with 80% on advanced nodes (7nm and smaller), 10% on packaging and masks and 10% on “specialty”.

If we take a guess at the capital for each year, we can project something like $30B for 2021 (announced),… Read More


SPIE 2021 – Applied Materials – DRAM Scaling

SPIE 2021 – Applied Materials – DRAM Scaling
by Scotten Jones on 04-08-2021 at 10:00 am

Slide1

At the SPIE Advanced Lithography Conference in February 2021, Regina Freed of Applied Materials gave a paper: “Module-Level Material Engineering for Continued DRAM Scaling”. Applied Materials provided me with the presentation and was kind enough to set up an interview for me with Regina Freed.

I also spoke to Regina Freed last… Read More


Kioxia and Western Digital and the current Kioxia IPO/Sale rumors

Kioxia and Western Digital and the current Kioxia IPO/Sale rumors
by Scotten Jones on 04-06-2021 at 10:00 am

Slide2

There are a lot of articles out right now discussing a possible IPO for Kioxia or sale of the company with Western Digital (WD) and Micron Technology (MT) mentioned as possible acquirers. Kioxia and WD have a partnership for Flash Memory and on March 18th WD gave a presentation on the state of their partnership and what they see as their… Read More


Intel Node Names

Intel Node Names
by Scotten Jones on 02-15-2021 at 6:00 am

Slide2

There is a lot of interest right now in how Intel compares to the leading foundries and what the future may hold.

Several years ago, I published several extremely popular articles converting processes from various companies to “Equivalent Nodes” (EN). Nodes were at one time based on actual physical features of processes but had… Read More


ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era

ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era
by Scotten Jones on 01-15-2021 at 6:00 am

Slide3

I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.

The title of the talk is “Logic Leadership in the PPAC era”.

The talk is broken up into three main sections:

  1. Background information explaining PPAC and Standard Cells.
  2. A node-by-node comparisons of companies running leading edge logic
Read More

IEDM 2020 – Imec Plenary talk

IEDM 2020 – Imec Plenary talk
by Scotten Jones on 01-08-2021 at 6:00 am

Imec Figure 1

On Monday morning at IEDM, Sri Samavedam of Imec opened the technical program with a plenary talk entitled “Future Logic Scaling: Towards Atomic Channels and Deconstructed Chips”. I am not generally a fan of plenary talks, I think the presenters often try to cover too much in their talks and end up not providing enough detail to be… Read More


No Intel and Samsung are not passing TSMC

No Intel and Samsung are not passing TSMC
by Scotten Jones on 12-02-2020 at 6:00 am

Slide1

Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More


Leading Edge Foundry Wafer Prices

Leading Edge Foundry Wafer Prices
by Scotten Jones on 11-06-2020 at 6:00 am

Slide1

I have seen several articles recently discussing foundry wafer selling prices for leading edge wafers, these articles all quote estimates from a paper by the Center for Security and Emerging Technology (CSET). The paper is available here.

My company IC Knowledge LLC is the world leader in cost and price modeling of semiconductors… Read More


VLSI Symposium 2020 – Imec Monolithic CFET

VLSI Symposium 2020 – Imec Monolithic CFET
by Scotten Jones on 09-13-2020 at 10:00 am

th311591894514842 Page 04

The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Monolithic CFET and I had a chance to interview one of the authors, Hiroaki Arimura.

It is well known in the industry that FinFETs (FF) are reaching the end of their scaling life. Samsung… Read More