The news Qualcomm has shipped over a billion Snapdragon chips in Android smartphones broke last September. After reiterating that and a sustained outlook for smartphones over the next five years, the Qualcomm CES 2015 presser seemed to leave most media outlets a bit disappointed. Naturally, that prompts us to ask what is going… Read More
Riding the Wave of Silicon Magic in 2015!
2014 was a busy year for SemiWiki. We attended dozens of events, met hundreds of people (if not thousands), and published 810 blogs and a book that reached more than half of a million people. We collaborated throughout the fabless semiconductor ecosystem all year long and let me tell you it has been an amazing mind expanding experience,… Read More
Kathryn Kranen at IEDM
It is the 50th year of IEDM, the International Electron Devices Meeting. The fact that it has been going for so long reveals why it has such an odd name: back in 1964 most “electron devices” were tubes (valves in UK lingo). This year they gave all of us a USB stick with all the papers from all 50 years of the event, something… Read More
IEDM: TSMC, Intel and IBM 14/16nm Processes
This week is IEDM. Three of the presentations today were by TSMC, Intel and IBM going over some of the details of their 14/16nm processes. They don’t provide the slides at IEDM, just the single page papers so this may end up being a somewhat random collection of facts.
TSMC were up first. They talked about the improvements that… Read More
A Closer Look at the QCOM $40M Investment in China!
Last Thursday night was the 20[SUP]th[/SUP] annual GSA Awards Dinner which probably hosts one of the largest collections of semiconductor executives. Think of a movie or music awards show with all of the trimmings including Jay Leno as the keynote. I don’t know the exact head count but there were 160 dinner tables with 10 plates … Read More
Will 3DIC Ever Be Cheap Enough for High Volume Products?
More news from the 3DASIP conference. Chet Palesko of SavanSys Solution had an interesting presentation with the same title as this blog (although this blog draws from several other presentations too). Chet took a look at what aspects of 3D are likely to get cheaper going forward. He took as a starting point that stuff that is not … Read More
3D, The State of the State
I have been at the 3D ASIP conference that is held every year in Burlingame. It is far and away the best place to get a snapshot on what is going on in 3D (and 2.5D) IC design each year. One of the presentations was by the guys from Yole on where the industry is right now. Other presentations were on pathfinding, power reduction (did you know… Read More
3DIC in Burlingame
Every year in December is what I think of as the main 3D IC conference where you can get up to speed on all the latest. Officially it is called 3D Architectures for Semiconductor and Packaging or 3D ASIP. It is held in the Hyatt Regency in Burlingame (the one right by 101 near the airport). This year it is from December 10-12th.
The first… Read More
Rock for CASA, December 6th
It is the holiday season so time to get together with your friends and colleagues in EDA, IP and semiconductor at the third annual event raising money for Court Appointed Special Advocates (CASA) (www.casaofsantacruz.org). This is the third event that Heart of Technology has worked with CASA. CASA has local organizations and … Read More
Lucio and the Kaufman Award
Tuesday was the Kaufman award dinner. This year it was awarded to Lucio Lanza. Last week I wrote about how Lucio ended up in EDA, although that was not where he finished up. He is currently a venture capitalist running Lanza Technology Ventures, one of the few VCs to make any investments in the EDA/IP/semiconductor space. Also, unlike… Read More
Intel High NA Adoption