I live in Tualatin, Oregon just a few miles away from the corporate headquarters of the #3 EDA company in the world, Mentor Graphics. Since DAC is fast approaching, I thought it would be useful to give you a quick overview of what Mentor is going to be talking about in Austin, Texas during June 5-9. … Read More
Electronic Design Automation
Power Noise Sign-off at #53DAC
When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More
How TSMC Tackles Variation at Advanced Nodes
The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More
Who protects power protection chips?
Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.
Power protection chips work like electronic fuses,… Read More
Testing IGBTs before they go into EVs
In the pages of SemiWiki, we are usually talking about what to do with billions of really small transistors – for a change of pace today, we’ll discuss what to do with a few really big ones. Mentor Graphics has just announced their latest MicReD platform for thermal testing of IGBTs, experiencing a resurgence (pun intended) thanks… Read More
What Does an MPW and a Pizza Have in Common?
Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More
"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis
A common SoC design methodology in current use starts with preparation of the physical floorplan — e.g., block/pin placement, global clock domain and bus signal planning, developing the global/local power distribution (and dynamic power domain management techniques). Decoupling capacitor estimated densities and… Read More
Rebooting EDA
In the 35 years since commercial EDA went mainstream a lot of advances have been made but the fundamental architecture and even the philosophy of tooling have really not advanced at all. Tools are designed around individual tasks – analysis and optimization within a specific domain – under the assumption that variability within… Read More
Google TPU Another Step in a Shifting Semiconductor Landscape
Markets work when consumers of a widget don’t feel there is significant differentiated value in making their own and would rather get lowest possible cost from experienced widget makers who can amortize their investment over high-volume sales to many customers. But that changes when a large consumer finds they can increase differentiated… Read More
Where are the Entrepreneurs?
This week I attended the UpWest Labs event in San Francisco. UpWest Labs provides seed funding and incubation for a wide range of domains including Enterprise Software, Internet of Things, Infrastructure Technologies, Artificial Intelligence, Consumer Applications, Drones, Cyber Security, Augmented Reality / Virtual … Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools