WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 263
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 263
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
    [is_post] => 
)
            
3dic banner 800x100
WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 263
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 263
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
    [is_post] => 
)

2.5D and 3D designs

2.5D and 3D designs
by Paul McLellan on 09-07-2011 at 1:54 pm

Going up! Power and performance issues, along with manufacturing yield issues, limit how much bigger chips can get in two dimensions. That, and the fact that you can’t manufacture two different processes on the same wafer, mean that we are going up into the third dimension.

The simplest way is what is called package-in-package… Read More


Top 5 Reasons for Wasting Power

Top 5 Reasons for Wasting Power
by Paul McLellan on 08-19-2011 at 2:27 pm

Traditionally, David Letterman style, we should really have the top 10 reasons for wasting power in semiconductor design, but here are the five big ones.

Starting with reason #5: Lack of a power gating strategy
Leakage power is a huge proportion of total power and the only way to save leakage power (apart from low leakage cells when… Read More


ANSYS Regional Conference

ANSYS Regional Conference
by Paul McLellan on 08-17-2011 at 3:15 pm

Next Tuesday, August 23rd, is the ANSYS Regional Conference for Silicon Valley. It takes place at the Techmart Network Meeting Center. Apache has three presentations during the day:

  • 9.25-9.45 Andrew Yang Introducing Apache Design Solutions
  • 11.00-11.30 Methodology for delivering power-efficient designs from concept to
Read More

ANSYS/Apache

ANSYS/Apache
by Paul McLellan on 08-13-2011 at 2:43 pm

Last week I met with Andrew Yang, erstwhile CEO of Apache Design Systems and now formally President of Apache Design Inc, a wholly owned subsidiary of ANSYS. The merger formally closed at the start of the month. Within ANSYS Apache is positioned as Chip-aware System-level Engineering Simulation. ANSYS is pretty much completely… Read More


Sentinel-PSI Webinar

Sentinel-PSI Webinar
by Paul McLellan on 08-07-2011 at 3:28 pm

The last of the current series of webinars is on Sentinel-PSI,IC-Package, Power and Signal Integrity Solution. It will be at 11am Pacific time on Thursday 11th August. It will be conducted by Dr. Tao Su, product manager of the Sentinel products. Dr. Su has many years of experience in the EDA industry and is specialized in power integrity… Read More


Chip-Package-System Webinar

Chip-Package-System Webinar
by Paul McLellan on 08-05-2011 at 5:14 pm

The webinar on CPS (chip-package-system) is on Tuesday 9th August at 11am Pacific time. It will be conducted by Christopher Ortiz, Principal Application Engineer at Apache Design Solutions. Dr. Ortiz has been with Apache since 2007, supporting the Sentinel product line. Prior to Apache he worked at Agere / LSI, where he investigated… Read More


PathFinder webinar: Full-chip ESD Integrity and Macro-level Dynamic ESD

PathFinder webinar: Full-chip ESD Integrity and Macro-level Dynamic ESD
by Paul McLellan on 08-01-2011 at 10:00 am

The PathFinder webinar will be at 11am Pacific time on Thursday 4th August. It will be conducted by Karthik Srinivasan, Senior Applications Engineer at Apache Design Solutions. Mr. Srinivasan has over four years of experience in the EDA industry, focusing on die, system, and cross-domain analysis. His professional interests… Read More


Totem webinar: Analog/Mixed-Signal Power Noise and Reliability

Totem webinar: Analog/Mixed-Signal Power Noise and Reliability
by Paul McLellan on 07-30-2011 at 5:26 pm

The Totem webinar will be at 11am on Tuesday 2nd August. This session will be conducted by Karan Sahni, Senior Applications Engineer at Apache Design Solutions. Karan has been with Apache since 2008, supporting the Redhawk, Totem, Sentinel product lines. He received his MS in Electrical Engineering from the Syracuse University… Read More


PowerArtist webinar

PowerArtist webinar
by Paul McLellan on 07-21-2011 at 3:21 pm

The next Apache webinar is on PowerArtist, RTL Power Analysis on July 26th at 11am Pacific time. The webinar will be conducted by David “Woody” Norwood, Principal Applications Engineer at Apache Design Solutions. David has been supporting RTL Power products for the past 8 years. He has broad EDA industry experience… Read More


Gary Smith on the Apache acquisition

Gary Smith on the Apache acquisition
by Paul McLellan on 07-20-2011 at 4:44 pm

Gary Smith has a note out about the Apache acquisition by Ansoft (unfortunately if you get his email newsletter the link there takes you to the wrong article but it really is here or here as pdf). Most of the note actually describes the acquisition and the Apache product line which won’t reveal much new to anyone here.

He regards… Read More