Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling

The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration. However, this evolution introduces significant challenges in modeling, simulation, and reliability assessment due to the massive size and complexity of ECAD data.

A webinar addressing this very topic was recently offered by Altair. Iyad Rayane, senior technical specialist at the company delivered the webinar session.

The Growing Complexity of Modern ECAD Models

Modern IC packages feature thousands of nets across multiple routing layers and use a variety of materials with different physical properties. This results in extremely large ECAD datasets that are difficult to manage and analyze. High-density routing and compact layouts in 3D memory cubes and stacked-die packages also lead to increased power densities and mechanical stresses. Designers face issues like thermal stress, delamination, chip warpage, and solder fatigue, which can severely impact package reliability. Traditional simulation tools struggle to handle these detailed models efficiently, often requiring prohibitively long runtimes and limiting early-stage design exploration.

Challenges in Multiphysics Simulation

Several challenges complicate multiphysics simulation of large-scale 3D IC packages. The volume and complexity of ECAD data strain the capacity of existing tools to import and process models quickly. Accurate analysis requires coupling thermal, mechanical, fatigue, and electromagnetic effects, all while managing heterogeneous materials and thin-layer geometries. Applying fine mesh detail throughout the entire model is computationally expensive, yet necessary in critical regions. Moreover, the shift to system-level floorplanning and heterogeneous integration demands new workflows that traditional EDA tools do not fully support.

Altair SimLab’s Innovative Solution

Altair SimLab addresses these challenges by providing a paradigm-shifting multiphysics environment tailored for large-scale ECAD models. It drastically reduces import times—from hours to minutes—enabling detailed simulation on common desktop hardware. Its metal-mapping technology computes equivalent material properties based on volumetric metal and dielectric content, simplifying fine routing into effective continuous materials without sacrificing accuracy. The software supports hybrid modeling, where signal layers are represented as sheet bodies, vias as wire bodies, and insulating layers as solids, allowing flexible and efficient meshing strategies.

SimLab also incorporates submodeling, allowing designers to run fast global simulations with trace mapping to identify critical areas for detailed local analysis. Displacement and other boundary conditions are transferred from the global model to the detailed submodel, balancing speed with accuracy. Furthermore, the platform integrates thermal, thermal stress, solder fatigue, and package reliability simulations within a single, user-friendly environment. It also interfaces with third-party solvers to extend multiphysics capabilities, providing a comprehensive solution for advanced packaging analysis.

How Altair SimLab Helps Engineers

By combining scalable import, flexible modeling approaches, and multiphysics coupling, Altair SimLab enables engineers to accelerate simulation turnaround and improve prediction accuracy. Designers can quickly explore “what-if” scenarios early in the design cycle, making better-informed decisions about process nodes and package configurations. The efficient data handling allows for detailed reliability analysis of solder bumps, vias, and interconnects, helping identify potential failure points before manufacturing. This approach reduces costly redesigns, shortens development cycles, and ultimately leads to more robust semiconductor products.

Test Case Results: Significant Time Savings

The power of Altair SimLab is evident in real-world test cases. One example involves a large PCB measuring 42 cm by 34 cm with 14 routing layers and over 7,500 nets. SimLab reduced the import runtime from more than four hours on a high-performance computing system to just five minutes on a standard laptop. Another case features a 66 mm by 66 mm silicon interposer with 12 routing layers and over 3,000 nets. Import time was cut from one hour to three minutes. These results demonstrate how Altair’s efficient ECAD data handling enables complex multiphysics simulations to be performed quickly and cost-effectively on everyday hardware.

Summary

As semiconductor packaging continues to evolve toward 3D ICs and heterogeneous integration, simulation tools must keep pace with increasing complexity. Altair SimLab delivers a scalable, integrated platform that bridges the gap between massive ECAD datasets and accurate multiphysics analysis. Its innovative modeling techniques and efficient workflows empower designers to accelerate innovation, optimize reliability, and confidently address the challenges of advanced packaging technologies. By transforming how large-scale ECAD models are imported and analyzed, Altair SimLab plays a critical role in advancing the next generation of semiconductor devices.

Learn more at https://altair.com/simlab

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