Software defined vehicles (SDVs) are transforming the automotive industry. Today’s vehicles are connected computing platforms that rely on advanced processors, artificial intelligence (AI), over the air (OTA) software updates, cloud services, and vehicle to everything (V2X) communications. Every electronic … Read More
Author: Kalar Rajendiran
Industry’s First Certified Automotive Grade PUF for Software Defined Vehicles
From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems
Every generation of semiconductor innovation has relied on one fundamental principle: before a technology can be manufactured at scale, it must first be understood. That understanding comes through characterization.
For decades, characterization enabled process learning. It helped engineers understand transistor behavior,… Read More
The Architecture of Success: Why a Unified Semiconductor IP Strategy Is the Foundation of Modern SoC Design
As architects push toward advanced nodes and increasingly demanding workloads, modern silicon design has entered an era of unprecedented complexity. A single design respin can cost millions of dollars and delay market entry. Against this backdrop, designs must be balanced for performance, bandwidth, power efficiency, security… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More
Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets Era
The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More
Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner
Highlights from a recent panel session moderated by Ed Sperling (Semiconductor Engineering) featuring Walden Rhines (Silvaco), Vincent Wong (Verific), Dave Kelf (Breker Verification Systems), Shelly Henry (MooresLab AI), Ann Wu (Silimate), and Cindy Cui (ChipAgents). The panel session was hosted by Electronic System … Read More
Customized Foundation IP Enables the Next Generation of Automotive Compute
As vehicles become increasingly software-defined, automotive semiconductor suppliers face growing pressure to deliver higher compute performance while maintaining strict requirements for power efficiency, reliability, and long-term product support. Advanced driver assistance systems (ADAS), electrification, … Read More
Engineering the Next Era of Semiconductor Innovation
The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More
SiFive’s P570 Gen 3 Pushes RISC-V Further Into the AI Era
With the launch of its new P570 Gen 3 processor family, SiFive is making a broader statement about the future of edge computing and the growing role of RISC-V in mainstream application processors. Rather than simply unveiling another CPU core, the company is positioning the P570 as a balanced-performance processor built specifically… Read More
ASML High-NA EUV is Not Ready for High-Volume Production