From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation

From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
by Kalar Rajendiran on 10-22-2026 at 10:00 am

Gary Dickerson on the Stage

The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More


The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip

The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
by Kalar Rajendiran on 10-20-2026 at 10:00 am

Partners Photo Op scaled

Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected

Artificial intelligence is changing what the semiconductor industry must deliver. … Read More


Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP

Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP
by Kalar Rajendiran on 10-12-2026 at 8:00 am

Voltage Regions and Impact of Voltage Scaling

As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning… Read More


From Blueprint to Production: How Rambus Brings Commercial-Grade Caliptra Security to AI SoCs

From Blueprint to Production: How Rambus Brings Commercial-Grade Caliptra Security to AI SoCs
by Kalar Rajendiran on 10-07-2026 at 10:00 am

CryptoManager Interfaces for Platform Level Security Orchestration

Semiconductor designers today face a critical hurdle: how to smoothly transition from an open-source hardware blueprint to a commercially hardened, production-ready silicon implementation. As semiconductors play an increasingly essential role in powering the AI era, safeguarding these hardware foundations has become… Read More


Managing Power, Performance and Reliability in the Chiplet Era

Managing Power, Performance and Reliability in the Chiplet Era
by Kalar Rajendiran on 09-29-2026 at 10:00 am

Test Drivers proteanTecs (Chiplet Webinar)

Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More


Synopsys Announces AgentEngineer Solutions and Autopilot Platform for Autonomous Engineering

Synopsys Announces AgentEngineer Solutions and Autopilot Platform for Autonomous Engineering
by Kalar Rajendiran on 09-28-2026 at 6:00 am

updated from ai assisants to autonomous engineering

Synopsys today announced its AgentEngineerTM solutions portfolio and AutopilotTM Platform, advancing a fundamental paradigm shift in electronic design automation (EDA): moving beyond AI copilots toward autonomous engineering agents. Following a recent technical briefing with Thomas Andersen, Vice President of AI and… Read More


Tokens Per Watt Over Peak Performance: Retrofitting Heterogeneous Silicon for Production Inference

Tokens Per Watt Over Peak Performance: Retrofitting Heterogeneous Silicon for Production Inference
by Kalar Rajendiran on 09-24-2026 at 2:00 pm

Image for Article 2 SemiWiki Tokens per Watt or per Dollar

👉 This is Part 2 of an editorial series on the evolving economics of AI inference. If you missed Part 1, where I broke down the shift toward full-system integration, the lessons from the AI Infra Summit, and the “no forks” open-source philosophy, you can read it HERE: Beyond the Accelerator: Why Silicon Challengers … Read More


The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems
by Kalar Rajendiran on 09-23-2026 at 2:00 pm

Broadest Portfolio of Silicon Validated IP

At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More


Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure

Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure
by Kalar Rajendiran on 09-22-2026 at 2:00 pm

Image for Article 1 SemiWiki Silicon to Systems

The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular caught my attention… Read More


The $9.5 Billion Design IP Market: Shifting Boundaries, Arm’s Monopoly, and the RISC-V Response

The $9.5 Billion Design IP Market: Shifting Boundaries, Arm’s Monopoly, and the RISC-V Response
by Kalar Rajendiran on 09-04-2026 at 6:00 am

2025 Design IP Sub Categories Market Share Pie Chart

While semiconductor design intellectual property (IP) is a $9.45 billion market, it acts as the absolute architectural bottleneck for the entire global semiconductor value chain. The choices made at the IP layer today dictate the cost, power, and security of a downstream technology economy rapidly marching toward a trillion… Read More