Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More


Semiconductors and Mobile Communications: 5G and Beyond

Semiconductors and Mobile Communications: 5G and Beyond
by Kalar Rajendiran on 03-06-2023 at 6:00 am

RF Front End Increasing in Complexity

Mobile World Congress (MWC) is the world’s largest gathering of mobile industry innovators where one can hear the latest on advanced technologies and solutions. This year, it took place from February 27 through March 2. Soitec was there to share their insights on how mobile communications are going to evolve with 5G and beyond … Read More


Maintaining Vehicles of the Future Using Deep Data Analytics

Maintaining Vehicles of the Future Using Deep Data Analytics
by Kalar Rajendiran on 02-27-2023 at 10:00 am

proteanTecs PPM Highlevel View

So much has changed over the recent couple of decades in what constitutes an automobile. Gone are the days when it was essentially an electro-mechanical product, used for just personal transportation. Over the years, it has evolved to adding in-cabin infotainment, tele and data communications, driving assistance, all the way… Read More


Speeding up Chiplet-Based Design Through Hardware Emulation

Speeding up Chiplet-Based Design Through Hardware Emulation
by Kalar Rajendiran on 02-16-2023 at 10:00 am

Barriers on the Continuum to SiP

The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More


PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels

PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels
by Kalar Rajendiran on 02-14-2023 at 6:00 am

Multi Level Challenges

As the premier high-speed communications and system design conference, DesignCon 2023 offered deep insights from various experts on a number of technical topics. In the area of high-speed communications, PCIe has a played a crucial role over the years in supporting increasingly higher communications speed with every new revision.… Read More


Cliosoft’s Smart Storage Strategy for Better Workspace Management

Cliosoft’s Smart Storage Strategy for Better Workspace Management
by Kalar Rajendiran on 02-08-2023 at 10:00 am

Links to Cache Architecture

Over the years storage has gotten very cheap, or has it? As a typical consumer, we take data storage for granted because access to it has gotten very cheap. Long gone are the days of being limited to 1.44MB floppy disks to store data. The smart devices we carry around with us can store 100’s of GB of data. That is a lot of data. But what about… Read More


Designing a ColdADC ASIC For Detecting Neutrinos

Designing a ColdADC ASIC For Detecting Neutrinos
by Kalar Rajendiran on 01-26-2023 at 6:00 am

The DUNE Experiment

Cliosoft recently hosted a webinar where Carl Grace, a scientist from Lawrence Berkeley National Laboratory (LBNL) talked about a cutting edge project for detecting neutrinos. The project is called the Deep Underground Neutrino Experiment (DUNE) project. Many of us know what a neutron is, but what is a neutrino? Before we get… Read More


How to Efficiently and Effectively Secure SoC Interfaces for Data Protection

How to Efficiently and Effectively Secure SoC Interfaces for Data Protection
by Kalar Rajendiran on 01-04-2023 at 6:00 am

secure interfaces article fig1

Before the advent of the digitized society and computer chips, things that needed protection were mostly hard assets such as jewelry, coins, real estate, etc. Administering security was simple and depended on strong guards who provided security through physical means. Then came the safety box services offered by financial … Read More


The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Kalar Rajendiran on 12-27-2022 at 6:00 am

High End Performance Packaging Spectrum

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More


How an Embedded Non-Volatile Memory Can Be a Differentiator

How an Embedded Non-Volatile Memory Can Be a Differentiator
by Kalar Rajendiran on 12-22-2022 at 6:00 am

State of Weebit ReRAM

Embedded memory makes computing applications run faster. In the early days of the semiconductor industry, the desire to utilize large amount of on-chip memory was limited by cost, manufacturing difficulties and technology mismatches between logic and memory circuit implementations. Since then, advancements in semiconductor… Read More