Synchronous circuits dominate the electronic world because clocking eases the design of circuits compared to asynchronous circuits. At the same time, clocking also introduces its share of challenges to overcome. No wonder, a tremendous amount of time and effort have been spent over the years on developing and implementing … Read More
Author: Kalar Rajendiran
Methodology to Minimize the Impact of Duty Cycle Distortion in Clock Distribution Networks
Flex Logix: Industry’s First AI Integrated Mini-ITX based System
As the market for edge processing is growing, the performance, power and cost requirements of these applications are getting increasingly demanding. These applications have to work on instant data and make decisions in real time at the user end. The applications span the consumer, commercial and industrial market segments.… Read More
Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model
The tremendous amount of data generated by AI/ML driven applications and other hyperscale computing applications have forced the age old server architecture to change. The new architecture is driven by the resource disaggregation paradigm, wherein memory and storage are decoupled from the host CPU and managed independently… Read More
Five Key Workflows For 3D IC Packaging Success
An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
- System Co-Optimization (STCO) approach
- Transition from design-based to systems-based optimization
- Expanding the supply chain and tool
Getting Ahead with Semiconductor Manufacturing Equipment and Related Plasma Reactors
Advanced semiconductor fabrication technology is what makes it possible to pack more and more transistors into a sq.mm of a wafer. The rapidly increasing demand for advanced-process-based chips has created huge market opportunities for semiconductor manufacturing equipment vendors. According to SEMI, worldwide sales … Read More
Protecting Critical IP With Next-Generation Zero Trust Security
While semiconductors are the enablers for high-tech solutions, the semiconductor industry was not at the forefront of Cloud adoption. There were many valid concerns behind the slow adoption, a primary reason being the threat to intellectual property (IP) security. IP in this context refers to not just chip building blocks but… Read More
Delivering 3D IC Innovations Faster
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
Flex Logix Partners With Intrinsic ID To Secure eFPGA Platform
While the ASIC market has always had its advantages over alternate solutions, it has faced boom and bust cycles typically driven by high NRE development costs and time to market lead times. During the same time, the FPGA market has been consistently bringing out more and more advanced products with each new generation. With very… Read More
DSP IP for High Performance Sensor Fusion on an Embedded Budget
Whether we realize it or not, everyday applications we use depend on data gathered by sensors. We can bet that pretty much every application uses at least a couple of different types of sensors, if not more. That is because different types of sensors are better suited to collect data depending on the application, the environment … Read More
OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More
Moore’s Law is Dead – Long-live the Chiplet!