The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
Author: Kalar Rajendiran
Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
Cadence® Janus™ Network-on-Chip (NoC)
A Network-on-Chip (NoC) IP addresses the challenges of interconnect complexity in SoCs by significantly reducing wiring congestion and providing a scalable architecture. It allows for efficient communication among numerous initiators and targets with minimal latency and high speed. A NoC facilitates design changes, enabling… Read More
Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More
Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More
Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures
The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More
3DIC Verification Methodologies for Advanced Semiconductor ICs
At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.
3DIC Challenges
Despite the numerous advantages of 3DIC technology, its… Read More
The Fallacy of Operator Fallback and the Future of Machine Learning Accelerators
As artificial intelligence (AI) and machine learning (ML) models continue to evolve at a breathtaking pace, the demands on hardware for inference and real-time processing grow increasingly complex. Traditional hardware architectures for acceleration are proving inadequate to keep up with these rapid advancements in ML … Read More
Elevating Your SoC for Reconfigurable Computing – EFLX® eFPGA and InferX™ DSP and AI
Field-Programmable Gate Arrays (FPGAs) have long been celebrated for their unmatched flexibility and programmability compared to Application-Specific Integrated Circuits (ASICs). And the introduction of Embedded FPGAs (eFPGAs) took these advantages to new heights. eFPGAs offer on-the-fly reconfiguration capabilities,… Read More
AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs
Artificial Intelligence (AI) continues to revolutionize industries, from healthcare and finance to automotive and manufacturing. AI applications, such as machine learning, deep learning, and neural networks, rely on vast amounts of data for training, inference, and decision-making processes. As AI algorithms become … Read More
Enabling Imagination: Siemens’ Integrated Approach to System Design
In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More
Has ASML Reached the Great Wall of China