This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More
14:00 JST (APAC)
10:00 EDT, 16:00 CET (AMER and EUR)
Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics… Read More
We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
With… Read More
Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More
I just did a Google search for “3D IC”, and was stunned to see it return a whopping 476,000 results. This topic is trending, because more companies are using advanced IC packaging to meet their requirements, and yet the engineers doing the 3D IC design have new challenges to overcome. One of those challenges is creating… Read More
Over its 40+ year history, electronic design automation (EDA) has seen many companies rise, fall, and merge. In the beginning, in the 1980s, the industry was dominated by what came to be known as the big three — Daisy Systems, Mentor Graphics, and Valid Logic (the infamous “DMV”). The Big 3 has morphed over the years, eventually settling… Read More
An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
