Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


Cadence TECHTALK: Solution for 3D-IC Interposer Signal Integrity

Cadence TECHTALK: Solution for 3D-IC Interposer Signal Integrity
by Admin on 07-12-2023 at 3:31 pm

Date: Wednesday, July 26, 2023

Time: 10:00am PDT | 1:00pm EDT

3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design… Read More


Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
by Daniel Nenni on 06-26-2023 at 10:00 am

dac 2023 600x100

 

Highlights:

  • Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
  • There will be technical presentations every hour in the Ansys Booth Theater (#1539)
  • Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
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Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023

Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
by Daniel Nenni on 06-19-2023 at 10:00 am

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As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More


Webinar: 3D-IC Foundry Frameworks

Webinar: 3D-IC Foundry Frameworks
by Admin on 06-13-2023 at 4:54 pm

Join us on June 28th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.

TIME:
JUNE 28, 2023
11 AM EST

Venue:
Virtual

About this Webinar

Semiconductor applications such as Mobile

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Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


Webinar: Open Silicon Photonics 3D-IC Ecosystem for Computing Applications

Webinar: Open Silicon Photonics 3D-IC Ecosystem for Computing Applications
by Admin on 05-01-2023 at 1:46 pm

Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.

TIME:
MAY 16, 2023
11 AM EDT / 5 PM CEST

Venue:
Virtual

About this Webinar

We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used

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Webinar: Power Integrity Challenges and Solutions for Interposer Design

Webinar: Power Integrity Challenges and Solutions for Interposer Design
by Admin on 05-01-2023 at 1:42 pm

Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in

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Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

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Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More