One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
Tag: 3d-ic
Cadence TECHTALK: Solution for 3D-IC Interposer Signal Integrity
Date: Wednesday, July 26, 2023
Time: 10:00am PDT | 1:00pm EDT
3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design… Read More
3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.
TIME:
JULY 20, 2023
11 AM EST
About this Webinar
Semiconductor applications such as Mobile (5G), Automotive,
Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
Highlights:
- Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
- There will be technical presentations every hour in the Ansys Booth Theater (#1539)
- Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More
Webinar: 3D-IC Foundry Frameworks
Join us on June 28th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.
TIME:
JUNE 28, 2023
11 AM EST
Venue:
Virtual
About this Webinar
Semiconductor applications such as Mobile
Chiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
Webinar: Open Silicon Photonics 3D-IC Ecosystem for Computing Applications
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.
TIME:
MAY 16, 2023
11 AM EDT / 5 PM CEST
Venue:
Virtual
About this Webinar
We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used
Webinar: Power Integrity Challenges and Solutions for Interposer Design
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in
Multiphysics Analysis from Chip to System
Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More