Have you ever had the experience where you look up some unusual word in the dictionary since you don’t remember seeing it before. And then, in the next few weeks you keep coming across it. Twice in the last week I have been in presentations about the economics of putting die onto silicon interposers and the possibility of a new… Read More
Tag: 3d-ic
Atrenta Semiconductor Design in 3D!
My vote for most compelling technology at #47DAC is 3D technology. No, I don’t mean Hollywood-style 3D, I’m talking about vertical stacked-die system on chip design. This design approach basically means putting different parts of the system on different silicon substrates, so you can use the right technology for each part, and… Read More