From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
Tag: Advanced packaging
SEMICON Japan + Advanced Packaging and Chiplet Summit
December 14-16, 2022
Venue: Tokyo Big Sight
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology… Read More
Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET
(A recording will be sent after the live event to all registrants)
The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1
As the semiconductor industry adopts chiplets and heterogeneous… Read More
Alchip Delivers Cutting Edge Design Support for Supercomputer Processor
Alchip issued a press announcement recently entitled Alchip Provides Supercomputer Processor Design Support. The release is literally a tour de force of technology, with many advanced design and packaging accomplishments. First, let’s examine the basics of the design.
Preferred Networks, Inc (PFN) is the customer. They … Read More