Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology… Read More
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET
(A recording will be sent after the live event to all registrants)
As the semiconductor industry adopts chiplets and heterogeneous… Read More
Alchip issued a press announcement recently entitled Alchip Provides Supercomputer Processor Design Support. The release is literally a tour de force of technology, with many advanced design and packaging accomplishments. First, let’s examine the basics of the design.
Preferred Networks, Inc (PFN) is the customer. They … Read More
