Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
Alchip issued a press announcement recently entitled Alchip Provides Supercomputer Processor Design Support. The release is literally a tour de force of technology, with many advanced design and packaging accomplishments. First, let’s examine the basics of the design.
Preferred Networks, Inc (PFN) is the customer. They … Read More
