Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling

Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling
by Kalar Rajendiran on 07-10-2025 at 10:00 am

What is SimLab

The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More


Webinar: Using Digital Engineering for a Structural, Thermal, and Optical Performance Workflow

Webinar: Using Digital Engineering for a Structural, Thermal, and Optical Performance Workflow
by Admin on 05-05-2025 at 9:01 pm

This webinar discusses Ansys’ integrated STOP workflow, highlighting how it streamlines analysis, accelerates time-to-market, and improves optical system reliability through seamless integration and automation.

DATE:
June 5, 2025

Venue:
Virtual

Overview

Ansys is a digital engineering technology partner. This

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