The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More
Tag: structural
Webinar: Using Digital Engineering for a Structural, Thermal, and Optical Performance Workflow
This webinar discusses Ansys’ integrated STOP workflow, highlighting how it streamlines analysis, accelerates time-to-market, and improves optical system reliability through seamless integration and automation.
DATE:
June 5, 2025
Venue:
Virtual
Overview
Ansys is a digital engineering technology partner. This