Performing electronics thermal simulation directly within your CAD system

Performing electronics thermal simulation directly within your CAD system
by Admin on 08-11-2021 at 12:00 am

LIVE WEBINAR | AUGUST 11, 2021 | 11 AM EDT

Performing electronics thermal simulation directly within your CAD system

Most of today’s products include electronics that we can interface with and that control the device. As the use of electronics increases, design engineers are increasingly faced with challenges of thermal management… Read More


Spacecraft thermal control: leverage an integrated CAE and system simulation approach

Spacecraft thermal control: leverage an integrated CAE and system simulation approach
by Admin on 07-07-2021 at 12:00 am

LIVE WEBINAR | 07 JULY 2021 | TWO SESSIONS AVAILABLE

In today’s competitive context, telecommunications satellites must accommodate higher payload powers while reducing their mass, volume and cost. It leads to conflicting requirements, such as dissipating higher thermal loads with limited radiative surfaces.

One… Read More


Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
by Admin on 06-01-2021 at 12:00 am

Overview

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Takeaways:

  • Seamless
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Accuracy of In-Chip Monitoring for Thermal Guard-banding

Accuracy of In-Chip Monitoring for Thermal Guard-banding
by Daniel Payne on 01-28-2019 at 12:00 pm

I remember working at Intel and viewing my first SPICE netlist for a DRAM chip, because there was this temperature statement with a number after it, so being a new college graduate I asked lots of questions, like, “What is that temperature value?”

My co-worker answered, “Oh, that’s the estimated junction… Read More


Coupled Electro-thermal Analysis Essential for PowerMOS Design

Coupled Electro-thermal Analysis Essential for PowerMOS Design
by Tom Simon on 11-08-2018 at 12:00 pm

Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More


Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More


Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems
by Bernard Murphy on 02-08-2018 at 7:00 am

In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More


Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More


Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs

Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs
by Bernard Murphy on 09-17-2017 at 7:00 am

In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More


Simulating ADAS

Simulating ADAS
by Bernard Murphy on 05-04-2017 at 7:00 am

Simulation is a broad technique spanning certainly digital logic and circuit simulation but also methods beyond these which are particularly relevant to ADAS design. In fact, much of the design of full ADAS systems begins and ends with these types of modeling. This is in part due to the need fully validate integrity and reliability… Read More