Accuracy of In-Chip Monitoring for Thermal Guard-banding

Accuracy of In-Chip Monitoring for Thermal Guard-banding
by Daniel Payne on 01-28-2019 at 12:00 pm
Categories: Automotive, IoT, Mobile, Moortec
2 Comments

I remember working at Intel and viewing my first SPICE netlist for a DRAM chip, because there was this temperature statement with a number after it, so being a new college graduate I asked lots of questions, like, “What is that temperature value?”

My co-worker answered, “Oh, that’s the estimated junction… Read More

November 8, 2018

Coupled Electro-thermal Analysis Essential for PowerMOS Design

Coupled Electro-thermal Analysis Essential for PowerMOS Design
by Tom Simon on 11-08-2018 at 12:00 pm
Categories: EDA, Magwel

Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More

May 15, 2018

Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am
Categories: ANSYS, Inc., Automotive, EDA, Events

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’… Read More

February 8, 2018

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems
by Bernard Murphy on 02-08-2018 at 7:00 am
Categories: ANSYS, Inc., Automotive, EDA, Foundries, TSMC

In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More

October 17, 2017

Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am
Categories: ANSYS, Inc., Automotive, EDA, TSMC

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More

September 17, 2017June 14, 2019

Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs

Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs
by Bernard Murphy on 09-17-2017 at 7:00 am
Categories: ANSYS, Inc., Automotive, EDA, FinFET, Mobile

In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More

May 4, 2017June 14, 2019

Simulating ADAS

Simulating ADAS
by Bernard Murphy on 05-04-2017 at 7:00 am
Categories: ANSYS, Inc., Automotive, EDA, IoT

Simulation is a broad technique spanning certainly digital logic and circuit simulation but also methods beyond these which are particularly relevant to ADAS design. In fact, much of the design of full ADAS systems begins and ends with these types of modeling. This is in part due to the need fully validate integrity and reliability… Read More

May 25, 2016June 14, 2019

Who protects power protection chips?

Who protects power protection chips?
by Tom Simon on 05-25-2016 at 12:00 pm
Categories: EDA, Magwel

Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.

Power protection chips work like electronic fuses,… Read More

August 23, 2015June 14, 2019

A Complete Simulation Platform for Mobile Systems

A Complete Simulation Platform for Mobile Systems
by Pawan Fangaria on 08-23-2015 at 7:00 am
Categories: ANSYS, Inc., EDA, Mobile

If we take an insight into the semiconductor industry, we can easily find that mobile systems are the main drivers of this industry. The Smartphone business has remained at the top since a good number of years. Although the Smartphone sales growth has started showing a sign of stagnation, it is still a main contributor with a solid… Read More

April 16, 2015June 14, 2019

Don’t Miss Mentor Graphics U2U San Jose, April 21, 2015

Don’t Miss Mentor Graphics U2U San Jose, April 21, 2015
by Beth Martin on 04-16-2015 at 10:00 pm
Categories: EDA, Mentor, a Siemens Business

Mentor Graphics’ User2User conference will be held next week on April 21[SUP]st[/SUP] at the San Jose DoubleTree Hotel. This one-day, free conference is the perfect opportunity to learn, network, and share with other Mentor Graphics users.

The day starts off with back-to-back keynotes that examine different aspects of the … Read More

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