Electronics that are exposed to fluctuating temperatures undergo a process known as thermal cycling. These fluctuations in temperature cause the PCB and it’s components to expand and contract with the rise and fall of temperature. The various materials used electronics will expand and contract at different rates due to a mismatch… Read More
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate… Read More
Whether you’re involved in producing, distributing, or maintaining thermal management solutions, Thermal Management Expo is designed for you. Harness the potential of cutting-edge materials and technologies to enhance your application capabilities, guaranteeing optimal performance and longevity.
Identify… Read More
Join us on March 7th to hear about the latest updates and newest features in Ansys Icepak and Ansys Mechanical Thermal. Some new capabilities include breakthroughs that will be of considerable use to engineers involved in hardware design for Telecommunications, Consumer Electronics, A&D, and Automotive products.
TIME:
Ansys Thermal Desktop provides engineers with rapid heat transfer and thermal insight using numerical techniques to cater to applications involving conduction, thermal radiation, and flow challenges. Complementing the use of Ansys Fluent and Ansys Mechanical, Ansys Thermal Desktop provides an easy-to-use experience
March 25–29, 2024
At the DoubleTree by Hilton San Jose
2050 Gateway Place, San Jose, CA 95110, US, (855) 610-8733
SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic
SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from integrated circuits to facilities, fosters discussions between thermal engineers, professionals, and industry experts,
Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks
Date: Wednesday, October 18, 2023
Time: 10:00 AM Eastern Daylight Time
Duration: 45 minutes
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and
Date: Thursday, October 12, 2023
Time: 10:00am – 11:00am (PDT)
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages… Read More
