Batteries are everywhere from mobile phones to appliances to electric vehicles. Battery performance and safety are highly sensitive to temperature, making efficient thermal management systems critical. During this webinar we will explore the capabilities of Ansys in performing coupled electro-thermal simulations,
Free Webinar Series
The global demand for energy continues to increase and the diversity of sources is growing. Through the Altair Partner Alliance (APA), we are helping customers explore sustainable generation, achieve efficient distribution, maintain reliable power grids, and transform
Thermal Live™ is a new concept in education and networking in thermal management – a FREE 2-day online event for electronics and mechanical engineers to learn the latest in thermal management techniques and topics. Produced by Electronics Cooling® magazine, Thermal Live™ features webinars, whitepapers, and product demos,
An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
Time: 9:00am – 10:00am (PT)
Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and
We’ll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs.
TIME:
SEPTEMBER 21, 2022
9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET
About this
Welcome to ITherm 2022
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
May 31 – June 3, 2022
Sheraton Hotel & Marina San Diego, CA USA
(Co-Located with ECTC)
Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2022 is an international conference… Read More
Overview
Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.
Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More
