Using CFD and Thermal Simulation to Support the Development of Electric Vehicles

Using CFD and Thermal Simulation to Support the Development of Electric Vehicles
by Admin on 10-11-2022 at 12:00 am

Free Webinar Series | April – October 2022

For many companies, the journey to product electrification and sustainable e-mobility solutions require completely transforming well-established design practices, acquiring non-core domain expertise, and integrating new design software within incumbent tech stacks.

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Overcoming System-Level 3D-IC Electrical and Thermal Challenges

Overcoming System-Level 3D-IC Electrical and Thermal Challenges
by Admin on 04-06-2022 at 10:00 am

Overview

Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.

Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More


Overcoming System-Level 3D-IC Electrical and Thermal Challenges

Overcoming System-Level 3D-IC Electrical and Thermal Challenges
by Admin on 04-06-2022 at 12:00 am

Overview

Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.

Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More


Performing electronics thermal simulation directly within your CAD system

Performing electronics thermal simulation directly within your CAD system
by Admin on 08-11-2021 at 12:00 am

LIVE WEBINAR | AUGUST 11, 2021 | 11 AM EDT

Performing electronics thermal simulation directly within your CAD system

Most of today’s products include electronics that we can interface with and that control the device. As the use of electronics increases, design engineers are increasingly faced with challenges of thermal management… Read More


Spacecraft thermal control: leverage an integrated CAE and system simulation approach

Spacecraft thermal control: leverage an integrated CAE and system simulation approach
by Admin on 07-07-2021 at 12:00 am

LIVE WEBINAR | 07 JULY 2021 | TWO SESSIONS AVAILABLE

In today’s competitive context, telecommunications satellites must accommodate higher payload powers while reducing their mass, volume and cost. It leads to conflicting requirements, such as dissipating higher thermal loads with limited radiative surfaces.

One… Read More


Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
by Admin on 06-01-2021 at 12:00 am

Overview

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Takeaways:

  • Seamless
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Accuracy of In-Chip Monitoring for Thermal Guard-banding

Accuracy of In-Chip Monitoring for Thermal Guard-banding
by Daniel Payne on 01-28-2019 at 12:00 pm

I remember working at Intel and viewing my first SPICE netlist for a DRAM chip, because there was this temperature statement with a number after it, so being a new college graduate I asked lots of questions, like, “What is that temperature value?”

My co-worker answered, “Oh, that’s the estimated junction… Read More


Coupled Electro-thermal Analysis Essential for PowerMOS Design

Coupled Electro-thermal Analysis Essential for PowerMOS Design
by Tom Simon on 11-08-2018 at 12:00 pm

Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More


Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More