Power and Thermal Simulation in ESL Verification Flows

Power and Thermal Simulation in ESL Verification Flows
by Daniel Payne on 04-18-2014 at 8:11 pm

At the recent DVcon there was a keen focus on design verification and validation. Much of the attention is on Logic/circuit design verification, UVM, and IP verification. At the system level functional verification has improved to comprehend complex hardware and software interaction using Virtual Platforms/SystemC and Transaction… Read More


Power and Thermal Modeling Approach for Embedded and Automotive using ESL Tools

Power and Thermal Modeling Approach for Embedded and Automotive using ESL Tools
by Daniel Payne on 01-31-2014 at 7:04 pm

Did you know that an S-class Mercedes Benz can use 100 microprocessor-based electronic control units (ECUs) networking throughout the vehicle that run 20-100 million lines of code (Source: IEEE)?


2014 Mercedes-Benz CLA

Here’s a quick list of all the places that you will find software controlling hardware in an automobile:… Read More


Xilinx At 28nm: Keeping Power Down

Xilinx At 28nm: Keeping Power Down
by Paul McLellan on 09-08-2013 at 2:26 pm

Almost without exception these days, semiconductor products face strict power and thermal budgets. Of course there are many issues with dynamic power but one big area that has been getting increasingly problematic is static power. For various technical reasons we can no longer reduce the voltage as much as we would like from one… Read More


Qualcomm JEDEC Mobile Keynote: Memory Bandwidth and Thermal Limits

Qualcomm JEDEC Mobile Keynote: Memory Bandwidth and Thermal Limits
by Paul McLellan on 05-14-2013 at 4:37 pm

I went to some of the JEDEC mobile conference a couple of weeks ago. The opening keynote was by Richard Wietfeld of Qualcomm called The Need for Speed.

He emphasized that smartphones are really setting the pace these days in all things mobile and internet. Over 1/3 of access is on smartphones now. Over 4/5 of searches on smartphones… Read More


Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
by Paul McLellan on 12-16-2012 at 10:00 pm

Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.

On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More


Power, Signal, Thermal and EMI signoff

Power, Signal, Thermal and EMI signoff
by Paul McLellan on 08-28-2012 at 1:55 pm

Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More


3D Thermal Analysis

3D Thermal Analysis
by Paul McLellan on 07-17-2012 at 11:32 am

Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More


RedHawk: On to the Future

RedHawk: On to the Future
by Paul McLellan on 05-01-2012 at 6:00 am

For many, maybe most, big designs, Apache’s RedHawk is the signoff tool for analyzing issues around power: electromigration, power supply droop, noise, transients and so on. But the latest designs have some issues: they are enormous (so you can’t just analyze them naively any more than you can run a Spice simulation… Read More