Learn about the latest acquisition for the fluids product line: Ansys Thermal Desktop – a PC-based thermal and fluids analysis tool for multiple industry applications. Sign up for this upcoming webinar.
TIME:
SEPTEMBER 26TH, 2023
11 AM EDT / 5 PM CEST / 8:30 PM IST
Venue:
Virtual
Thermal Desktop is a widely used
Sign up for the second webinar of the Magnetics & Consumer Electronics Design series. Learn how Ansys Maxwell can impact EM performance due to permanent magnets used for coil alignment, predict core and AC losses to obtain thermal performance and generate a frequency-dependent RL matrix.
TIME:
SEPTEMBER 19, 2023
2PM EDT
Spacecraft experience thermal loading in orbit affects various systems onboard, including radios and associated antennas, which are a critical part of satellite operations. During this webinar, we’ll discuss the details of the Ansys solution and integration, focusing on Spacecraft Antenna Thermal Deformation.
TIME:
AUGUST
See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.
Whether the application is Automotive, 5G, Industrial, Energy, IoT, Medical, FA&D, or Consumer Goods, the chances are high that a printed circuit board will be involved. Increases in the electrification of modern systems will include electronic sensors, wireless connectivity, power conversion, or data handling system… Read More
Using Ansys Twin Builder and Fluent, Skydweller predicts their battery’s thermal behavior over various day missions. Don’t miss this upcoming webinar which covers data manipulation, meshing strategy and configuration models.
TIME:
APRIL 20, 2023
4:00 PM CEST/ 10 AM EDT
VENUE:
VIRTUAL
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping,
