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A Hardware IDE for VS Code Fans

A Hardware IDE for VS Code Fans
by Daniel Nenni on 11-22-2022 at 10:00 am

VS Code Remote SSH Article Diagram

A few times a year, I check in with AMIQ EDA co-founder Cristian Amitroaie to see what’s new with their company and the integrated development environment (IDE) market for hardware design and verification. Usually he suggests a topic for us to discuss, but this time I specifically wanted to learn more about the version of their Design and Verification Tools (DVT) IDE built on the Visual Studio Code (VS Code) platform. They announced this product earlier this year, and my colleague Kalar wrote about it in some detail.

Microsoft developed VS Code, a language-aware source code editor with a streamlined graphical user interface (GUI), and released the source code on GitHub in 2015. VS Code is customizable for language support, editor theme, keyboard shortcuts, user preferences, and more. Because of its flexibility and availability, a broad ecosystem of extensions and themes is available. It is not surprising that hardware design and verification engineers would want support for their languages in an IDE based on VS Code.

I asked Cristian why they felt the need to develop DVT IDE for VS Code when they’ve already had the very successful DVT Eclipse IDE since 2008. AMIQ EDA pretty much invented the whole concept of hardware IDEs, and they have lots of happy users, several of whom I have interviewed in past blog posts. DVT Eclipse IDE is based on the Eclipse Platform, which is also very popular, widely adopted, and supported by a wide range of plugins. I wondered whether there is some deficiency in Eclipse that caused them to add support for VS Code.

Cristian explained that it all comes down to user preference. There is a generation of engineers who have had exposure to other IDEs based on VS Code and are familiar with its look and feel. There are many other engineers who know Eclipse better and have no interest in switching. As the industry’s leader in hardware IDEs, Cristian and his team felt that it made perfect sense to support both underlying platforms. Users are free to mix and match however they want, at no extra cost.

In my long experience in the industry, I have seen that both hardware and software engineers are reluctant to switch GUIs or editors. I am old enough to remember when we did most of our work using plain-text editors in full-screen mode on ASCII terminals. There were two primary choices: vi and Emacs. Users were surprisingly passionate about which they preferred, to such an extent that observers often referred to the “religion” of Emacs or vi. Perhaps the strong feelings about Eclipse and VS Code are just a new manifestation of an old feud.

Cristian said they are seeing lots of interest in DVT IDE for VS Code, as expected, but that they are not observing any significant migration of DVT Eclipse IDE users. Engineers sometimes try the other version out of curiosity, especially since it’s easy to do so using the same project settings and scripts.  However, for the most part they prefer either VS Code or Eclipse and they choose their hardware IDE accordingly.  AMIQ EDA is happy to support both.

I wondered whether there were any technical reasons to choose one version of DVT IDE over the other. Cristian said that they have worked very hard to make the two implementations as equivalent in functionality as possible. They have a common engine behind both interfaces to ensure consistency in code compilation and analysis. However, there are some differences in the user experience due to the different technologies used by the underlying platforms.

I found this intriguing, and asked Cristian for some examples. He said that Eclipse has better support for dedicated views of the code, such as hierarchy browsers and schematics. Eclipse also provides a way to show “breadcrumbs” as the user traverses the design and verification hierarchy. This makes it easy to know the location in the hierarchy of the file being edited and to navigate to another location. These actions are possible in VS Code, but in a less intuitive way.

Cristian then made a deep dive into a capability that works much better in VS Code than in Eclipse: the ability to open a secure shell (SSH) to a remote machine from within the IDE. Users can connect over Remote SSH from their laptop or desktop, for example a Windows PC or Apple, to a workstation  at the office. They can remotely browse folders, edit files, save results, etc. as if the files were local. This provides better performance than running an interactive GUI over a virtual network computing (VNC) connection.

The VS Code Remote SSH capability also supports the use of remote machines for compiling and analyzing the source code. Users can spawn a process on a dedicated machine, on a server farm, or in the cloud. This allows the use of inexpensive desktops without the computational power and memory needed for high performance on large designs. Users can also open a terminal to a remote machine to run simulations and other tasks. Again, the performance is better than with a VNC and the users feel as if they are doing everything locally.

Cristian closed our conversation by reminding me that AMIQ EDA is all about user choice. They support an incredible range of language and format standards, including SystemVerilog, Verilog, Verilog-AMS, VHDL, e, Property Specification Language (PSL), Portable Stimulus Standard (PSS), Unified Power Format (UPF), and the Universal Verification Methodology (UVM). Offering their DVT IDE based on either Eclipse or VS Code is the next logical step in their openness.

Also Read:

Using an IDE to Accelerate Hardware Language Learning

AMIQ EDA Adds Support for Visual Studio Code to DVT IDE Family

Automated Documentation of Space-Borne FPGA Designs


Calibre: Early Design LVS and ERC Checking gets Interesting

Calibre: Early Design LVS and ERC Checking gets Interesting
by Peter Bennet on 11-22-2022 at 6:00 am

fig1

The last thing you want when taping out a design is to hit large numbers of violations in signoff checks that could have been flushed out and resolved in earlier flow iterations. For implementation flows (floorplanning, synthesis, place and route), it’s usual to do a lot of flow flushing work early in the design cycle and iteratively refine the design, constraints and flow settings to target a minimum TAT (turnaround time) pass through the final layout.

We need that same more iterative and interactive model for the signoff physical verification that has traditionally been done in batch mode on final designs. Increasing design and technology complexity are only making the circuit and physical verification tasks more challenging and time consuming. Design schedules and the need to work with designs with blocks in different design states force us to “shift left” more checks earlier in the design cycle.

While many layout-versus-schematic (LVS) circuit verification checks can be run earlier, running a full signoff set takes too long and includes thousands of transitory errors that will disappear in the final design and don’t need fixing – the run and debug time is excessive.

Siemens recognised the need for faster LVS iterations on dirty designs and identified the high impact errors that need cleaning in the early design stages. This led them to create Calibre nmLVS Recon (“Recon” is short for design reconnaissance here), initially supporting short isolation checks. That’s now been extended to support more checks.

A new Siemens EDA white paper describes how Calibre’s nmLVS Recon tool lets you target ERC and soft connection checks on incomplete and dirty designs while improving verification productivity and TAT.

Figure 1 shows this new functionality:

This is a tool usage model that supports early stage design LVS and allows engineers to focus on the core of real and high impact design errors in the earlier design stages while avoiding trying to fix the thousands of transitory errors that will disappear as the design matures – avoidable engineering analysis and fixing time must not become the bottleneck.

The focus is on fast TAT for the targeted checks: runs can be started off existing LVS DBs and focused on only the required checks, giving dramatically faster LVS iterations on dirty designs.

Rule file execution with selective device for path checking (pathchk) for ERC checks speeds up what can be a slow step for partially completed designs, while Enhanced LVS path-finding capability and debugging accelerates problem diagnosis and fixing. Starting ERC runs from previously generated LVS DBs means already completed steps need not be re-run and gives an efficient, incremental flow. Path isolation and enhanced reporting eliminate manual ERC debug steps.

Figure 2 shows the improvement in TAT possible when running standalone ERC checks from a reused DB:

Soft connection checks are supported with the Calibre nmLVS Recon Softchk function with interactive debugging and improved debug to eliminate some previously manual steps. Rule decks can now be partitioned by layers of interest to save run time and memory and by layer groups for parallel processing. Again, we can reuse LVS databases from earlier LVS, extraction or Softchk runs to get faster incremental runs and skipping already completed checks like connectivity. The paper also notes that DB reuse could also be used in signoff to re-run only a single check.

Debug productivity is critical here and Calibre’s RVE debug interface (there’s a White Paper for this too) provides both interactive layout edits and fixes and immediate verification (Figure 5).

These new additions to Calibre nmLVS Recon usefully extend the range of early stage design LVS checking and Siemens continues to identify more of what it calls such “easy button” functionality so more verification can be run as early and efficiently as possible.

Find out more in the original white paper here:

Achieve dramatic productivity and turnaround time improvements in early design electrical rule checking

https://resources.sw.siemens.com/en-US/white-paper-achieve-dramatic-productivity-and-turnaround-time-improvements-in-early

[also earlier White Papers on Calibre nmLVS Recon]

Accelerate time to market with Calibre nmLVS-Recon technology: A new paradigm for circuit verification
https://resources.sw.siemens.com/en-US/white-paper-accelerate-time-to-market-with-calibre-nmlvs-recon-technology-a-new-paradigm

Increase LVS verification productivity in early design cycles
https://resources.sw.siemens.com/en-US/white-paper-increase-lvs-verification-productivity-in-early-design-cycles

Siemens also has an interesting YouTube channel for Calibre:

https://www.youtube.com/user/ICNanometerDesign/featured?app=desktop

Also Read:

Architectural Planning of 3D IC

Pushing Acceleration to the Edge

Why Use PADS Professional Premium for Electronic Design


Podcast EP124: A Look at the Design and Simulation Side of Keysight with Niels Faché

Podcast EP124: A Look at the Design and Simulation Side of Keysight with Niels Faché
by Daniel Nenni on 11-21-2022 at 10:00 am

Dan is joined by Niels Faché, vice president and general manager, Design and Simulation at Keysight Technologies. Niels is responsible for Keysight’s design and simulation portfolio.

Dan explores the high-speed, high-frequency design and simulation capabilities of Keysight Technologies with Niels. A history of the products, markets served, the open architecture used, ecosystem relationships and how this business and the test and measurement business at Keysight work together are all discussed.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


AMAT – Backlog buffers downcycle- still fighting shortages – WFE down in 2023

AMAT – Backlog buffers downcycle- still fighting shortages – WFE down in 2023
by Robert Maire on 11-21-2022 at 6:00 am

Applied Materials

-AMAT put up good numbers despite slowing cycle
-Growing backlog will help them manage declining orders
-Parts shortages still haunt but improving for 2-4 more quarters
-2023 will be down- too early to tell how much- 2024 who knows

Good numbers but already adjusted for China

Applied put up revenue of $6.7B and EPS of $2.03 versus already lowered estimates on a pre-announcement of $6.45B and $1.73EPS. Guidance is for $6.7B +-$400M and EPS of $1.93 +- $0.18 versus current street estimates of $6.45B and $1.83. So guide is somewhat flattish and likely dependent upon how many parts they can get so they can start to use up the backlog.

China negative hit of $2.5B next year hoping to mitigate

Applied has an initial estimate of a $2.5B revenue hot to 2023 from the China restrictions. They think they can work that down to $1.5B to $2.0B through licensing and help from customers. Its clearly too early to tell how quickly licenses will come from the US government and how many they will grant.

Management won’t estimate 2023 revenue other than down

Management didn’t want to offer up an estimate of how far down WFE is likely to fall in 2023. Our guess is that there are far too many moving parts and unknowns to come up with even an educated guess other than to say its obviously going to be down but no guess as to how far. Management also seemed to demur of whether 2024 will be up or down…. its just unclear. Others we have heard from and spoken to seem to be talking about 20% down in 2023 but we think that’s a best guess at this point.

Memory obviously much weaker than foundry logic

Its no surprise give Microns recent announcement for worsening business that memory is way worse than foundry/logic. Sounds like foundry/logic may be flattish to slightly up while memory is almost solely responsible for all the downturn. We haven’t heard a lot from the other memory makers but that is likely another shoe to drop on worsening memory spend.

Still supply limited by parts shortages

Applied’s backlog continues to grow as they are still having issues getting enough parts to get tools out the door. Management suggested we may see another 2 to 4 quarters of parts issues before we get back to a more normalized environment. Applied has clearly been one of the harder hit with parts shortages as we believe their prior relationships with suppliers was more adversarial. It does sound like progress is being made but obviously not fast enough.

Service business helps even more

Applied service business continues to help smooth revenue out as the more steady business continues to grow with the number of tools in the field.
While an increasing contributor it still can’t make up for memory’s down cycle.

The stocks

The stock of Applied will obviously bounce as it could have been worse but wasn’t. Investors have forgotten already that the results are measured against a pre-announcement and already reduced estimates so its pretty easy to meet them as the estimates were only recently announced. All this still doesn’t change the fact that there is a whole year of downside in front of us and numbers will certainly have more to come down. Applied is in good shape relative to Lam given a smaller memory mix but far from as immune as ASML is with is infinite backlog.

We still see no good reasons to go out and buy the stock as it will tread water within a range depending on which way the wind blows that day. We need to wait until we see at least some formation of a bottom. Right now we continue to stare into a great unknown.

About Semiconductor Advisors LLC‌

Semiconductor Advisors is an RIA (a Registered Investment Advisor),
specializing in technology companies with particular emphasis on semiconductor and semiconductor equipment companies. We have been covering the space longer and been involved with more transactions than any other financial professional in the space. We provide research, consulting and advisory services on strategic and financial matters to both industry participants as well as investors. We offer expert, intelligent, balanced research and advice. Our opinions are very direct and honest and offer an unbiased view as compared to other sources.

Also read:

KLAC- Strong QTR and Guide but Backlog mutes China and Economic Impact

LRCX down from here – 2023 down more than 20% due to China and Downcycle

Is ASML Immune from China Impact?


Semiconductors Down in 2nd Half 2022

Semiconductors Down in 2nd Half 2022
by Bill Jewell on 11-20-2022 at 4:00 pm

Top Semiconductor Revenue 2H 2022

The semiconductor market declined 6.3% in 3Q 2022 from 2Q 2022, according to WSTS. Based on the outlook for 4Q 2022, the second half of 2022 will be down over 10% from the first half of 2022. The 2H 2022 decline will be the largest half-year decline since a 21% drop in the first half of 2009 versus the second half of 2008 during the great recession.

The revenue change of the top semiconductor companies in 3Q 2022 versus 2Q 2022 was mixed. Nine of the fifteen companies reported (or guided) a revenue increase in 3Q 2022, with the highest from Infineon at 15% and STMicroelectronics at 13%. Six of the companies reported a revenue decline, with the worst declines of 19% to 23% from memory companies Samsung, SK Hynix, and Micron Technology. The 3Q 2022 revenue declines in memory dropped the ranking of SK Hynix from 3 to 5 and dropped Micron Technology from 5 to 6. Samsung managed to maintain the number 1 ranking over Intel. Qualcomm moved up to number 3 and Broadcom became number 4.

The revenue outlook for 4Q 2022 is generally bleak, especially for memory. Micron Technology’s guidance was a 36% decline in 4Q 2022 from 3Q 2022. Micron plans to reduce its wafer starts by about 20%. Kioxia plans to cut its wafer starts by about 30%. Samsung and SK Hynix did not give specific revenue guidance, but both cited weak demand and inventory adjustments as factors impacting revenue in the current quarter. Among non-memory companies, Qualcomm, Texas Instruments and MediaTek all expect double-digit revenue drops in 4Q 2022. Weak overall demand and inventory adjustments by customers were blamed for the grim outlook by most companies. Automotive seems to be the only healthy segment. Texas Instruments, STMicroelectronics, Infineon and NXP all stated growth in growth in the automotive sector is largely or partially offsetting declines in other sectors. Of the ten companies providing guidance for 4Q 2022, only Nvidia (+1.2%) and STMicroelectronics (+1.8%) are expecting increased revenues. The weighted average revenue change from the nine non-memory companies providing guidance is a 9% decline in 4Q 2022 from 3Q 2022.

The weakness in the key end markets of PCs and smartphones is apparent from the 3Q 2022 shipment estimates from IDC. PCs were down 15% from a year ago and smartphones were down 9.7%. Before the 3Q 2022 data was available, IDC was expecting year 2022 shipments of PCs to decline 12.8% and smartphones to decline 6.5%. Based on the latest shipment data, we at Semiconductor Intelligence are now forecasting a 15% decline in PCs and a 10% decline in smartphones for year 2022.

With the 6.3% semiconductor market decline in 3Q 2022 and the gloomy outlook for 4Q 2022, only forecasts done after the 3Q 2022 WSTS data release are relevant. November forecasts for 2022 are 8.1% from the Cowan LRA Model, 3% from IC Insights and 1.5% from us at Semiconductor Intelligence. 2023 will certainly see a decline in the semiconductor market. IC Insights is projecting a 6% drop while we at Semiconductor Intelligence project a 14% decline. Interestingly, back in August, Future Horizons forecast a 22% decline in 2023. The WSTS committee met last week for its fall forecast which should be released within the next two weeks. It will be interesting to see how much it changes from the WSTS August forecast update of 13.9% growth in 2023 and 4.6% growth in 2023.

Our Semiconductor Intelligence forecast for a 14% decline in 2023 would be the largest drop in the semiconductor market since a 32% decline in 2001, 21 years ago. In the last 50 years, the market has seen double digit declines in only three years: 1975, 1985 and 2001. Our 2023 forecast is based on the following assumptions:

Inventory corrections are resolved over the next two to three quarters

PCs and smartphones return to pre-pandemic trends by mid-2023

No global recession in 2022 or 2023

If any of the above assumptions fail to materialize, the semiconductor downturn could continue throughout the quarters of 2023 and result in an annual decline of over 20%.

Semiconductor Intelligence is a consulting firm providing market analysis, market insights and company analysis for anyone involved in the semiconductor industry – manufacturers, designers, foundries, suppliers, users or investors. Please contact me if you would like further information.

Also Read:

Continued Electronics Decline

Semiconductor Decline in 2023

Automotive Semiconductor Shortage Over?


Podcast EP123: The Breadth and Power of Ceva’s IP and Platforms

Podcast EP123: The Breadth and Power of Ceva’s IP and Platforms
by Daniel Nenni on 11-18-2022 at 10:00 am

Dan is joined by Nir Shapira, business development director in CEVA Mobile Broadband BU. Nir has been in the communication industry for more than 25 years. He has made significant contributions to standardizations, notably 802.11, and has dozens of patents in the field of communications.

Nir discusses the impact Ceva IP and associated platforms are having on the development of advanced technologies such as 5G RAN. Several development scenarios utilizing Ceva products are discussed in detail.

Learn more about CEVA’s solutions: www.ceva-dsp.com

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


2023: Welcome to the Danger Zone

2023: Welcome to the Danger Zone
by Daniel Nenni on 11-18-2022 at 6:00 am

Silicon Catalyst Danger Zone Ad

I just got this notice from my good friend and fellow sailor Rich Curtin. The Silicon Catalyst events are the best open networking events in Silicon Valley, absolutely. And this one includes another good friend Wally Rhines, the most interesting man in semiconductors, so you don’t want to miss this. The live event will definitely fill up but there will be a follow-on virtual event so register now.

Silicon Catalyst is pleased to continue our collaboration with Silicon Valley Bank in hosting our 5th Annual Semiconductor Industry Forum, returning to an in-person event on December 6 at their auditorium in Santa Clara.

The Silicon Catalyst Semiconductor Industry Forum was launched in 2018, hosted at the TSMC Silicon Valley headquarters. The Forum’s charter is to enable a town-hall like event to discuss the broad impact of semiconductors on our world, beyond the traditional focus on technology and financial reviews and forecasts.

The topics discussed during that inaugural 2018 event covered the cost of fabs, IoT business opportunities, memory technology and foreshadowed the gathering storm clouds about the potential impact of China’s activities in the semiconductor sector. Clearly, the key take-away was that the semiconductor industry was on the verge of major structural changes.

Looking back now as we close out 2022, wow, was that an understatement!

For a re-cap of the 2018 Forum, check out the IEEE Spectrum coverage at https://spectrum.ieee.org/semiconductor-industry-veterans-see-the-old-order-crumbling.

Zoom recordings of Forum 3 2020 and Forum 4 2021 are available for replay from our website.

Forum 5 – “2023: Welcome to the Danger Zone”

The coming year is shaping up as the perfect storm for our industry, as we look to adapt to the unprecedented challenges to be addressed across our businesses, along with our personal and national security. We’ve arranged a stellar panel of speakers, moderated by Don Clark, contributing journalist for the NY Times for our Forum 5 event.

Silicon Catalyst CEO, Pete Rodriguez, will kick things off with an insider’s view of his participation on the PCAST Semiconductor Working Group and the creation of the report to the President. For background information about the PCAST Group, I encourage you to read the details at:

https://www.whitehouse.gov/wp-content/uploads/2022/08/POTUS-letter_PCAST-Semiconductors_09AUG2022.pdf

https://www.whitehouse.gov/wp-content/uploads/2022/09/PCAST_Semiconductors-Report_Sep2022.pdf

https://www.nist.gov/chips/national-semiconductor-technology-center-update-community

The Forum 5 panel will discuss potential strategies and tactics to help us navigate through the danger zone and includes:

Navin Chaddha – Managing Director, Mayfield Fund

Navin is Managing Director at Mayfield. He has been named a Young Global Leader by the World Economic Forum and has ranked on the Forbes Midas List of Top 100 Tech Investors fourteen times, including being named in the Top Five in 2020 and 2022. His investments have created over $120 billion in equity value and over 40,000 jobs. During his venture capital career, Navin has invested in over 60 companies, of which 18 have gone public and 25 have been acquired. He believes the Renaissance of Silicon will create industry giants and has invested in semiconductor companies including Nuvia, Fungible, Alif Semiconductor, Frore Systems, and several others in stealth. As an entrepreneur, Navin has co-founded or led three startups, of which one went public and 2 were acquired. Navin holds an MS degree in electrical engineering from Stanford University and a B.Tech. degree in electrical engineering from IIT Delhi, where he was honored with a distinguished IIT Alumni Award.

Dr. Wally Rhines, President & CEO of Cornami;  GSA 2021 Morris Chang Exemplary Leadership award recipient

Dr. Rhines is President and CEO of Cornami, Inc., a fabless software/semiconductor company focused on intelligent computing for fully homomorphic encryption and machine learning. He was previously CEO of Mentor Graphics for 25 years and Chairman of the Board for 17 years. During his tenure at Mentor, revenue nearly quadrupled and market value of the company increased 10X. Prior to joining Mentor Graphics, Dr. Rhines was Executive Vice President, Semiconductor Group, responsible for TI’s worldwide semiconductor business. Dr. Rhines has served on the boards of Cirrus Logic, QORVO, TriQuint Semiconductor, Global Logic, PTK Corp. and as Chairman of the Electronic Design Automation Consortium (five two-year terms). He is a Lifetime Fellow of the IEEE. Additionally, his experience includes four years on the board of SEMATECH, three years on the board of SEMI-SEMATECH and twenty years on the board of SRC (Semiconductor Research Corporation). Dr. Rhines holds a Bachelor of Science degree in engineering from the University of Michigan, a Master of Science and PhD in materials science and engineering from Stanford University, an MBA from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.

Maryam Rofougaran – CEO and Founder, Movandi

Maryam Rofougaran is founder and CEO of Movandi, a leader in new 5G RF and millimeter wave technology that is commercializing multi-gigabit, 5G millimeter wave networks. Movandi is breaking through coverage and network challenges of 5G millimeter wave networks. Their BeamXR active repeater and system solutions solves today’s real world 5G deployment challenges – by increasing 5G coverage and capacity, while reducing infrastructure costs by 50%, accelerating large-scale 5G commercialization. Prior to co-founding Movandi, Maryam was the Sr Vice president of Radio Engineering at Broadcom and was instrumental in starting and building the wireless business at Broadcom and in growing it to annual revenues of more than $3 billion. She is an Inventor and co-inventor on 300 U.S. issued patents, 85 U.S. filed patents and is co-author to many publications. Her first startup, Innovent Systems was acquired by Broadcom Corporation and was the entrance of Broadcom in wireless business.

All Forum 5 registrants will be able to summit questions to the panelists in advance, for potential discussion during the Q&A portions of Forum 5.

Registration details can be found at:

https://www.eventbrite.com/e/5th-semi-industry-forum-2023-welcome-to-the-danger-zone-tickets-453034838397

Also Read:

Silicon Catalyst Angels Turns Three – The Remarkable Backstory of This Semiconductor Focused Investment Group

Silicon Catalyst Fuels Worldwide Semiconductor Innovation

Silicon Catalyst Hosts an All-Star Panel December 8th to Discuss What Happens Next?


Ask Not How FPGA Prototyping Differs From Emulation – Ask How FPGA Prototyping and Emulation Can Benefit You

Ask Not How FPGA Prototyping Differs From Emulation – Ask How FPGA Prototyping and Emulation Can Benefit You
by Daniel Nenni on 11-17-2022 at 10:00 am

Figure 1 Proto vs. Emu Dan 161122

The differences between commercial FPGA Prototyping (“Prototyping”) and Emulation have been well documented by the purveyors of commercial Prototyping and Emulation solutions, and the technical media.  What has received less coverage is how Prototyping benefits differ from Emulation benefits.  Both are intended to reduce the time and resources required to achieve comprehensive verification of chip-based electronic systems – both run much faster than software simulation for verification, in a modeled context of the end-product executing software, with high internal design-node visibility during operation.

Both are forms of hardware-accelerated simulation that originated, in part, out of Intel’s desperate attempt in the mid-1980’s to cope with the skyrocketing engineering resource requirements projected for future processor chip design complexity.  Both deliver their greatest value when they are used to enable early hardware/software co-development that shifts-left development schedules by months vs. sequential hardware/software development.  In fact, it was the risk of being late to market that motivated many early product developers to invest millions of dollars in Emulation to manage the time-to-market risks.  At the time, it was proposed that a chip-based product with an expected lifetime revenue of say $50M, and a product lifetime of say 3 years, would suffer $8M of lost revenue if market entry was delayed by 2 months – and an equation was proposed for modeling the lost revenue.

Figure 1: Lost Revenue Due to Delayed Time-To-Market

Prototyping vs. Emulation Spider Chart

One way to visualize the difference between Prototyping and Emulation is with a “spider chart” (named for its resemblance to a spider’s web).  The Prototyping vs. Emulation spider chart below highlights the differences between these two verification methods, which may be distilled down to runtime speed, design capacity, and affordability – all other differences, sometimes not insignificant, are “artifacts” of these three fundamental differences.  Compilation speed is a function of design capacity – the larger the design the longer the compilation time.  Any verification platform can be connected in-circuit to a hardware target-system with the appropriate interface speed-buffers, but the verification runtime speed is limited by the verification platform – Emulation runtime speed is much faster than software simulation, and achievable Prototyping runtime speeds are much higher than achievable Emulation runtime speeds.

Likewise, any verification platform can be used for software debug for periods of software execution – and the higher runtime speeds of Prototyping enable much longer periods of software execution, therefor are capable of more comprehensive software debug sessions which are usually sufficient for earlier software development.  And debug visibility could include every internal design node in a Prototype or an Emulator – but each design node debug probe requires another internal interconnect wire connection in FPGA-based Prototyping and Emulation implementations, which impacts design capacity and runtime speed.

Finally, reusability is a function of how unique the Prototyping or Emulation platform needs to be to achieve the desired verification design capacity, runtime speed, and in-circuit operation goals – the more “bespoke” the platform is to fit the specific verification requirements, the less reusable the platform will be.  The underlying Prototyping or Emulation hardware itself is highly reusable, but the design compilations, internal IP block adaptations, and target-system “external” connections will have limited reusability for the next design and design context – unless the next design is a close derivation of the previous design where much of the verification platform does not need to change and can be reused.

Figure 2: FPGA Prototyping vs. Emulation

You’ve Come a Long Way Baby

Early commercial Emulators (circa 1990’s) were not even as capable as today’s commercial Prototyping solutions, and what was referred to as “prototyping” in those days was still the domain of adventurous do-it-yourself FPGA-jockeys.  Today’s Emulators have evolved to buttoned-up, “big-iron” solutions that appear to be special-purpose simulation hardware-accelerators, implemented with commercial FPGAs or custom silicon, that have traded performance for improved deployment time/effort.  Today’s Emulators also come with restrictive methodologies tailored to specific Emulation hardware implementations that enable design deployment to be more automatic, more predictable, with high design internal-node visibility – and for this automation and more predictable deployment, users are willing to sacrifice “some” runtime speed.

Modern Emulators tend to focus on providing highly automated and versatile verification – support for multiple programming languages, high design under test (“DUT”) model capacity (1 billion gate equivalent, and more), high levels of bring-up automation (a few weeks) that minimizes manual intervention, support for multiple verification modes such as transaction-based acceleration (“TBA”), in-circuit emulation (“ICE”), and Quick Emulator (“QEMU”) mode, targeting multiple usage scenarios for system-level functional verification of chip and IP designs and embedded software verification.

Prototyping, on the other hand, is more affordable, and is capable of much faster runtime speeds than Emulation – so Prototyping may be a better choice than Emulation for certain verification environments.  If a “personal verification platform” is preferred – desktop design tools, geographically dispersed development sites, etc. – the affordability of Prototyping makes it practical for each developer to have a personal verification platform.  Prototyping also enables developers to ship a verification platform to customers prior to the availability of the silicon under development.

Rapid advances in single-package FPGA logic capacity (usable gate density) and performance have encouraged more chip developers to consider Prototyping as an essential part of their verification strategy, especially if the entire design can be made to “fit” into a single FPGA.  Today’s leading-edge FPGAs (Xilinx Virtex UltraScale+ VU19P, and Intel Stratix GX 10M) have usable logic capacities of up to about 50 million equivalent ASIC gates per FPGA.

Figure 3: Intel Stratix GX 10M (10.2M Logic Elements) and Xilinx VU19P FPGAs (3.8M System Logic Cells)

If the entire design to be Prototyped can be fit into a single FPGA, many of the Prototype deployment challenges, and the runtime speed limitations of inter-FPGA interconnect, can be avoided.  Once the design spills over into multiple FPGAs, the design must be partitioned into blocks for each FPGA, the multi-FPGA timing must be assured, and the inter-FPGA signals must be connected with high-performance cables between the FPGAs.  Unfortunately, the I/O pin counts of the leading commercial FPGAs have not increased as fast as the FPGA logic capacities – I/O pin counts are still limited to a couple thousand inter-connections, and multi-million gate logic partitioned blocks often require 10’s of thousands of block-block inter-connections.  Fortunately, requirements for more inter-FPGA interconnect is not insurmountable for Prototyping projects because of the availability of leading-edge pin-multiplexing automation that can be applied to create “virtual” FPGA I/O inter-connection pins, but this solution comes at a cost of lower runtime speeds.

So, How Can Prototyping and Emulation Benefit You?

To summarize, FPGA Prototyping today is generally more affordable than Emulation, it can achieve much higher runtime speeds, and design capacity has been greatly expanded by today’s leading-edge FPGA technology.  Emulation, on the other hand comes with a higher cost of ownership, higher automation of deployment, and provides more simulation-like verification for design debug.  In fact, if you can afford both Prototyping and Emulation, debug with Prototyping is usually limited to identifying and isolating design hardware/software problems over long periods of design operation which are then reproduced in Emulation for detailed debug.  It is recommended that you be clear at project outset about your verification goals (what is sufficient to approve sign-off, etc.?), your verification priorities (e.g. runtime speed vs. design visibility vs. deployment time, etc.), the skill-set of your design team with respect to getting the best value from Prototyping and/or Emulation platforms, a quick ROI calculation for your verification tool investment – and then budget accordingly.  Only then should you proceed with a choice and deployment of FPGA Prototyping and/or Emulation.

S2C Can Help

S2C is a leading global supplier of FPGA prototyping solutions for today’s innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 500 customers, including 6 of the world’s top 15 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customer’s SoC and ASIC verification needs. S2C has offices and sales representatives in the US, Europe, mainland China, Hong Kong, Korea and Japan. Visit S2C’s website at s2ceda.com for more details.

Also Read:

A faster prototyping device-under-test connection

Stand-Out Veteran Provider of FPGA Prototyping Solutions at #59DAC

Multi-FPGA Prototyping Software – Never Enough of a Good Thing


It’s Always About the Yield

It’s Always About the Yield
by Kalar Rajendiran on 11-17-2022 at 6:00 am

yieldHUB Box Plot

Whether it is the stock market or the semiconductor market, the name of the game is yield. In semiconductors, yield has to do with minimizing scrap costs in all phases of manufacturing. This means squeezing as many good dies from a wafer as well as maximizing the number of good assembled/packaged chips that pass system level testing. Naturally, the field of semiconductor yield management is a well-established space with a number of solutions offered by various vendors. One such vendor, solely focused on yield management and enhancement is yieldHUB. It is one thing for a vendor to tout their wares but when customers tout a vendor’s platform, it raises more attention.

A couple of customers recently shared with yieldHUB, detailed feedback about their experience with yieldHub’s platform. One of them is Infineon, a multi-national semiconductor technology company that develops products for commercial, industrial, automotive, aerospace and defense applications. Their products include high-performance memories, micro-controllers, energy efficient and intelligent power modules, sensors, charging devices, lighting, audio, connectivity and hardware-based security devices. The other customer is Clas-SiC Wafer Fab Ltd, the first open foundry to develop and prototype silicon carbide (SiC) diode and MOSFET devices. The use cases from these two customers is bound to face as many of the yield management challenges there are.

Infineon’s Feedback:

Charbel Abi Samra Product Engineering Manager at Infineon and a long-time yieldHUB user provides the following feedback.

yieldHUB as an all-in-one platform eliminates the need for use of various point tools to get the same results. With yieldHUB, problems can be quickly identified and solved by searching its database and analyzing in just a few clicks. The earlier solution that Infineon used to use for yield management wasn’t efficient. Engineers had to jump back and forth between the query program, analysis program and data management in-between. As an example, on a customer request to tighten a limit, the analysis was done in less than 2 minutes with yieldHUB. Using the earlier solution, it would have taken two hours to locate the data and plot it.

yieldHUB’s custom reporting tools allow Infineon to reduce customer returns and field failures. Another yieldHUB tool increases our customers’ satisfaction levels by simplifying the test data sent to them in a consolidated fashion as one file. Another valuable feature in yieldHUB that product engineers will greatly appreciate is creating box plots and grouping multiple lots together. This feature allows the engineers to review the product’s history and the failure pareto.

Clas-SiC Wafer Fab Ltd’s Feedback:

Clas-SiC Wafer Fab Ltd manufactures SiC wafers through Junction Barrier Schottky (JBS) diode [also known as Merged PN Schottky (MPS) diode] and MOSFET process flows. The amount of data that needs to be analyzed to make sure everything is functioning properly is more than Excel can handle time efficiently. We needed a yield management platform to enable us to meet our customers’ functional requirements as well as turnaround time requirements. Clas-SiC needed a solution that provides for a quick graphical representation of the analytical results in a format easy to convey to our customers.

yieldHUB onboarding is very fast and straightforward. According to Graeme Morland, Clas-SiC Manufacturing Excellence Engineering and Quality Manager, Clas-SiC was online the very next day after yieldHUB was installed. Rae Hyndman, Clas-SiC Managing Director says the speed at which yieldHUB’s wafer yield analysis software integrated with Clas-SiC’s test system’s results was remarkable.

What used to take a couple of hours of an engineer’s time now takes just a couple of minutes when using yieldHUB. The yieldHUB platform has certainly fast tracked things for Clas-SiC. While it usually takes four to eight weeks to make a customer’s product, yieldHUB has helped get the information to the end-customers faster on several occasions.

Summary

yieldHUB makes the task of yield management, data analysis and reporting easier, effective and efficient. Anyone tasked with the responsibility of ensuring product performance and yields of semiconductor products could benefit from using the yieldHUB platform.

To gain more insight into yieldHub’s products and services, visit yieldHub website.

Also Read:

The Six Signs That You Need a Yield Management System

yieldHUB – Helping Semiconductor Companies be More Competitive

yieldHUB – A Yield Management Checklist for Startups and a New Look


Podcast EP122: IMEC’s Unique Imaging Technology for Medical Apllications

Podcast EP122: IMEC’s Unique Imaging Technology for Medical Apllications
by Daniel Nenni on 11-16-2022 at 10:00 am

Dan is joined by Dr. Xavier Rottenberg, who has been at IMEC Leuven since 2000, where he contributes to research in the field of RF, RF-MEMS, photonics and microsystems modelling integration.

Dan explores some of the unique imaging technology being developed at IMEC. Manufacturing methods to implement large sensors cost effectively are explored, as well as a varied set of applications for these sensor arrays.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.