Top Ten #53DAC Highlights

Top Ten #53DAC Highlights
by Tom Dillinger on 06-13-2016 at 12:00 pm

Here is a very subjective list of the Top 10 logistical and technical highlights from DAC’53.

(10) With DAC attendance down from its peak days, the Austin Convention Center served as an excellent venue. There was good participation from companies with design centers in the “Silicon Hills”. And, I saw colleagues from Silicon Valley,… Read More


iDRM – A Complete Design Rule Development System

iDRM – A Complete Design Rule Development System
by Daniel Nenni on 06-02-2016 at 12:00 pm

Design rules are at the heart of the interface between the foundry and semiconductor designers, which makes them so critical. Traditionally, design rules and DRC decks have been developed manually with no or little automation. Design rule definitions are written using WORD or other general purpose office tools, and DRC decks… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More


What Does an MPW and a Pizza Have in Common?

What Does an MPW and a Pizza Have in Common?
by Daniel Nenni on 05-23-2016 at 12:00 pm

Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More


"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis

"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis
by Tom Dillinger on 05-23-2016 at 7:00 am

A common SoC design methodology in current use starts with preparation of the physical floorplan — e.g., block/pin placement, global clock domain and bus signal planning, developing the global/local power distribution (and dynamic power domain management techniques). Decoupling capacitor estimated densities and… Read More


Stop FinFET Design Variation @ #53DAC and get a free book!

Stop FinFET Design Variation @ #53DAC and get a free book!
by Daniel Nenni on 05-20-2016 at 7:00 am

If you plan on visiting Solido (the world leader in EDA software for variation-aware design of integrated circuits) at the Design Automation Conference next month for a demonstration of Variation Designer, register online now and get an autographed copy of “Mobile Unleashed”. Such a deal!

Solido Variation Designer is used by… Read More


The ASIC Business Model is Critical for the DIY and Maker Movements!

The ASIC Business Model is Critical for the DIY and Maker Movements!
by Daniel Nenni on 05-17-2016 at 12:00 pm

If you look back at the beginning of the ASIC business you will see that it was really a critical time in the semiconductor industry. It all began in the 1980s which coincidentally is when I started my career in Silicon Valley. General purpose integrated circuits ruled the market, forcing system designers to cobble together off-the-shelf… Read More


DAC 2016 – Register Now

DAC 2016 – Register Now
by Bernard Murphy on 05-16-2016 at 7:00 am

DAC is again going to be in Austin (reason enough to go), from June 6[SUP]th[/SUP]-8[SUP]th[/SUP] for the main event. A number of events caught my eye:

  • Monday AM – custom hardware for algorithmic trading. If you want to know more about FinTech (technology for finance) this could be for you
  • Another Monday morning session on Linux
Read More

The Emerging Importance of Parallel SPICE

The Emerging Importance of Parallel SPICE
by Tom Dillinger on 05-15-2016 at 7:00 am

SPICE simulation is the workhorse tool for custom circuit timing validation and electrical analysis. As the complexity of blocks and macros has increased in advanced process nodes — especially with post-layout extraction parasitic elements annotated to the circuit netlist — the model size and simulation throughput… Read More