The Premier Conference Devoted to Technical Innovations in Electronic Design Automation!
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When you propose attending ICCAD, focus on specifically what you will bring back to the organization to demonstrate return on the investment. Use this “benefits guide” to help you state your case.
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While India has done well in terms of chip design and electronics manufacturing, there have been challenges in setting up of Semiconductor Wafer Fabrication (FAB) units for a long time.
The digital age has propelled the world into consuming electronics at an unprecedented scale. Worldwide shipments of devices — PCs, tablets … Read More
In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More
At the ES Design West event in San Francisco last week Silvaco’s CTO and EVP of Products, Babak Taheri, gave a presentation titled, “Next Generation SoC Design: From Atoms to Systems”. The time slot for the talk was only 30-minutes which is simply not enough to discuss all the technology Silvaco is providing now. I had not looked closely… Read More
Recently, Daniel Nenni blogged on the presentation Wally Rhines gave at #56th DAC. Daniel provided a great summary, but I want to dive into a portion of the presentation in more detail. I love Wally’s presentations, but sometimes you cannot absorb the wealth of information he provides when you initially see it. It’s… Read More
In February this year, the Department of Defense (DoD) submitted a $686.1 billions budget for 2019 and published a National Defense Strategy outlining the overall spending for defense and military programs. The recently signed US $1.3 trillion spending bill included part of the funding. According to DoD Defense Budget Overview… Read More
Hardware-assisted verification has been with us (commercially) for around 20 years and at this point is clearly mainstream. But during this evolution it split into at least two forms (emulation and prototyping), robbing us of a simple choice – to hardware-assist or not to hardware-assist (that is the question). Which in turn … Read More
Experience gives us the ability to make better decisions and in a fast moving industry like semiconductors, experience is critical. As chips get more integrated and complex the number of design decisions that must be made increases at a dramatic rate. Process technologies for example, never in the history of semiconductors have… Read More
There are two interesting transformations that are currently taking place inside the semiconductor industry: First, systems companies (not chip companies) are now driving the semiconductor industry. Second, IoT focused chips are accelerating design starts. The result is what I would call the Custom SoCs for IoT Revolution!… Read More
Regular Semiwiki readers are aware of the rapid emergence of various (multi-die) advanced package technologies, such as: FOWLP (e.g., Amkor’s SWIFT, TSMC’s InFO); 2D die placement on a rigid substrate (e.g., TSMC’s CoWoS); and, 2.5D “stacked die” with vertical vias (e.g., any of the High Bandwidth Memory,… Read More