Yes, it means complete hardware and software integration, debugging, verification, optimization of performance and power and all other operational aspects of an electronic system in semiconductor design. In modern SoCs, several IPs, RTL blocks, software modules, firmware and so on sit together on a single chip, hence making… Read More
I am talking about the health of electronic and semiconductor design, which if made sound at RTL stage, can set it right for the rest of the design cycle for faster closure and also at lesser cost. Last week was the week of ITC(International Test Conference) for the Semiconductor and EDA community. I was looking forward to what ITC… Read More
Last week I heard about the Indian Cabinet approving the proposal for setting up of two Fabs in India. One led by IBM, Tower Jazzand JP Associates(an Indian business house), and the other led by HSMC(Hindustan Semiconductor Manufacturing Co.), ST Microelectronicsand Silterra. Indian Semiconductor community including IESA… Read More
Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More
Increasingly, end users in some markets are requiring soft error rate (SER) data. This is a measure of how resistant the design (library, chip, system) is to single event effects (SEE). These manifest themselves as SEU (upset), SET (transient), SEL (latch-up), SEFI (functional interrupt).
There are two main sources that cause… Read More
Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More
Layout editing is a complex task, traditionally done manually by designers, and the layout design productivity largely depends on the designer’s skills and expertise. However, a good tool with features for ease of design is a must. Layout productivity has been an area of focus and various features are constantly being added in… Read More
You can only design and optimize for low-power SoC designs if you can actually simulate the entire Chip, Package and System together. The engineers at ANSYS-Apachehave figured out how to do that and talked about their design for power methodology in a webinar today. I listened to Arvind Shanmugavel present a few dozen slides and… Read More
IP is the center of the semiconductor universe and nobody knows this better than Design and Reuse. The D&R website was launched in 1997 targeting the emerging commercial semiconductor IP market. Today, with more than 15,000 IP/SOC product descriptions updated daily, D&R is the #1 IP site matching customer requirements… Read More
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
