5G Wireless, Network Acceleration, Data centers, Machine Learning, Compression, Encryption fueling the Growth
Building on its increasing momentum, Achronix Semiconductor Corporation held a ribbon-cutting ceremony on Tuesday, April 25, with the presence of Santa Clara’s Mayor Lisa Gillmor, customers, and partners, employees… Read More
Tag: hpc
IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow
Until recently, ICs at bleeding edge nodes like 7nm technology from foundries like TSMC were mostly targeted for high-performance-computing (HPC) and mobile applications or possibly high radix switches that needed the increased performance of advanced nodes. The momentum of Moore’s law and Moore-than-Moore saw foundries… Read More
Aldec and High-Performance Computing
Aldec continues to claim a bigger seat at the table, most recently in their attendance at SC17, the supercomputing conference hosted last month in Denver. I’m really not sure how to categorize Aldec now. EDA company seems to miss the mark by a wide margin. Prototyping company? Perhaps, though they have a much stronger focus on end-applications… Read More
A Self-Contained Software-Driven Prototype
You’re building an IP, subsystem or SoC and you want to use a prototype together with a software testbench to drive extensive validation testing. I’m not talking here about the software running on the IP/SoC processor(s); the testbench should wrap around the whole DUT. This is a very common requirement. The standard approach to… Read More
TSMC Design Platforms Driving Next-Gen Applications
Coming up is the 23rd annual TSMC Technology Symposium where you can get first-hand updates on advanced and specialty technologies, advanced backend capabilities, future development plans, and network with hundreds of TSMC’s customers and partners. This year the Silicon Valley event kicks off at the Santa Clara Convention… Read More
CEO Interview: Marie Semeria of LETI
Laboratoire d’électronique des technologies de l’information (LETI) is a French research center, affiliate to the CEA (Commisariat a l’Energie Atomique). Since LETI creation in 1967, this affiliation has two consequences, the money was flowing from the deep pocket of the atomic industry to sustain advanced … Read More
ARM gets wider and more flexible in vectors
ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More
RISC-V opens for business with SiFive Freedom
When we talk about open source, free usually comes in the context of “freedom”, not as in “free beer”, and open IP often serves as a base layer of value add for commercialization. The creators of the RISC-V instruction set, now working at startup SiFive, have released specifications for their aptly-named Freedom processor IP cores… Read More
2.5D supply chain takes HBM over the wall
SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More
TSMC OIP: What to Do With 20,000 Wafers Per Day
Today it is TSMC’s OIP Ecosystem Innovation forum. This is an annual event but is also a semi-annual update on TSMC’s processes, investment, volume ramps and more. TSMC have changed the rules for the conference this year: they have published all the presentations by their partners/customers. Tom Quan of TSMC told… Read More