Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem

Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
by Kalar Rajendiran on 08-27-2024 at 10:00 am

9.2Gbps HBM3E Subsystem

In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’sRead More


Webinar: Total Cost of Ownership of HPC and AI for Engineering

Webinar: Total Cost of Ownership of HPC and AI for Engineering
by Admin on 08-20-2024 at 9:27 pm

We will discuss the findings of a joint survey conducted by Hyperion Research, Intel, and Ansys on Total Cost of Ownership (TCO) models utilized for both on-premises and cloud-based HPC resources during this upcoming webinar.

TIME:
September 24, 2024
11:00 AM EDT

Venue:
Virtual

Overview

In this webinar, we will discuss the findings

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Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
by Kalar Rajendiran on 07-29-2024 at 6:00 am

Industry First, Multi Protocol IO Connectivity Chiplet

In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More


Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology

Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
by Kalar Rajendiran on 07-25-2024 at 10:00 am

High Speed PAM4 SerDes Use Scenarios

The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More


Advanced Packaging Conference (APC) 2024

Advanced Packaging Conference (APC) 2024
by Admin on 07-23-2024 at 8:30 pm

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance… Read More


Keysight EDA at the 2024 Design Automation Conference

Keysight EDA at the 2024 Design Automation Conference
by Daniel Payne on 06-17-2024 at 8:00 am

DAC 2024 Banner

DAC starts June 24th and I can already feel the buzz of excitement building up as I receive updates from EDA vendors like Keysight EDA. Talking with Scott Seiden, Director Strategic Marketing, Keysight EDA Portfolio, I learned that they have the largest booth on the first floor, now that’s a statement that caught my attention. This… Read More


Reduce Risk, Ensure Compliance: Hardware-Assisted Verification for Design Certification

Reduce Risk, Ensure Compliance: Hardware-Assisted Verification for Design Certification
by Lauro Rizzatti on 06-12-2024 at 10:00 am

Reduce risk ensure compliance Figure 1
Prologue

Peter was running late for two reasons. First, he encountered unexpected heavy traffic and arrived ten minutes late for a crucial meeting with a customer to run a compliance test of his new 6G phone design prototyped on FPGAs. This prototype’s success was pivotal, as it could secure a significant purchase order.Read More