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There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:
Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More
On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More
TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More
The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners,… Read More
Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More
TSMC, the world’s largest contract semiconductor manufacturer, is significantly expanding its deployment of NVIDIA artificial intelligence and accelerated computing technologies throughout its chip design and manufacturing operations. The initiative represents one of the most comprehensive applications of AI within… Read More
As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
As semiconductor manufacturing becomes increasingly dependent on uninterrupted power and energy efficiency, battery reliability has emerged as a critical operational issue for advanced fabs. Taiwan Semiconductor Manufacturing Company, better known as TSMC, is addressing this challenge through an ambitious global initiative… Read More
Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More