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SPICE circuit simulation is used for transistor-level analysis while Place and Route tools are typically used to connect cells and blocks of an SoC, so why would there be a connection between these two EDA tools?
I read a press release today from ATopTech and Berkeley Design Automation that talked about how SPICE and P&R are … Read More
See how Synopsys’ advanced analog verification solution can dramatically increase your verification productivity with CustomExplorer Ultra, along with CustomSim and CustomSim-VCS. CustomExplorer Ultra is a comprehensive simulation and debug environment for analog and mixed-signal design verification.
Web … Read More
First, I must say that I’m biased. I like Cheerleaders, they are lots of fun, I even married one. Second, I’m not a fan of Peggy Aycinena. She has been on her EDA feminist rant for years now and I have been targeted multiple times. My solution has been to ignore her and any publication that supports her but this time she has gone too far.… Read More
If you are involved in testing memory or logic of ARM-based designs, you’ll want to attend this free seminar on July 17, 2012 in Santa Clara. Mentor Graphics and ARM have a long standing partnership, and have optimized the Mentor test products (a.k.a Tessent) for the ARM processors and memory IP.
The lunch seminar runs from 10:30-1:00… Read More
Novocell Semiconductor, core antifuse-based OTP Smartbit™ technology was first patented in 2001 and 2002, and created a solid foundation for the first ten years,” stated Walt Novosel, President and CTO, “Since then, our customer-driven focus has led to numerous innovations in our original high reliability Smartbit-based… Read More
A Bloomberg article from early July caught my eye as it portends further changes in the competitive mobile market landscape. Intel is now in the business of paying Taiwanese panel suppliers to ensure the supply of touch-screen panels for PC ultrabooks. In essence it says that to win in the PC market, Intel has to mimic Apple and go … Read More
Thanks to SemiWiki readers for the feedback and comments on the previous “Introduction to FinFET Technology” posts – very much appreciated! The next installment on FinFET modeling will be uploaded soon.
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One of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is difficult, if… Read More
Remember the processor-memory gap— a situation where the processor is forced to stall while waiting for a memory operation to complete? This was largely a result of the high latency required for off chip memory accesses. Haven’t we solved that problem now with SoCs? SoCs are typically architected with their processors … Read More
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
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Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era