The RISC-V and Open-Source Functional Verification ChallengeMost of the RISC-V action at the end…Read More
Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers2.5D package design is rapidly finding its stride…Read More
Addressing Reliability and Safety of Power Modules for Electric VehiclesAs electric vehicles (EVs) gain widespread adoption, safety,…Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024Anyone who has read my articles about IEDM…Read More
SI and PI Update from Cadence on Sigrity XSignal Integrity (SI) and Power Integrity (PI) issues…Read More
In my rush on Wednesday at DAC I had almost over-looked the last two companies I talked with: Invarian and AnaGlobe. These last two I had hand-written notes on paper, so I just got to the bottom of my inbox tonight to write up the final trip reports.
Invarian
Jens Andersen and Vladimir Schellbach gave me an overview of tools that perform… Read More
We all knew that Apache had filed for an IPO earlier and were just waiting for the timing and price to be revealed. Rumors have been circulating about an acquisition and today we know that the rumors were true asAnsys paid $310 million in cash for Apache.
Ansys stock has surged some 35% over the past twelve months:
Products
This acquisition… Read More
The recent announcement from Cadence, officially launching the PCI Express 3.0 Controller IP, as well as the associated Verification IP (VIP), made of Compliance Management System (CMS) which provides interactive, graphical analysis of coverage results, and PureSuite which provides the PCIe associated test cases, clearly… Read More
There are some very interesting comments to the last entry on SoC Realization and how more and more chips are actually assembled out of IP. There was clearly a lot of discussion in this area at DAC, although most people (Atrenta being an exception) don’t use the term SoC Realization, presumably because it was originated by … Read More
Introduction
Before DAC I met with Stephen Pateras, Ph.D. at Mentor Graphics, he is the Product Marketing Director in the Silicon Test Solutions group. Stephen has been at Mentor for two years and was part of the LogicVision acquisition. He was in early at LogicVision and went through their IPO, before that he was at IBM in the mainframe… Read More
While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor… Read More
During the early 2000’s, when OEM starting to question the use of LVDS to interface with display devices, two standards has emerged: High-Definition Multimedia Interface (HDMI) and DisplayPort. HDMI has been developed by silicon Image, surfing on the success of Digital Video Interface (DVI), and was strongly supported… Read More
The latest edition of GSA Forum has an article by Aveek Sarkar of Apache on system design for emerging market needs. The BRIC (Brazil, Russia, India, China) type countries are characterized by a small rich segment, a large and growing middle class and a large poor segment. One big trend is that smart phone use is expanding very fast.… Read More
Probably everyone knows that openAccess is a layout database. It was originally developed at Cadence (called Genesis) but has since been transferred to Si2. Strictly speaking, openAccess is actually an API and the database is a reference implementation. The code is licensed under a sort of halfway to open-source: you can use … Read More
With the adoption of the 32/28 nm process node, some significant new challenges in digital routing arise—including complex design rule checking (DRC) and design for manufacturing (DFM) rules, increasing rule counts, very large (1 billion transistor) designs. To meet quality, time-to-market, and cost targets, design teams… Read More
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