The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI BoomMost crypto forty-niners died broke in a warehouse…Read More
From Detection to Safety: Reframing Fault Simulation for Functional SafetyIn the early 1980s, when computer-aided engineering (CAE),…Read More
Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative MattersThe future of work will not be shaped…Read More
Foundation IP for Intel 18A: Technical Overview and Why It MattersSynopsys Foundation IP for Intel 18A is a…Read More
WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA toolsThe real promise of AI in EDA is…Read More
We’ve packed each day full of exciting activities focused on the latest in cutting-edge design. Use this site to find your favorite Mentor experts and events—whether in our suites and networking events, at our partner booths or in the conference. You won’t want to miss a thing!
Celebrating Your Design Creativity!
Rejuvenate with… Read More
This is one of the most aggressive DAC appearances I have seen from Dassault, absolutely. Dassault Systèmes is branded as the: 3D EXPERIENCE Company that provides virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault … Read More
Listening to a webinar at your desk, in front of a PC screen will never replace a live presentation, but the lesson learned to time spent ratio can be incredibly higher than when traveling to a conference to listen several presentation. If you are interested by the approach taken by a complex DSP design team to overcome the various … Read More
Baseball loves a good switch hitter – from Frisch to Mantle to Rose to Murray to Jones, they are a rare and valuable commodity. AMD is calling on ambidexterity for its processors in 2015 and beyond, this week tipping plans for 20nm “Project SkyBridge” parts in either ARM or X86 with a common footprint. What remains to be seen is where… Read More
The CEVA-TeakLite-4 is the DSP IP issued from the TeakLite family, started about 15 years ago with the 16-bit, single MAC TeakLite. Now the TeakLite-4 is a 32-bit, quad MAC IP core, supporting 2G/3G/4G Wireless BaseBand or PowerLine Communication. But even the latest BaseBand computational requirement doesn’t saturate this… Read More
The Linley Mobile Conference last week initiated a lot of discussion about emerging technologies and markets, especially wearables. Jessica Lipsky’s EE Times article captured some of the sentiments in her article, “Wearables Need Tailored SoCs.” But the conference covered a lot more ground than wearables, including mobile… Read More
IDM companies like Micronuse SPICE circuit simulators during the design phase in order to predict timing, currents and power on their custom IC chip designs at the transistor level. A senior memory design engineer at Micron named Raed Sabbahtalked today at a webinarabout how the embedded solutions group uses the FineSimcircuit… Read More
Last week, I had the pleasure to present at the Linley Group Mobile Conference. My presentation was part of the Wearable Device Session, which examined wearables from several different angles including software, sensor, processor, and IP.
As the smartphone market is maturing and the pace of innovation generally slowing, there… Read More
In the fabless world of semiconductor design, IP components have become indispensable partners and have enabled the development of complex billion gate SoCs. IP business in general is exhibiting a very high growth rate since couple of years and it is going to increase; the same is being reflected by a growing number of IP vendors… Read More
When I was reading the recent Daniel Payne article “Designing Change Into Semiconductor Techonomics” with commentary on a recent presentation from Aart de Geus of Synopsys, one chart jumped out at me: the most popular process node for new design starts today is 180nm.
Upon mentioning that to a few of my IoT counterparts, they quickly… Read More
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The Packaging PDK Is the Missing Layer for Co-Packaged Optics