On July 18, 2025, Serge Nicoleau from STMicroelectronics delivered a compelling presentation at DACtv, as seen in the YouTube video exploring how artificial intelligence (AI) is revolutionizing semiconductor design, edge computing, and sustainability. Addressing a diverse audience, Serge highlighted AI’s pervasive … Read More




Google Cloud: Optimizing EDA for the Semiconductor Future
On July 9, 2025, a DACtv session featured a Google product manager discussing the strategic importance of electronic design automation (EDA) and how Google Cloud is optimizing it for the semiconductor industry, as presented in the YouTube video. The talk highlighted Google Cloud’s role in addressing the escalating complexity… Read More
Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use
On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More
Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA
On July 9, 2025, Michael Munsey, VP of Semiconductor Industry at Siemens, and Vishal Moondhra, VP of Solutions at Perforce, presented a DACtv session announcing their strategic partnership, as seen in the YouTube video. This collaboration integrates Siemens’ digital twin and digital thread technologies with Perforce’s version… Read More
AI-Enhanced Chip Design: Pioneering the Future at DAC 2025
On July 9, 2025, a DACtv session illuminated the transformative role of artificial intelligence (AI) in chip design, as presented by Ankur Gupta of Siemens EDA in the YouTube video. The speaker explored how AI is revolutionizing electronic design automation (EDA), addressing the semiconductor industry’s challenges in managing… Read More
IBM Cloud: Enabling World-Class EDA Workflows
On July 9, 2025, Derren Dunn from IBM Research’s TJ Watson Research Center delivered a DACtv presentation, as seen in the YouTube video detailing IBM’s EDA-as-a-Solution platform. This innovative offering leverages IBM’s high-performance computing (HPC) cloud to deliver hybrid and cloud-only infrastructure for electronic… Read More
AI-Driven Chip Design: Navigating the Future
On July 9, 2025, a DACtv session by Dr. Peter Levin explored the transformative impact of artificial intelligence (AI) on chip design, as presented in the YouTube video. The speaker, an industry expert, delved into how AI is reshaping electronic design automation (EDA), addressing the escalating complexity of modern chips and… Read More
AI Infrastructure: Silicon Innovation in the New Gold Rush
On July 18, 2025, Jeff Wittich, Chief Product Officer at Ampure Computing, delivered a compelling DACtv presentation, as seen in the YouTube video, likening the current AI boom to the 1848 California Gold Rush. Speaking in San Francisco, just 100 miles from Sutter’s Mill, Wittich drew parallels between the historical rush that… Read More
Large Language Models: A New Frontier for SoC Security on DACtv
On July 18, 2025, Mark Teranipur, chairman of the Electrical and Computer Engineering Department at the University of Florida and co-founder of Caspia Technologies, delivered a compelling talk at DACtv on leveraging large language models (LLMs) for System-on-Chip (SoC) security, as seen in the YouTube video. Addressing the… Read More
Chip Agent: Revolutionizing Chip Design with Agentic AI
On July 18, 2025, ChipAgents AI, a Santa Barbara-based startup, showcased its innovative agentic AI platform for chip design and verification at a DACtv session. Led by CEO William Wong, a former CMU PhD and UC Santa Barbara professor, Chip Agent is redefining electronic design automation (EDA) by leveraging advanced AI agents… Read More
Should the US Government Invest in Intel?