I would guess that most people have seen or at least heard of the Matrix movies but how many people can remember who vanquished the earth to begin the series? It was artificial intelligence (AI) of course which seemed pretty far fetched 20 years ago, but today not so much. In fact, for those of us in the AI know it seems quite likely in some… Read More
Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology SymposiumAnalog Bits has a way of stealing the…Read More
Disaggregating LLM Inference: Inside the SambaNova Intel Heterogeneous Compute BlueprintSambaNova Systems and Intel have introduced a blueprint…Read More
CEO Interview with Johan Wadenholt Vrethem of VoxoWith over two decades of experience bridging technology…Read More
TSMC to Elon Musk: There are no Shortcuts in Building Fabs!The opening of the TSMC 2026 earning call…Read More
Speculation: Silicon’s Most Expensive CompulsionHow Time-Based Scheduling Reclaims Silicon Wasted by Speculative…Read MoreThe Tech Week that was December 16-20 2019
As we approach the end of 2019 I wish everybody a Merry Christmas and a Happy New Year. This will be my last update for a few weeks as I will also take a little break over the holiday season.
Despite a lot of people winding down for the year, there was still lots of interesting news from last week with lots of data points pointing to an even
Debugging Hardware Designs Using Software Capabilities
Every few months, I touch base with Cristian Amitroaie, CEO of AMIQ EDA, to learn more about how AMIQ is helping hardware design and verification engineers be more productive. Quite often, his answers surprise me. When he started describing their Design and Verification Tools (DVT) Eclipse Integrated Development Environment… Read More
Network on Chip Brings Big Benefits to FPGAs
The conventional thinking about programmable solutions such as FPGAs is that you have to be willing to make a lot of trade-offs for their flexibility. This has certainly been the case in many instances. Even just getting data across the chip can eat up valuable routing resources and add a lot of overhead. These problems are exacerbated… Read More
Full Solution for eMRAM Coming in 2020
It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More
Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology. A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer; the interposer… Read More
A VIP to Accelerate Verification for Hyperscalar Caching
Non-volatile memory (NVM) is finding new roles in datacenters, not currently so much in “cold storage” as a replacement for hard disk drives, but definitely in “warm storage”. Warm storage applications target an increasing number of functions requiring access to databases with much lower latency than is possible through paths… Read More
Cadence Continues Photonics Industry Engagement
On November 13, Cadence held its annual Photonics Summit. Cadence has been hosting this event for several years with the intention of advancing the photonics industry. With this event, Cadence has been a catalyst in furthering photonic product development. It’s quite remarkable that Cadence hosts such an event in a field where… Read More
IP to SoC Flow Critical for ISO 26262
In thinking about automotive electronics safety standards, such as ISO 26262, it is easy to jump to the conclusion that they are in reference to systems such as autonomous driving, which are entering the marketplace. In reality, functional safety in automotive electronics plays a significant role in many well-established automotive… Read More
IEDM 2019 – TSMC 5nm Process
IEDM is in my opinion the premiere conference for information on state-of-the-art semiconductor processes. In “My Top Three Reasons to Attend IEDM 2019” article I singled out the TSMC 5nm paper as a key reason to attend.
IEDM is one of the best organized conferences I attend and as soon as you pick up your badge you are handed a memory… Read More


Is Intel About to Take Flight?