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Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”
To recap, VersionVault delivers a lot of … Read More
It’s no secret that innovation in AI chip architectures is on a tear. When you put together the spatial complexity of highly parallelized algorithms with the need to localize memory accesses on-chip to the greatest extent possible, we’re seeing a proliferation of all kinds of domain-specific architectures. Which in the normal… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The talk covered here focuses on a complete on-die clock … Read More
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the last of three that attempts to summarize the highlights of the presentations. This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.
Key Takeaways… Read More
There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More
In 2016 SemiWiki published a book “Prototypical: The Emergence of FPGA-Based Prototyping for SoC Design”. Today we are writing Prototypical II since a LOT of prototyping innovation has happened in the last four years, absolutely.
For example:
Quad 10M Prodigy™ Logic System extends the capacity leadership to simplify… Read More
When we think of wireless it is natural to wonder “which one – cellular, Wi-Fi, BLE?” Our phones support everything but those are pricey devices. What if we wanted the same combo wireless option in a low-cost IoT device, maybe something that only need to send a small amount of data periodically? Logistics applications are a good example.… Read More
TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the second of three that attempts to summarize the highlights of the presentations. This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.
Key… Read More
Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More
Enhancing Multi-Domain System Simulation with FMI Co-Simulation