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Using ML Acceleration Hardware for Improved DSP Performance

Using ML Acceleration Hardware for Improved DSP Performance
by Tom Simon on 04-24-2020 at 6:00 am

nnMAX Flex Logix Tile

Some amazing hardware is being designed to accelerate AI/ML, most of which features large numbers of MAC units. Given that MAC units are like the lego blocks of digital math, they are also useful for a number of other applications. System designers are waking up to the idea of repurposing AI accelerators for DSP functions such as … Read More


Tracing Technology’s Evolution with Patents

Tracing Technology’s Evolution with Patents
by Arabinda Das on 04-23-2020 at 10:00 am

Figure 1

We live in an age of abundant information. There is a tremendous exchange of ideas crisscrossing the world enabling new innovative type of products to pop up daily. Therefore, in this era there is a greater need to understand competitive intelligence. Corporate companies today are interested in what other competitors are brewing… Read More


Wi-Fi Bulks Up

Wi-Fi Bulks Up
by Bernard Murphy on 04-23-2020 at 6:00 am

Wi Fi

Wireless discussion these days seems to be dominated by 5G, but that’s not the only standard that’s attracting attention. The FCC just circulated draft rules to dramatically expand bandwidth available to Wi-Fi in the new Wi-Fi 6e standard.

Is this a tragic plea for attention from a once-important standard, now eclipsed by its … Read More


ASML A Scenario More Lumpy While Demand and Tech Remain Solid Despite Covid Delays

ASML A Scenario More Lumpy While Demand and Tech Remain Solid Despite Covid Delays
by Robert Maire on 04-22-2020 at 2:00 pm

ASML SemiWiki 2020

Covid issues create “lumpy” quarters due to delays
Orders & demand remain solid and strong
2020 Year financials intact so far but ignore Qtrs
Taking prudent actions- no buybacks or guidance

As expected, Covid impacts both shipments & supply chain, ignore the near term lumpiness…
ASML reported revenues… Read More


Accelerating Edge Inference with Flex Logix’s InferX X1

Accelerating Edge Inference with Flex Logix’s InferX X1
by Mike Gianfagna on 04-22-2020 at 10:00 am

Screen Shot 2020 04 11 at 6.29.49 PM

For a long time, memories were the primary technology driver for process development. If you built memories, you got access to cutting-edge process information. If you built other products, this could give you a competitive edge. In many cases, FPGAs are replacing memories as the driver for advanced processes. The technology… Read More


How does TensorFlow Lite on Tensilica HiFi DSP IP Sound?

How does TensorFlow Lite on Tensilica HiFi DSP IP Sound?
by Tom Simon on 04-22-2020 at 6:00 am

TensorFlow Lite Needed for Audio

In all the hubbub about AI/ML, it’s easy to see why visual ML gets more attention. It’s got appeal because of applications such as autonomous driving. Because of this it’s easy to overlook the importance of audio ML. I own a Tesla and putting it into autopilot is very cool, but even it has voice recognition built in as an important feature… Read More


The Quiet Giant in Verification IP and More

The Quiet Giant in Verification IP and More
by Mike Gianfagna on 04-21-2020 at 10:00 am

SmartDV Market Coverage

In the technology industry, we’re all used to the hype about the latest and greatest. Semiconductor IP participates in the over-drive news cycle from time to time as well. So, when I see a company that has real, solid credentials but has resisted the temptation to over-hype, it gets my attention. I had an experience like this recently… Read More


That Last Level Cache is Pretty Important

That Last Level Cache is Pretty Important
by Bernard Murphy on 04-21-2020 at 6:00 am

CodaCache in System

Last-level cache seemed to me like one of those, yeah I get it, but sort of obscure technical corners that only uber-geek cache specialists would care about. Then I stumbled on an AnandTech review on the iPhone 11 Pro and Max and started to understand that this contributes to more than just engineering satisfaction.

Caching

A brief… Read More


SPIE 2020 – ASML EUV and Inspection Update

SPIE 2020 – ASML EUV and Inspection Update
by Scotten Jones on 04-20-2020 at 10:00 am

0.33 NA EUV systems for HVM Ron Schuurhuis Page 02

I couldn’t attend the SPIE Advanced Lithography Conference this year for personal reasons, but last week Mike Lercel of ASML was nice enough to walk me through the major ASML presentations from the conference.

Introduction
In late 2018, Samsung and TSMC introduced 7nm foundry logic processes with 5 to 7 EUV layers, throughout … Read More


Design IP Revenue Grew 5.2% in 2019, Good News in Declining Semi Market

Design IP Revenue Grew 5.2% in 2019, Good News in Declining Semi Market
by Eric Esteve on 04-20-2020 at 6:00 am

IP Category 2018 2019

Good news is good to hear, particularly these days! The behavior of the Design IP market in 2019 is extremely positive, when the semiconductor market has seen a decline worst than in 2009 (economy crisis) or 2001 (internet bubble collapse). Analysis this 5.2% growth in detail will help to understand the future of the IP market, as… Read More