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Semiconductor Expert Forum

Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang

Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang
by Daniel Nenni on 06-26-2026 at 10:00 am
Categories: ChipAgents AI, EDA

Daniel is joined by William Wang the CEO and Founder of ChipAgents.ai, the category-leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded… Read More

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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
by Daniel Nenni on 06-26-2026 at 6:00 am
Categories: Foundries, Intel Foundry

Inel 18A vs Intel 18A P

Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More

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WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads

WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads
by Daniel Nenni on 06-25-2026 at 2:00 pm
Categories: NetApp, Semiconductor Services

Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads

In this webinar, Google Cloud and NetApp explore how semiconductor companies can address the growing infrastructure demands of modern Electronic Design Automation (EDA) workflows. As process technologies continue to advance and chip designs become increasingly complex, engineering teams require scalable, high-performance… Read More

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How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
by Mike Gianfagna on 06-25-2026 at 10:00 am
Categories: AI, EDA, Events, llmda.ai

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.

llmda.ai… Read More

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COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era

COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
by Daniel Nenni on 06-25-2026 at 6:00 am
Categories: AI, Andes Technology, Prototyping, RISC-V, S2C EDA

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COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More

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The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story

The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story
by Jonah McLeod on 06-24-2026 at 2:00 pm
Categories: AI

Open AI Illustration

Every family has that one wedding where, halfway through the toasts, someone leans over and whispers “wait, who’s paying for all this?” This is that wedding. OpenAI and Broadcom are the happy couple. Apollo Global Management walked the bride down the aisle. Nvidia may have just stood up to offer a toast, a very… Read More

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The Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor

The Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor
by Moh Kolb on 06-24-2026 at 10:00 am
Categories: Photonics

Picture BORB EORC June19

Co-packaged optics, silicon photonics, optical I/O, and photonic engines are becoming central topics in the future of AI infrastructure.

The common story is simple:

Copper is reaching limits.
Light can move data farther and more efficiently.
Therefore, AI systems will move from electrical interconnects toward optical interconnects.… Read More

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All-Embracing Multiphysics Analysis for Chiplet-Based Systems

All-Embracing Multiphysics Analysis for Chiplet-Based Systems
by Bernard Murphy on 06-24-2026 at 6:00 am
Categories: 3D IC, 5G, AI, Chiplet, EDA, Synopsys

Revised multiphysics graphic

What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More

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Semidynamics Brings Its Full Inference Stack to ISC HPC 2026 — And Why It Matters

Semidynamics Brings Its Full Inference Stack to ISC HPC 2026 — And Why It Matters
by Daniel Nenni on 06-23-2026 at 2:00 pm
Categories: IP, Semidynamics

Semidynamics Brings Its Full Inference Stack to ISC HPC 2026

AI inference is quickly becoming the real battleground for next-generation computing. Training still gets the headlines, but inference is where AI becomes a business, a service, and an infrastructure problem. Every chatbot response, agentic workflow, code assistant, scientific model, and enterprise copilot depends on … Read More

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Chips&Media Signs Next-Gen ‘AV2’ Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership

Chips&Media Signs Next-Gen ‘AV2’ Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership
by Daniel Nenni on 06-23-2026 at 10:00 am
Categories: Chips&Media, IP

image (12)

Chips&Media, a leading provider of video intellectual property (IP) solutions, has announced a strategic licensing agreement with a major North American technology company for its next-generation AV2 video codec IP. The agreement marks a significant milestone for the company as demand accelerates for advanced video… Read More