Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working… Read More
Nvidia Overcoming the Challenges of Blending Hardware Verification Expertise with AI and ML Verification Futures Conference 2025…Read More
Automotive Digital Twins Out of The Box and Real Time with PAVE360Digital twins are amazing technology, virtual representations mirroring…Read More
CEO Interview with Rabin Sugumar of AkeanaRabin Sugumar was Distinguished Engineer and Chief Architect…Read MoreGetting to Faster Closure through AI/ML, DVCon Keynote
Manish Pandey, VP R&D and Fellow at Synopsys, gave the keynote this year. His thesis is that given the relentless growth of system complexity, now amplified by multi-chiplet systems, we must move the verification efficiency needle significantly. In this world we need more than incremental advances in performance. We need… Read More
5G Requires Rethinking Deployment Strategies
5G’s Departure from Its Predecessors
In each move from 1G to 4G people became accustomed to seeing the new generation as primarily offering increased bandwidth and efficiency. It would be a mistake to view the transition to 5G along these same lines. 5G takes Radio Area Networks (RANs) from a use model primarily for cell phone communications… Read More
Semiconductor Packaging History and Primer
From DIP to Advanced, semiconductor packaging has become strategic
For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek
How Intel will Beat Samsung
Now that Intel is back in the foundry business, and with the Tower Semiconductor acquisition they are definitely back in the foundry business, Samsung will be the biggest foundry loser here.
You can break the IDM foundry business into two parts: First, and foremost, the NOT TSMC Business. Second is the the Better PPA (Power/Performance,… Read More
Webinar: Beyond the Basics of IP-based Digital Design Management
According to the ESD Alliance, the single biggest revenue category in our industry is for semiconductor IP, so the concept of IP reuse is firmly established as a way to get complex products to market more quickly and reducing risk. On the flip side, with hundreds or even thousands of IP blocks in a complex SoC, how does a team, division… Read More
Prototype enables new synergy – how Artosyn helps their customers succeed
Artosyn Microelectronics, a leading provider of AI SoCs for drones and other sophisticated applications finds itself at the intersection of hardware architecture and software development. “Our customers are advancing the state of AI programming every day,” said Shen Sha, Senior R&D Manager of Artosyn’s AI Chip Department.… Read More
Analog IC Layout Automation Benefits
I viewed a recent webinar from Paul Clewes of Pulsic, and the topic was Balancing Analog Layout Parasitics in MOSFET Differential Pairs. This topic interests me, because back in 1982 I wrote my first IC layout automation tool at Intel that automatically created 15% of a GPU chip layout called the 82786, then joined Silicon Compilers… Read More
Non Volatile Memory IP is Invaluable for PMICs
Power Management ICs are a vitally important part of system design. Evidence of this is cited by a Synopsys white paper that mentions how Apple acquired a portion of PMIC developer Dialog Semiconductor that was previously their exclusive PMIC supplier. Clearly Apple had decided that PMIC design was a strategic differentiating… Read More
Semiconductor Capital Equipment Series: Introduction
Semicap is in some ways the unsung hero of American global dominance in semiconductors. The US punches above its weight in terms of market share compared to demand, but specifically in three categories. EDA, IP, and Equipment.
I hope to write about everything there can be said about semiconductors, and EDA is a place I understand… Read More




AI Bubble?