Events EDA2025 esig 2024 800X100

Why Glass Substrates?

Why Glass Substrates?
by Sharada Yeluri on 08-13-2024 at 6:00 am

Intel Glass Substrates

The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More


PieceMakers HBLL RAM: The Future of AI DRAM

PieceMakers HBLL RAM: The Future of AI DRAM
by Joe Ting on 08-12-2024 at 6:00 am

PieceMaker Memory

PieceMakers, a fabless DRAM product company, is making waves in the AI industry with the introduction of a new DRAM family that promises to outperform traditional High Bandwidth Memory (HBM). The launch event featured industry experts, including a representative from Samsung, highlighting the significance of this innovation.… Read More


A Post-AI-ROI-Panic Overview of the Data Center Processing Market

A Post-AI-ROI-Panic Overview of the Data Center Processing Market
by Claus Aasholm on 08-11-2024 at 8:00 am

Datacenter Supply Chain 2024

With all the Q2-24 results delivered, it is time to remove the clouds of euphoria and panic, ignore the performance claims and the bugs, and analyse the Data Center business, including examining the supply chain up and downstream. It is time to find out if the AI boom in semiconductors is still alive.

We begin the analysis with the … Read More


Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han

Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han
by Daniel Nenni on 08-09-2024 at 10:00 am

Dan is joined by Dr. Mark Han, Vice President of R&D Engineering for Circuit Simulation at Synopsys. Mark leads a team of over 300 engineers in developing cutting-edge advanced circuit simulation and transistor-level sign-off products, including characterization and static timing analysis. With 27 years of industry … Read More


CEO Interview: Yogish Kode of Glide Systems

CEO Interview: Yogish Kode of Glide Systems
by Daniel Nenni on 08-09-2024 at 6:00 am

Yogish Kode

Yogish Kode is a senior solutions architect with substantial experience in product lifecycle management for over 20 years. His focus has been on semiconductor PLM and IP management. Prior to founding Glide Systems, he was a global solutions architect at Dassault Systèmes, an IT lead at Xilinx, and a senior programmer/analyst… Read More


Design Automation Conference #61 Results

Design Automation Conference #61 Results
by Daniel Nenni on 08-08-2024 at 10:00 am

IMG 3273

This was my 40th Design Automation Conference and based on my follow-up conversations inside the semiconductor ecosystem it did not disappoint. The gauge I use for exhibitors is “qualified customer engagements” that may result in the sale of their products. This DAC was the best for that metric since the pandemic, absolutely.… Read More


Application-Specific Lithography: Patterning 5nm 5.5-Track Metal by DUV

Application-Specific Lithography: Patterning 5nm 5.5-Track Metal by DUV
by Fred Chen on 08-08-2024 at 6:00 am

Application Specific Lithography I

At IEDM 2019, TSMC revealed two versions of 5nm standard cell layouts: a 5.5-track DUV-patterned version and a 6-track EUV-patterned version [1]. Although the metal pitches were not explicitly stated, later analyses of a 5nm product, namely, Apple’s A15 Bionic chip, revealed a cell height of 210 nm [2]. For the 6-track … Read More


Podcast EP239: The Future of Verification for Advanced Systems with Dave Kelf

Podcast EP239: The Future of Verification for Advanced Systems with Dave Kelf
by Daniel Nenni on 08-07-2024 at 8:00 am

Dan is joined by Dave Kelf, CEO of Breker Verification Systems, whose product portfolio solves challenges across the functional verification process for large, complex semiconductors. Dave has deep experience with semiconductor design and verification with management and executive level positions at Cadence, Synopsys,… Read More


The Future of Logic Equivalence Checking

The Future of Logic Equivalence Checking
by Bernard Murphy on 08-07-2024 at 6:00 am

LEC concept

Logic equivalence checking (LEC) is an automated process to verify that modified versions of a design evolving through implementation remain logically equivalent to the functionally signed-off RTL. This becomes important when accounting for retiming optimizations and for necessary implementation-stage ECOs which must… Read More


Aniah and Electrical Rule Checking (ERC) #61DAC

Aniah and Electrical Rule Checking (ERC) #61DAC
by Daniel Payne on 08-06-2024 at 10:00 am

Aniah #61DAC min

Visiting a new EDA vendor at #61DAC is always a treat, because much innovation comes from the start-up companies, instead of the established big four EDA companies. I met with Vincent Bligny, Founder and CEO of Aniah on Wednesday in their booth, to hear about what they are doing differently in EDA. Mr. Bligny has a background working… Read More